JPH05291626A - Light emitting optical component - Google Patents
Light emitting optical componentInfo
- Publication number
- JPH05291626A JPH05291626A JP4084407A JP8440792A JPH05291626A JP H05291626 A JPH05291626 A JP H05291626A JP 4084407 A JP4084407 A JP 4084407A JP 8440792 A JP8440792 A JP 8440792A JP H05291626 A JPH05291626 A JP H05291626A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- led
- lens
- emitting optical
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
Description
［発明の目的］ [Object of the Invention]
【０００１】[0001]
【産業上の利用分野】本発明は、高光量のＬＥＤ（Ｌｉ
ｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）素子を基板に
高集積で配置した発光光学部品に関する。The present invention relates to a high amount of LED (L i
The ght E mitting D iode) element to a light emitting optical components arranged in a highly integrated into the substrate.
【０００２】[0002]
【従来の技術】近時、光技術、情報技術の発展にともな
い、光学素子の一つであるＬＥＤ部品は、あらゆる産業
機器に用いられている。とくに、表示用のものが多く、
発光色も種類が豊富である。また、光量の高いＬＥＤ部
品は、各種の光センサとしても用いられつつある。2. Description of the Related Art Recently, with the development of optical technology and information technology, LED parts, which are one of optical elements, are used in various industrial equipment. Especially for display,
There are a wide variety of emission colors. Moreover, LED components with high light intensity are being used as various optical sensors.
【０００３】このようなＬＥＤ部品の構造は、極めて単
純な形であるが、半導体チップのためボンディング・ワ
イヤで結線してあり、樹脂封止を必要とする。すなわ
ち、従来のＬＥＤ部品は、図４に示すように、ＬＥＤ半
導体チップＡと、このＬＥＤ半導体チップＡを保持する
ホルダＢと、このホルダＢに取付けられた一対のリード
Ｃと、ＬＥＤ半導体チップＡとリードＣとを電気的に接
続するボンディング・ワイヤＤと、ＬＥＤ半導体チップ
Ａ及びボンディング・ワイヤＤを封止する封止樹脂部Ｅ
とからなっている。この封止樹脂部Ｅは、図５に示すよ
うに、型Ｆに溶融状態のエポキシ樹脂Ｇを満たし、この
エポキシ樹脂Ｇ中にＬＥＤ半導体チップＡ及びボンディ
ング・ワイヤＤを浸漬した後、硬化させたものである。The structure of such an LED component is extremely simple, but since it is a semiconductor chip, it is connected by a bonding wire and requires resin sealing. That is, as shown in FIG. 4, a conventional LED component has an LED semiconductor chip A, a holder B for holding the LED semiconductor chip A, a pair of leads C attached to the holder B, and an LED semiconductor chip A. A bonding wire D for electrically connecting the lead C and the lead C, and a sealing resin portion E for sealing the LED semiconductor chip A and the bonding wire D
It consists of As shown in FIG. 5, the encapsulating resin portion E is filled with a molten epoxy resin G in a mold F, and the LED semiconductor chip A and the bonding wire D are immersed in the epoxy resin G and then cured. It is a thing.
【０００４】このような従来の方法で製造される発光光
学部品は、光量が小さく且つ生産性がすこぶる低いとと
もに、単一のＬＥＤ素子しか製造できず、高集積化が不
可能である難点をもっている。とくに、従来のＬＥＤ部
品は、光量が小さいため、光学系レンズ、光スイッチと
して用いる場合、用途が限定されてしまう不具合を生じ
ている。The light emitting optical component manufactured by such a conventional method has a problem that the quantity of light is small and the productivity is extremely low, and only a single LED element can be manufactured, and high integration is impossible. .. In particular, since the conventional LED parts have a small amount of light, when used as an optical system lens or an optical switch, there is a problem that their applications are limited.
【０００５】[0005]
【発明が解決しようとする課題】以上のように、従来の
発光光学部品は、光量が小さく且つ生産性がすこぶる低
いとともに、単一のＬＥＤ素子しか製造できず、高集積
化が不可能である難点をもっている。As described above, the conventional light emitting optical component has a small amount of light and a very low productivity, and only a single LED element can be manufactured, and high integration is impossible. I have a difficulty.
