JPH0621241Y2 - ボンディング用ワーク押さえ - Google Patents

ボンディング用ワーク押さえ

Info

Publication number
JPH0621241Y2
JPH0621241Y2 JP6297488U JP6297488U JPH0621241Y2 JP H0621241 Y2 JPH0621241 Y2 JP H0621241Y2 JP 6297488 U JP6297488 U JP 6297488U JP 6297488 U JP6297488 U JP 6297488U JP H0621241 Y2 JPH0621241 Y2 JP H0621241Y2
Authority
JP
Japan
Prior art keywords
opening
work holder
pressing surface
line
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP6297488U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01167041U (US08066781-20111129-C00013.png
Inventor
光格 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP6297488U priority Critical patent/JPH0621241Y2/ja
Publication of JPH01167041U publication Critical patent/JPH01167041U/ja
Application granted granted Critical
Publication of JPH0621241Y2 publication Critical patent/JPH0621241Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means

Landscapes

  • Wire Bonding (AREA)
JP6297488U 1988-05-13 1988-05-13 ボンディング用ワーク押さえ Expired - Lifetime JPH0621241Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6297488U JPH0621241Y2 (ja) 1988-05-13 1988-05-13 ボンディング用ワーク押さえ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6297488U JPH0621241Y2 (ja) 1988-05-13 1988-05-13 ボンディング用ワーク押さえ

Publications (2)

Publication Number Publication Date
JPH01167041U JPH01167041U (US08066781-20111129-C00013.png) 1989-11-22
JPH0621241Y2 true JPH0621241Y2 (ja) 1994-06-01

Family

ID=31288514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6297488U Expired - Lifetime JPH0621241Y2 (ja) 1988-05-13 1988-05-13 ボンディング用ワーク押さえ

Country Status (1)

Country Link
JP (1) JPH0621241Y2 (US08066781-20111129-C00013.png)

Also Published As

Publication number Publication date
JPH01167041U (US08066781-20111129-C00013.png) 1989-11-22

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