JPH0621240Y2 - ボンディングウェッジ - Google Patents

ボンディングウェッジ

Info

Publication number
JPH0621240Y2
JPH0621240Y2 JP1988103292U JP10329288U JPH0621240Y2 JP H0621240 Y2 JPH0621240 Y2 JP H0621240Y2 JP 1988103292 U JP1988103292 U JP 1988103292U JP 10329288 U JP10329288 U JP 10329288U JP H0621240 Y2 JPH0621240 Y2 JP H0621240Y2
Authority
JP
Japan
Prior art keywords
wire
wedge
wall portion
bottom wall
ceiling wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988103292U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0226242U (https=
Inventor
秀明 三好
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP1988103292U priority Critical patent/JPH0621240Y2/ja
Publication of JPH0226242U publication Critical patent/JPH0226242U/ja
Application granted granted Critical
Publication of JPH0621240Y2 publication Critical patent/JPH0621240Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • H10W72/07141Means for applying energy, e.g. ovens or lasers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)
JP1988103292U 1988-08-05 1988-08-05 ボンディングウェッジ Expired - Lifetime JPH0621240Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988103292U JPH0621240Y2 (ja) 1988-08-05 1988-08-05 ボンディングウェッジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988103292U JPH0621240Y2 (ja) 1988-08-05 1988-08-05 ボンディングウェッジ

Publications (2)

Publication Number Publication Date
JPH0226242U JPH0226242U (https=) 1990-02-21
JPH0621240Y2 true JPH0621240Y2 (ja) 1994-06-01

Family

ID=31333990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988103292U Expired - Lifetime JPH0621240Y2 (ja) 1988-08-05 1988-08-05 ボンディングウェッジ

Country Status (1)

Country Link
JP (1) JPH0621240Y2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2574054B2 (ja) * 1990-07-12 1997-01-22 沖電気工業株式会社 ワイヤボンダ及びワイヤボンディング方法
JP5953385B1 (ja) * 2015-02-25 2016-07-20 本田技研工業株式会社 車両

Also Published As

Publication number Publication date
JPH0226242U (https=) 1990-02-21

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