JPH0623008Y2 - Pin terminal LED - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a so-called pin terminal LED.

[Conventional technology]

Conventionally, such a pin terminal LED is configured as shown in FIG. 2, for example. That is, in FIG. 2, a pin terminal LED 1 is a stud 2 made of a metal such as aluminum, copper, iron or the like having a substantially cylindrical shape, an LED chip 3 attached to substantially the center of the upper surface of the stud 2, and the stud 2.
A lead pin 4 which is respectively inserted into two bores 2a which vertically penetrate through the stud 2, an upper end of which is slightly projected from an upper surface of the stud 2, and a lower end of which is projected below the stud 2, L on top of stud 2
The lens 5 is made of a transparent resin and is attached so as to cover the ED chip 3. Each lead pin 4 is insulated from the stud 2 by insert-molding an insulating material 6 made of a resin such as polyester into the bore 2a of the stud 2 while being inserted into the bore 2a. Further, the upper end thereof is bonded to the upper surface of the LED chip 3 or the stud 2 by a gold wire 7 or the like.

[Problems to be solved by the invention]

Here, the molding of the lens 5 is performed by turning the stud 2 to which the LED chip 3 and the lead pin 4 are attached upside down and inserting the lens 5 into a resin mold (not shown) containing the melted molding resin. At this time, since it is difficult to accurately control the amount of the mold resin, the inner diameter of the resin mold of the lens 5 is selected to be slightly larger than the outer diameter of the stud 2 so that the lens 5 can be molded easily. In addition, excess mold resin is allowed to escape along the outer circumference of the stud 2.

For this reason, as indicated by reference numeral 5a in FIG. 2, the resin sticks out and adheres to the outer peripheral portion of the stud 2 of the pin terminal LED1, and the appearance of the pin terminal LED1 is spoiled. Further, since the excess resin escapes only along the outer periphery of the stud 2 when the lens 5 is molded, air bubbles tend to remain particularly near the upper surface of the stud 2 of the lens 5, especially in the central region thereof. There is a problem that the luminous efficiency of the pin terminal LED1 is reduced. Further, in the conventional pin terminal LED1, the heat generated from the LED chip 3 cannot be effectively dissipated to the outside via the stud 2.

In view of the above points, the present invention prevents excess resin from adhering to the outer periphery of the stud during molding of the lens, prevents bubbles from remaining in the lens, and efficiently generates heat from the LED chip via the stud. It is an object of the present invention to provide a pin terminal LED capable of radiating heat to the outside.

[Means and Actions for Solving Problems]

According to the present invention, the above object is to provide a substantially cylindrical metal stud, at least one LED chip mounted on the upper surface of the stud, and an insulating material in a plurality of bores vertically passing through the stud. And the upper end of the stud slightly projects from the upper surface of the stud.
A lead pin bonded to the upper surface of the ED chip or the stud, and a lens integrally formed on the upper surface of the stud so as to cover each LED chip,
Further, at least one through hole penetrating vertically through the stud is provided, and it is achieved by a pin terminal LED configured to allow a part of resin constituting the lens to enter into the through hole during molding of the lens. .

According to this invention, a part of the resin that constitutes the lens enters the through hole of the stud at the time of lens molding. Therefore, even if the amount of mold resin is not accurately measured at the time of lens molding, Since it can be adjusted as appropriate depending on the mold resin that enters, the manufacturing is facilitated, the cost is reduced, and it is not necessary to make the inner diameter of the resin mold for lens molding larger than the outer diameter of the stud for adjusting the amount of resin. Therefore, the mold resin adheres to the outer periphery of the stud and the pin terminal L
The ED's aesthetics will not be spoiled. Furthermore, since air bubbles do not remain near the upper surface of the stud,
The luminous efficiency of the pin terminal LED does not decrease, and the molding resin flows into the through holes opened on the upper surface of the stud when the lens is molded and hardens. Since it is integrated with the stud, the adhesion strength of the lens to the stud is also increased. Further, since the surface area of the stud 2 is increased, the effect of improving the heat dissipation effect of the stud is also obtained.

〔Example〕

The present invention will be described below based on the embodiments shown in the drawings.

FIG. 1 shows an embodiment of a pin terminal LED according to the present invention. The pin terminal LED 10 has a substantially cylindrical metal stud 11 made of aluminum, copper, iron or the like and a substantially central portion of the upper surface of the stud 11. Mounted on the LED chip 12 and two bores 11a vertically penetrating through the stud 11, the upper end of which is slightly projected from the upper surface of the stud 11, and the lower end thereof is the stud. It is composed of a lead pin 13 projecting downward from 11 and a lens 14 formed of a transparent resin and attached to the upper surface of the stud 11 so as to cover the LED chip 12.

