JPH09102633A - Led display, metal mold for its manufacture, and manufacture of the led display - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED display, a metal mold for its manufacture, and a manufacturing method of the LED display wherein uselessness in the application of a finished article is excluded, a protective layer can easily be formed, and a blind part can be formed successively to the formation of the protective layer. SOLUTION: In this LED display 1, a plurality of LED elements 5 are arranged in parallel on the surface of a circuit board 4, and lens parts 6 composed of transparent resin are formed just above the LED elements 5. A protective layer 7 which is composed of transparent resin and unified in a body with the lens parts 6 is formed on the surface of the circuit board 4. In this case, a blind part 8 composed of opaque colored resin is collectively formed together with the protective layer, on its surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold and method for manufacturing an LED display device used as an outdoor display board for displaying road information.

[0002]

2. Description of the Related Art As an LED display device 21 of this type,
As shown in simplified form in FIG. 6, a plurality of LED lamps 2
2 are arranged in parallel on the surface of the circuit board 23 by soldering, and the surface of the circuit board 23 exposed between the LED lamps 22 is covered with a protective layer 2 made of epoxy resin or the like.
Some have a structure coated with 4. The LED lamp 22 here is a completed component in which the periphery of the LED element 25 is molded with a transparent resin such as epoxy, while the protective layer 24 protects the electronic component and the circuit board 23 from moisture and rainwater in the atmosphere. Since it is formed for protection, the resin thickness of the protective layer 24 that is injected between the LED lamps 22 and cured is about 2 mm.

On the protective layer 24 of the circuit board 23 in the LED display device 21, a so-called louver member 26, which is a sunshade member formed as a separate component made of an opaque colored resin such as a metal plate or an epoxy resin, is formed. The louver member 26 is attached to the circuit board 23 by means such as screwing (not shown). In addition, the louver member 26 prevents the identification failure of the light emission state from occurring due to the incidence of sunlight on the LED lamp 22. Furthermore, in FIG. 6, the LED lamps 22 are arranged at the respective vertex positions of squares that are at right angles to each other, but the arrangement state is not limited to this, and for example, the LED lamps 22 are arranged at the vertex positions of a rectangle. However, it is needless to say that they may be arranged at each vertex position of a parallelogram that does not form a right angle.

[0004]

By the way, in the LED display device 21 having the above-mentioned conventional structure, the LED lamp 22 which is a completed part although it is a simple assembly part is used and the LED lamp 22 is avoided. Since the protective layer 24 is formed by injecting the resin, the labor and cost required to complete the LED lamp 22 are wasted, and a great deal of labor is required to form the protective layer 24. It was supposed to take. Further, since the louver member 26 as a separate component is prepared and it is necessary to attach the louver member 26 in a step completely different from the step of forming the protective layer 24, there is a disadvantage that extra labor is required. Was there.

The present invention has been devised in view of these disadvantages, and is capable of facilitating the formation of a protective layer while eliminating waste associated with the use of finished parts and forming a protective layer. It is an object of the present invention to provide an LED display device capable of forming a shade portion subsequently, a mold for manufacturing the LED display device, and a manufacturing method of the LED display device.

[0006]

In the LED display device according to claim 1 of the present invention, a lens portion made of a transparent resin is provided directly above each of the plurality of LED elements arranged in parallel on the surface of the circuit board. The protective layer is formed and is formed on the surface of the circuit board by a transparent resin integrated with the lens portion. Further, in the LED display device according to claim 2, a lens portion made of transparent resin is formed at a position directly above each of the plurality of LED elements arranged in parallel on the surface of the circuit board,
In addition, a protective layer made of a transparent resin integrated with the lens portion is formed on the surface of the circuit board, and a shade portion made of an opaque colored resin is provided on the surface of the protective layer exposed between the lens portions. Is formed integrally with the protective layer.