【０００６】本発明は、上記事情を顧慮してなされたも
ので、上述した従来の発光光学部品がもっている技術的
課題を解決することのできる発光光学部品を提供するこ
とを目的とする。 ［発明の構成］The present invention has been made in consideration of the above circumstances, and an object of the present invention is to provide a light emitting optical component which can solve the technical problems of the conventional light emitting optical component described above. [Constitution of Invention]
【０００７】[0007]
【課題を解決するための手段】本発明の発光光学部品
は、基板と、この基板上に形成された印刷回路と、上記
基板上に固着され且つ上記印刷回路に電気的に接続され
た発光ダイオード素子と、上記基板の少くとも上記印刷
回路及び上記発光ダイオード素子を封止する樹脂部とを
具備し、上記樹脂部の上記発光ダイオード素子からの光
が通過する部位がレンズとして機能するレンズ部に成形
されているものである。A light emitting optical component of the present invention comprises a substrate, a printed circuit formed on the substrate, and a light emitting diode fixed on the substrate and electrically connected to the printed circuit. An element and a resin portion for encapsulating at least the printed circuit and the light emitting diode element of the substrate, and a portion of the resin portion through which light from the light emitting diode element passes serves as a lens portion that functions as a lens. It is molded.
【０００８】[0008]
【作用】上記構成を有する発光光学部品は、ＬＥＤチッ
プの高集積化が可能となり、また、レンズ部を所望種類
のレンズに形成することが可能であることが相俟って、
発光光学部品としての機能が多様化するとともに用途が
拡大する。With the light emitting optical component having the above structure, LED chips can be highly integrated, and the lens portion can be formed into a lens of a desired type.
The functions as light emitting optical components will be diversified and the applications will be expanded.
【０００９】[0009]
【実施例】以下、本発明の一実施例を図面を参照して詳
述する。図１乃至図３は、この実施例の発光光学部品を
示している。この発光光学部品は、回路基板部１と、こ
の回路基板部１の表面に固着されたＬＥＤチップ部２
と、このＬＥＤチップ部２を封止するとともにこのＬＥ
Ｄチップ部２から投射された光を特定の位置に集光させ
る例えばアクリル樹脂などの透光性の樹脂部３とからな
っている。しかして、回路基板部１は、例えばガラスエ
ボキシ樹脂などからなる基板４と、この基板４の一方の
主面側表面に形成された印刷回路５とからなっている。
一方、ＬＥＤチップ部２は、一列に等間隔で基板４上に
固着された例えば２５個のＬＥＤチップ５…と、これら
のＬＥＤチップ５…の電極と印刷回路５とを電気的に接
続するボンディング・ワイヤ６…とからなっている。ま
た、樹脂部３は、基板４のＬＥＤチップ部２装着側の全
表面を被覆する厚膜状の封止部７と、この封止部７のＬ
ＥＤチップ部２配設部位に断面半円形状に盛り上がった
状態で連設され円柱レンズをなすレンズ部８とからなっ
ている。そして、樹脂部３は、ポリカーボネート樹脂、
アクリル樹脂であって、１，０００〜３０，０００ｐｏ
ｉｓｅの低粘度で透明、または、赤，黄，緑などに染料
により着色されている。また、封止部７の厚さは、例え
ば０．５〜１０ｍｍとする。このような発光光学部品の
製造は、基板４上に印刷回路５を形成した後、ＬＥＤチ
ップ５…を基板４上に糊着し、その後、ＬＥＤチップ５
…の電極と印刷回路５とをワイヤ・ボンディング法によ
り電気的に接続する。さらに、このＬＥＤチップ５…が
装着された基板４を射出成形金型のキャビティの所定位
置に配設した後、上下金型を密閉し、ポリカーボネート
樹脂、アクリル樹脂等の溶融樹脂をキャビティ中に射出
すると、発光光学部品がインサート射出成形される。な
お、樹脂部３の形成は、射出成形に限ることなく、例え
ば注型法、射出圧縮法、紫外線硬化法、コンプレッショ
ン成形法等によってもよい。An embodiment of the present invention will be described in detail below with reference to the drawings. 1 to 3 show a light emitting optical component of this embodiment. The light emitting optical component includes a circuit board portion 1 and an LED chip portion 2 fixed to the surface of the circuit board portion 1.