Each lead pin 13 is insulated from the stud 11 by insert-molding an insulating material 15 made of a resin such as polyester into the bore 11a of the stud 11 while being inserted into the bore 11a. Further, the upper end thereof is bonded to the upper surface of the LED chip 12 or the stud 11 by a gold wire 16, respectively.

The above configuration is similar to that of the conventional pin terminal LED.

In the embodiment of the present invention, the stud 11 is provided with four through holes 11b (see FIG. 1 (B)) for penetrating the stud 11 in the vertical direction. At this time, the stud 11 to which the LED chip 12 and the lead pin 13 are attached is turned upside down and inserted into a resin mold (not shown) in which the melted mold resin is housed. , A surplus of the molding resin is poured into the through hole 11b opened on the upper surface of the stud 11 and cured. At this time, air bubbles and the like flow into the through hole 11b together with the excess molding resin.

Thus, since the projection 14a integral with the lens 14 is insert-molded, the lens 14 is integrated with the stud 11 even in the through hole 11b. Here, since excess mold resin enters the through hole 11b, a resin mold (not shown) for molding the lens 14 is formed.
The inner diameter of can be selected to be approximately equal to the outer diameter of the stud 11.

The pin terminal LED according to the present invention is constructed as described above. The pin terminal LED 10 operates exactly like the conventional pin terminal LED, and the extra molding resin when molding the lens 14 is applied to the stud 11. Since it enters into the provided through hole 11b, it can be adjusted appropriately depending on the amount of resin entering into the through hole 11b, and it is not necessary to weigh accurately. Moreover, since the excess molding resin does not stick out and adhere along the outer periphery of the stud 11, the appearance is not impaired. Further, at this time, even if bubbles are generated near the entrance of the bore 11a, the bubbles move together with the resin into the bore 11a, so that the light emission of the pin terminal LED10 is not hindered.

Further, the lens 14 has a protruding portion 14a forming a part thereof.
Because it penetrates into the through hole 11b opened on the upper surface of the stud 11, the adhesion strength of the lens 15 to the stud 11 is increased and the surface area of the stud 11 is increased. This also improves the heat dissipation effect of the stud 11.

[Effect of device]

As described above, according to the present invention, a substantially cylindrical metal stud, at least one LED chip mounted on the upper surface of the stud, and an insulating material in a plurality of bores vertically penetrating the stud are provided. And lead pins that are respectively inserted through the studs and have their upper ends protruding slightly from the upper surface of the stud and bonded to the LED chips or the stud upper surface, and integrally formed on the stud upper surface so as to cover the LED chips. The pin terminal LED has a lens and at least one through hole that vertically penetrates the stud so that a part of resin forming the lens enters the through hole when the lens is molded. Since a part of the resin that should compose the lens enters the through hole of the stud during lens molding, the resin is molded during lens molding. Even if the amount of resin is not accurately measured, it can be adjusted appropriately by the mold resin that enters into the through hole, which simplifies the manufacturing process and reduces the cost. Since it is not necessary to make the inner diameter of the resin mold for lens molding larger than the diameter, the mold resin adheres to the outer periphery of the stud and the pin terminal LE
The appearance of D will not be spoiled.

Furthermore, since air bubbles and the like do not remain near the upper surface of the stud, the luminous efficiency of the pin terminal LED does not decrease,
Also, since the molding resin flows into the through holes that open on the top surface of the stud during lens molding and hardens,
Since the molding resin forming the lens is integrated with the stud even in the through hole, the adhesion strength of the lens to the stud can be increased.
Further, since the stud is provided with a hole penetrating up and down, the surface area of the stud is increased accordingly, so that the heat dissipation effect of the stud is improved.

Thus, according to the present invention, it is possible to provide an extremely excellent pin terminal LED in which excess resin at the time of lens molding does not adhere to the outer periphery of the stud and bubbles are not left in the lens.

[Brief description of drawings]

FIG. 1 shows an embodiment of a pin terminal LED according to the present invention, (A) is a sectional view and (B) is a plan view. FIG. 2 shows an example of a conventional pin terminal LED,
(A) is a cross-sectional view and (B) is a plan view. 10 ... Pin terminal LED; 11 ... Stud; 11a ... Bore; 11b ... Through hole; 12 ... LED chip;
13 ... Lead pin; 14 ... Lens; 14a ... Projection; 1
5 ... Insulating material; 16 ... Gold wire.

Claims (1)

[Scope of utility model registration request] 1. A substantially cylindrical metal stud, at least one LED chip mounted on the upper surface of the stud, and a plurality of bores vertically penetrating the stud, each of which is inserted through an insulating material. The upper end of the lead pin slightly protrudes from the upper surface of the stud and is bonded to the LED chip or the stud upper surface, and the lead pin is integrally formed on the stud so as to cover the LED chip. In the pin terminal LED, at least one through hole that penetrates the stud vertically is provided, and at the time of molding of the lens, a part of the resin forming the lens enters into the through hole. Characteristic, pin terminal LED.