In the die for manufacturing the LED display device according to the third aspect of the present invention, the transparent resin is injected so as to entirely surround the surface of the circuit board on which the plurality of LED elements are arranged in parallel. In the first manufacturing die, a lens portion forming recess for forming a lens portion made of a transparent resin of each LED element is provided at each position corresponding to a position directly above each LED element. Further, in the manufacturing die according to claim 4, an opaque colored resin is injected to entirely surround the surface of the circuit board on which the lens portion is formed directly above each LED element and the protective layer is formed. And a sunshade forming recess for forming a sunshade made of an opaque colored resin is provided at each position where it abuts on the surface of the protective layer exposed between the lens parts. Has been.

Further, a method for manufacturing an LED display device according to a fifth aspect of the present invention is a method for manufacturing the LED display device according to the first aspect using the first manufacturing die. After the entire surface of the circuit board on which a plurality of LED elements are arranged in parallel is surrounded by a manufacturing die, the transparent resin injected into the manufacturing die is cured to obtain LE.
A feature is that a lens portion made of a transparent resin is formed at each position directly above each D element, and a protective layer made of a transparent resin is formed integrally with the lens portion on the surface of the circuit board. The manufacturing method according to claim 6 is the second
A method for manufacturing the LED display device according to claim 2 using the manufacturing die according to claim 2, wherein the surface of the lens portion formed on the LED element and the protective layer formed on the circuit board. After being completely surrounded by the manufacturing mold, the opaque colored resin injected into the manufacturing mold is cured to cure the opaque colored resin on the surface of the protective layer exposed between the lens parts. The part is formed integrally with the protective layer.

[0009]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing a simplified sectional structure of an essential part of an LED display device according to this embodiment, and FIG. 2 is a perspective view showing a simplified sectional structure of an essential part of a first manufacturing die. 3 is an explanatory view showing a manufacturing procedure when the first manufacturing mold is used, and FIG. 4 is a perspective view showing a simplified sectional structure of a main part of the second manufacturing mold, and FIG. FIG. 6 is an explanatory view showing a manufacturing procedure when the second manufacturing die is used. Further, in these figures, reference numeral 1 is an LED display device, 2 is a first manufacturing mold, and 3 is a second manufacturing mold.

The LED display device 1 according to the present embodiment is
A circuit board 4 having a required wiring pattern (not shown) formed on the surface thereof, and a plurality of LED elements 5 arranged in parallel on the surface of the circuit board 4 are configured. , The LED elements 5 are die-bonded at predetermined positions on the surface of the circuit board 4 and then wire-bonded to the corresponding wiring patterns. The LED element 5 is not limited to the normal wire-bonding type, and may be a surface-mounting type that does not require wire-bonding, for example, a non-wire-bonding type horizontally mounted LED. Of course good things. A lens portion 6 made of a transparent resin such as an epoxy resin is formed so as to cover each position directly above each LED element 5, and the lens portion 6 is formed on the surface of the circuit board 4. A protective layer 7 made of an integrated transparent resin is formed.

That is, these lens portions 6 are provided so as to exert a light-collecting effect, and are precisely positioned so that the optical axis of the LED element 5 passes through the central position of the lens portion 6. Is formed by. Therefore, at this time, the same function as that of the LED lamp 22 in the conventional example is exhibited depending on the combination of the LED element 5 and the lens portion 6, and if the shape of the lens portion 6 is changed as necessary, the conical shape is obtained. A structure called a lamp or an elliptical lamp will be obtained.

Further, L constituting the LED display device 1
Lens part 6 formed directly above each ED element 5
An opaque colored resin, for example, a linear wall-shaped sunshade portion made of a black epoxy resin, a so-called louver 8 is formed on the surface of the protective layer 7 exposed between the two.
Each of the louvers 8 having a predetermined resin thickness is integrated with the protective layer 7 by using the same epoxy resin. The louvers 8 are provided to prevent generation of defective identification of the light emission state due to incidence of sunlight on the LED lamp including the LED element 5 and the lens portion 6. There is also an LED display device 1 in which only the lens portion 6 and the protective layer 7 are formed without being formed.