And this LED chip part 2 is sealed and this LE is
It is composed of a translucent resin portion 3 such as an acrylic resin for condensing the light projected from the D chip portion 2 at a specific position. The circuit board portion 1 is composed of a substrate 4 made of, for example, glass epoxy resin and a printed circuit 5 formed on the surface of the substrate 4 on the one main surface side.
On the other hand, the LED chip portion 2 has, for example, 25 LED chips 5 fixed to the substrate 4 in a row at equal intervals, and bonding for electrically connecting the electrodes of these LED chips 5 and the printed circuit 5.・ It consists of wire 6 ... Further, the resin portion 3 is a thick film-shaped sealing portion 7 that covers the entire surface of the substrate 4 on the LED chip portion 2 mounting side, and L of this sealing portion 7.
The ED chip portion 2 is provided with a lens portion 8 that is continuously formed in a raised state in a semicircular cross section and forms a cylindrical lens. And the resin part 3 is a polycarbonate resin,
Acrylic resin, 1,000-30,000 po
ise has a low viscosity and is transparent, or is colored with a dye such as red, yellow, and green. Moreover, the thickness of the sealing portion 7 is, for example, 0.5 to 10 mm. In the manufacture of such a light emitting optical component, after the printed circuit 5 is formed on the substrate 4, the LED chips 5 are glued on the substrate 4, and then the LED chip 5 is formed.
The electrodes and the printed circuit 5 are electrically connected by the wire bonding method. Further, after disposing the substrate 4 on which the LED chips 5 are mounted at a predetermined position in the cavity of the injection molding die, the upper and lower dies are sealed and a molten resin such as polycarbonate resin or acrylic resin is injected into the cavity. Then, the light emitting optical component is insert injection molded. The formation of the resin portion 3 is not limited to injection molding, and may be, for example, a casting method, an injection compression method, an ultraviolet curing method, a compression molding method, or the like.
【００１０】しかして、上記構成の発光光学部品は、図
示せぬ電源から印刷回路５及びボンディング・ワイヤ６
…を介して通電すると、基板４上に固着された例えば２
５個のＬＥＤチップ５…は発光する。そして、ＬＥＤチ
ップ５…にて発生した光は、基板４上に被着され且つ
赤，黄，緑などに着色されたレンズ部８を介して外部に
投射される。このように、この実施例の発光光学部品
は、ＬＥＤチップ５…を封止する樹脂部３の一部をレン
ズ部８に形成したので、ＬＥＤチップ部２の高集積化が
可能となる。また、基板４上において、ＬＥＤチップ５
…を種々の形状に配置できることにより、例えば、表示
用のみでなく、光スイッチなどにも応用でき、用途が拡
大する。Therefore, the light emitting optical component having the above-described structure is provided with a printed circuit 5 and a bonding wire 6 from a power source (not shown).
When electricity is applied via the ...
The five LED chips 5 ... Emit light. Then, the light generated by the LED chips 5 is projected to the outside through the lens portion 8 which is adhered onto the substrate 4 and colored red, yellow, green or the like. As described above, in the light emitting optical component of this embodiment, since the resin portion 3 for sealing the LED chips 5 is formed in the lens portion 8, the LED chip portion 2 can be highly integrated. In addition, on the substrate 4, the LED chip 5
Since the ... Can be arranged in various shapes, it can be applied not only to displays but also to optical switches and the like, and the applications are expanded.
【００１１】なお、上記実施例においては、レンズ部８
は、円柱レンズの場合を例示しているが、凹レンズ、凸
レンズ、マイクロレンズ、グレーティングレンズの集合
体あるいはこれらの組合わせでもよい。In the above embodiment, the lens portion 8
Although a cylindrical lens is illustrated as an example, a concave lens, a convex lens, a microlens, an assembly of grating lenses, or a combination thereof may be used.
