JPH0622985Y2 - 多電源素子用パッケージ - Google Patents

多電源素子用パッケージ

Info

Publication number
JPH0622985Y2
JPH0622985Y2 JP1988116285U JP11628588U JPH0622985Y2 JP H0622985 Y2 JPH0622985 Y2 JP H0622985Y2 JP 1988116285 U JP1988116285 U JP 1988116285U JP 11628588 U JP11628588 U JP 11628588U JP H0622985 Y2 JPH0622985 Y2 JP H0622985Y2
Authority
JP
Japan
Prior art keywords
power supply
lead frame
package
power
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988116285U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0238738U (enExample
Inventor
貴稔 瀧川
寛彦 井原
貴雄 前田
正晴 安原
正策 山中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP1988116285U priority Critical patent/JPH0622985Y2/ja
Publication of JPH0238738U publication Critical patent/JPH0238738U/ja
Application granted granted Critical
Publication of JPH0622985Y2 publication Critical patent/JPH0622985Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07554—Controlling the environment, e.g. atmosphere composition or temperature changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1988116285U 1988-09-02 1988-09-02 多電源素子用パッケージ Expired - Lifetime JPH0622985Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988116285U JPH0622985Y2 (ja) 1988-09-02 1988-09-02 多電源素子用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988116285U JPH0622985Y2 (ja) 1988-09-02 1988-09-02 多電源素子用パッケージ

Publications (2)

Publication Number Publication Date
JPH0238738U JPH0238738U (enExample) 1990-03-15
JPH0622985Y2 true JPH0622985Y2 (ja) 1994-06-15

Family

ID=31358683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988116285U Expired - Lifetime JPH0622985Y2 (ja) 1988-09-02 1988-09-02 多電源素子用パッケージ

Country Status (1)

Country Link
JP (1) JPH0622985Y2 (enExample)

Also Published As

Publication number Publication date
JPH0238738U (enExample) 1990-03-15

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