Next, based on FIGS. 2 and 3, the manufacturing procedure of the first manufacturing mold 2 and the LED display device 1 using the manufacturing mold 2, that is, the lens portion 6 and the protective layer. 7
The formation procedure of the above will be described.

First manufacturing mold 2 according to the present embodiment
Is a circuit board 4 on which a plurality of LED elements 5 are arranged in parallel.
2, the transparent resin is injected after completely enclosing the surface of the mold, and as shown in FIG. 2, the inner surface of the cavity 2a provided in the manufacturing mold 2 is equivalent to the thickness of the protective layer 7 in the circuit. The cavity 2a is separated from the surface of the substrate 4.
A lens portion forming recess 10 for forming a lens portion 6 made of a transparent resin of each LED element 5 at each position on the inner surface of the LED element 5 which corresponds to the position directly above each LED element 5.
Is provided. It should be noted that the conical lamp, the elliptical lamp, or the LED display device 1 in a state in which these are mixed
When configuring, the shape of each of the lens-portion forming recesses 10 is set as required.

In manufacturing the LED display device 1, as shown in FIG. 3, after a liquid transparent resin is injected into the cavity 2a of the manufacturing die 2, a plurality of L's are formed.
The surface of the circuit board 4 on which the ED elements 5 are arranged in parallel is covered with the cavity 2a of the manufacturing mold 2, and the transparent resin that has been injected is cured. That is, in this case, the entire surface of the circuit board 4 on which the LED elements 5 are arranged in parallel is surrounded by the manufacturing mold 2, and the transparent resin injected into the manufacturing mold 2 is 100 Through 15
Curing is carried out at a temperature of 0 ° C. for several hours. At this time, the cavity 2 of the manufacturing mold 2
It is necessary to take care so that air bubbles do not enter the inside of a, particularly the lens portion forming recess 10.

After that, when the circuit board 4 is removed from the manufacturing mold 2 after the completion of the curing of the transparent resin, the lens portion 6 made of the transparent resin is provided at each position directly above each of the LED elements 5.
Is formed, and a protective layer 7 made of a transparent resin having a resin thickness of about 2 mm is formed integrally with the lens portion 6 on the surface of the circuit board 4. That is, in this step, the louver 8 is not yet formed, and the LED display device 1 having a structure excluding the louver 8 in FIG. 1 is configured.

Further, based on FIGS. 4 and 5, the second manufacturing mold 3 and the manufacturing procedure of the LED display device 1 using the manufacturing mold 3, that is, the forming procedure of the louver 8 will be described. explain.

Second manufacturing mold 3 according to the present embodiment
Uses the first manufacturing mold 2 to completely enclose the surface of the circuit board 4 on which the lens portion 6 is formed immediately above each LED element 5 and the protective layer 7 is formed. The opaque colored resin is injected above, and as shown in FIG. 4, a space 3a for housing the lens 6 is provided in the cavity of the manufacturing mold 3.
At the same time, in order to form the louver 8 made of an opaque colored resin at a predetermined position in the cavity of the manufacturing mold 3, that is, at a position where the louver 8 contacts the surface of the protective layer 7 exposed between the lens portions 6. Sunshade forming recess 11
Are provided so as to project from the inner surface of the cavity. The depth of the sunshade forming recess 11 is 10 m.
It is generally about m, but the depths thereof, that is, the heights of the louvers 8 are set in consideration of the visibility of the LED elements 5.

At the time of manufacturing the LED display device 1 which is executed following the manufacturing procedure shown in FIG. 3, as shown in FIG. 5, a liquid opaque liquid is formed in the sunshade forming recess 11 of the manufacturing die 3. A colored resin is injected, and the opaque colored resin is cured after the cavity of the manufacturing die 3 is covered with the circuit board 4 on which the lens portion 6 and the protective layer 7 are formed. That is, in this case, after the entire surface of the lens portion 6 formed on the LED element 5 and the protective layer 7 formed on the circuit board 4 is surrounded by the manufacturing die 3, the manufacturing is performed. The opaque colored resin that has been injected into the mold 3 is cured. Therefore, louvers 8 made of an opaque colored resin are formed at predetermined positions on the surface of the protective layer 7 covering the surface of the circuit board 4 taken out of the manufacturing die 3, and these louvers 8 are formed. Is integrated with the protective layer 7. As a result, the LED display device 1 having the structure shown in FIG. 1 is completed.