【００１２】[0012]
【発明の効果】本発明の発光光学部品は、印刷回路を形
成した基板上にＬＥＤチップを固着して印刷回路に電気
的に接続したものを樹脂部により封止し、さらにＬＥＤ
チップ樹脂部のＬＥＤチップに接する部位がレンズ部と
なるように成形したので、ＬＥＤチップの高集積化が可
能となる。また、レンズ部を所望種類のレンズに形成す
ることが可能であることが相俟って、発光光学部品とし
ての機能が多様化するとともに用途が拡大する。According to the light emitting optical component of the present invention, an LED chip is fixed on a substrate on which a printed circuit is formed and electrically connected to the printed circuit, which is sealed with a resin portion.
Since the portion of the chip resin portion in contact with the LED chip is formed to be the lens portion, the LED chip can be highly integrated. In addition, it is possible to form the lens portion into a desired type of lens, so that the function as a light emitting optical component is diversified and the application is expanded.
【図１】本発明の一実施例の発光光学部品の全体を示す
斜視図である。FIG. 1 is a perspective view showing an entire light emitting optical component according to an embodiment of the present invention.
【図２】本発明の一実施例の発光光学部品の要部を示す
平面図である。FIG. 2 is a plan view showing a main part of a light emitting optical component according to an embodiment of the present invention.
【図３】本発明の一実施例の発光光学部品の要部を示す
断面図である。FIG. 3 is a sectional view showing a main part of a light emitting optical component according to an embodiment of the present invention.
【図４】従来の発光光学部品の構成図である。FIG. 4 is a configuration diagram of a conventional light emitting optical component.
【図５】従来の発光光学部品の製造方法の説明図であ
る。FIG. 5 is an explanatory view of a conventional method for manufacturing a light emitting optical component.
１：回路基板部，２：ＬＥＤチップ部，３：樹脂部，
４：基板，５：ＬＥＤチップ，８：レンズ部。1: circuit board part, 2: LED chip part, 3: resin part,
4: substrate, 5: LED chip, 8: lens part.
Claims (1)
と、上記基板上に固着され且つ上記印刷回路に電気的に
接続された発光ダイオード素子と、上記基板の少くとも
上記印刷回路及び上記発光ダイオード素子を封止する樹
脂部とを具備し、上記樹脂部の上記発光ダイオード素子
からの光が通過する部位はレンズとして機能するレンズ
部に成形されていることを特徴とする発光光学部品。1. A substrate, a printed circuit formed on the substrate, a light emitting diode element fixed on the substrate and electrically connected to the printed circuit, and at least the printed circuit on the substrate. A light emitting optical component, comprising: a resin portion that seals the light emitting diode element, wherein a portion of the resin portion through which the light from the light emitting diode element passes is molded into a lens portion that functions as a lens. ..
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4084407A JPH05291626A (en) | 1992-04-07 | 1992-04-07 | Light emitting optical component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4084407A JPH05291626A (en) | 1992-04-07 | 1992-04-07 | Light emitting optical component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05291626A true JPH05291626A (en) | 1993-11-05 |
Family
ID=13829740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4084407A Pending JPH05291626A (en) | 1992-04-07 | 1992-04-07 | Light emitting optical component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05291626A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000108144A (en) * | 1998-10-06 | 2000-04-18 | Taiyo Ltd | Manufacture of parts |
| US9222645B2 (en) | 2010-11-29 | 2015-12-29 | RTC Industries, Incorporated | LED lighting assembly and method of lighting for a merchandise display |
| US11274808B2 (en) | 2010-06-17 | 2022-03-15 | Rtc Industries, Inc. | LED lighting assembly and method of lighting for a merchandise display |
-
1992
- 1992-04-07 JP JP4084407A patent/JPH05291626A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000108144A (en) * | 1998-10-06 | 2000-04-18 | Taiyo Ltd | Manufacture of parts |
| US10619824B2 (en) | 2010-06-17 | 2020-04-14 | Rtc Industries, Inc. | LED lighting assembly and method of lighting for a merchandise display |
| US11274808B2 (en) | 2010-06-17 | 2022-03-15 | Rtc Industries, Inc. | LED lighting assembly and method of lighting for a merchandise display |
| US9222645B2 (en) | 2010-11-29 | 2015-12-29 | RTC Industries, Incorporated | LED lighting assembly and method of lighting for a merchandise display |
| US9829178B2 (en) | 2010-11-29 | 2017-11-28 | Rtc Industries, Inc. | LED lighting assembly and method of lighting for a merchandise display |
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