[0021]

As described above, the LE according to the present invention is used.
In the D display device, the lens portion of the LED element and the protective layer of the circuit board are integrally formed by using a transparent resin, and the louver formed by using an opaque colored resin is integrated with the protective layer. Has been converted. When the manufacturing method using the manufacturing die according to the present invention is adopted, the LED display device having the above structure according to the present invention can be manufactured very easily. Therefore, it is not necessary to use the LED lamp which is a completed part like the conventional example,
In addition, since it is not necessary to form the protective layer by injecting the resin while avoiding the LED lamp, it is possible to save labor and cost, and it is possible to significantly reduce the number of steps required for manufacturing. To be

[Brief description of the drawings]

FIG. 1 is a perspective view showing a simplified cross-sectional structure of a main part of an LED display device according to an embodiment.

FIG. 2 is a perspective view showing a simplified sectional structure of a main part of a first manufacturing die.

FIG. 3 is an explanatory view showing a manufacturing procedure when the first manufacturing die is used.

FIG. 4 is a perspective view showing a simplified sectional structure of a main part of a second manufacturing die.

FIG. 5 is an explanatory view showing a manufacturing procedure when the second manufacturing die is used.

FIG. 6 is a perspective view showing a simplified sectional structure of a main part of an LED display device according to a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 LED display device 2 1st manufacturing mold 3 2nd manufacturing mold 4 Circuit board 5 LED element 6 Lens part 7 Protective layer 8 Louver (shade part)

Claims (6)

[Claims] 1. A lens portion made of transparent resin is formed immediately above each of a plurality of LED elements arranged in parallel on the surface of a circuit board, and a lens portion is formed on the surface of the circuit board. An LED display device, wherein a protective layer made of an integrated transparent resin is formed. 2. A lens portion made of transparent resin is formed directly above each of the plurality of LED elements arranged in parallel on the surface of the circuit board, and the lens portion is formed on the surface of the circuit board. A protective layer made of an integrated transparent resin is formed, and a shade part made of an opaque colored resin is integrally formed with the protective layer on the surface of the protective layer exposed between the lens parts. LED display device characterized by. 3. A transparent resin is injected so as to entirely surround a surface of a circuit board on which a plurality of LED elements are arranged in parallel.
A mold for manufacturing an ED display device, wherein a lens portion forming recess for forming a lens portion made of a transparent resin of each LED element is provided at a position corresponding to a position directly above each LED element. A mold for manufacturing an LED display device characterized by: 4. An LED in which an opaque colored resin is injected to entirely surround the surface of a circuit board on which a lens portion is formed directly above each LED element and a protective layer is formed.
In a mold for manufacturing a display device, a sunshade forming concave portion for forming a sunshade made of an opaque colored resin is provided at each position of contact with the surface of the protective layer exposed between the lens portions. A mold for manufacturing an LED display device, which is characterized in that 5. An LED using the manufacturing die according to claim 3.
A method for manufacturing a display device, in which the surface of a circuit board on which a plurality of LED elements are arranged in parallel is entirely surrounded by a manufacturing mold, and then a transparent resin injected into the manufacturing mold is cured. By so doing, a lens portion made of transparent resin is formed at each position directly above each LED element, and a protective layer made of transparent resin is formed integrally with the lens portion on the surface of the circuit board. Manufacturing method of display device. 6. An LED using the manufacturing die according to claim 4.
A method of manufacturing a display device, comprising completely covering the surfaces of a lens part formed on an LED element and a protective layer formed on a circuit board with a manufacturing mold, and then manufacturing a mold. An LED display device, characterized in that by curing an opaque colored resin injected into the inside of the protective layer, a shade portion made of the opaque colored resin is integrally formed on the surface of the protective layer exposed between the lens portions. Manufacturing method.