JPH0621240Y2 - Bonding wedge - Google Patents
Bonding wedgeInfo
- Publication number
- JPH0621240Y2 JPH0621240Y2 JP1988103292U JP10329288U JPH0621240Y2 JP H0621240 Y2 JPH0621240 Y2 JP H0621240Y2 JP 1988103292 U JP1988103292 U JP 1988103292U JP 10329288 U JP10329288 U JP 10329288U JP H0621240 Y2 JPH0621240 Y2 JP H0621240Y2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- wedge
- wall portion
- bottom wall
- ceiling wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
- H01L2224/78314—Shape
- H01L2224/78317—Shape of other portions
- H01L2224/78318—Shape of other portions inside the capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、半導体装置の製造過程で用いられるワイヤボ
ンディング装置のボンディングウェッジ（以下ウェッジ
と略）に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a bonding wedge (hereinafter referred to as a wedge) of a wire bonding apparatus used in a manufacturing process of a semiconductor device.
従来用いられているウェッジは個々が特定の傾きでワイ
ヤをガイドするものである。例えば、３０°用のウェッ
ジ，４５°用のウェッジ，６０°用のウェッジが、別々
に製作され、使い分けられている。Conventionally used wedges individually guide the wire at a specific inclination. For example, a wedge for 30 °, a wedge for 45 °, and a wedge for 60 ° are separately manufactured and used properly.
第４図(a)のウェッジ１１のワイヤガイド孔２１は、中
央部３１の天井壁部４１及び底壁部５１のウェッジ１１
の振動付与面部６１に対する傾きがそれぞれ３０°に形
成され（縦断面図において互いに平行にあらわれる）、
ワイヤ１０を傾き３０°でガイドするウェッジ１１の
例、第４図(b)は中央部３１１の天井壁部４１１及び底
壁部５１１の傾きが６０°で、ワイヤ１０を傾き６０°
でガイドするワイヤガイド孔２１１を備えたウェッジ１
１１の例である。The wire guide hole 21 of the wedge 11 of FIG. 4 (a) is formed by the wedge wall 11 of the central wall 31 and the ceiling wall 41 and the bottom wall 51.
Are formed with an inclination of 30 ° with respect to the vibration imparting surface portion 61 (appearing parallel to each other in the longitudinal sectional view),
An example of the wedge 11 that guides the wire 10 at an inclination of 30 °, FIG. 4 (b) shows that the ceiling wall portion 411 and the bottom wall portion 511 of the central portion 311 have an inclination of 60 °, and the wire 10 has an inclination of 60 °.
1 with a wire guide hole 211 for guiding with
11 is an example.
従って、ワイヤの供給角度が異なる機種に使用すること
ができなかった。Therefore, it cannot be used for a model having different wire supply angles.
また、例えば第４図(b)のウェッジ１１１で第１ボンデ
ィングを行うときにウェッジ１１１の振動付与面部６１
１から突出したワイヤ先端部の傾きを小さくすることが
できず、確実な第１ボンディングを行うことがむずかし
かった。Further, for example, when performing the first bonding with the wedge 111 of FIG. 4B, the vibration applying surface portion 61 of the wedge 111 is used.
Since the inclination of the wire tip portion protruding from No. 1 cannot be reduced, it has been difficult to perform reliable first bonding.
本考案は上述の従来の問題点を解決しようとするもの
で、ワイヤの供給角度が異なる機種にも使用でき、たま
ワイヤ先端部の傾きを任意の所望の傾きにして確実に第
１ボンディングを行うことができるウェッジを提供する
ことを目的とするものである。The present invention is intended to solve the above-mentioned conventional problems, and can be used for models having different wire supply angles, and the first bonding is performed surely by setting the inclination of the wire tip end to any desired inclination. The purpose is to provide a wedge that can be used.
本考案は、入口をウェッジの一側面部に開口し出口をウ
ェッジの下端面部に開口したワイヤガイド孔を有するウ
ェッジにおいて、前記ワイヤガイド孔の中央部の天井壁
部と底壁部はそれぞれ前記下端面部に対する傾きを異な
らしめられるとともに天井壁部と底壁部にワイヤを真空
状態で沿わしめたときにワイヤが前記下端面部の振動付
与面部を含む平面上で交差するように設けられ、該中央
部から入口開口に至る入口部及び出口開口に至る出口部
はワイヤを真直状態で前記天井壁部及び底壁部に沿わし
めることができる大きさの出入口部に形成されているこ
とを特徴とするウェッジである。The present invention relates to a wedge having a wire guide hole having an inlet opening on one side surface of the wedge and an outlet opening on a lower end surface portion of the wedge, wherein a ceiling wall portion and a bottom wall portion at the center of the wire guide hole are respectively the lower end portions. The inclination with respect to the surface portion is different, and when the wires are laid along the ceiling wall portion and the bottom wall portion in a vacuum state, the wires are provided so as to intersect on a plane including the vibration imparting surface portion of the lower end surface portion, and the central portion From the inlet to the inlet opening and the outlet from the outlet opening are formed in the inlet / outlet portion having a size that allows the wire to be straightened along the ceiling wall portion and the bottom wall portion. Is.
本考案のウェッジはワイヤガイド孔の中央部の天井壁部
と底壁部はそれぞれウェッジの下端面部に対する傾きを
異ならしめられるとともに天井壁部と底壁部にワイヤを
真直状態で沿わしめたときにワイヤが前記下端面部の振
動付与面部を含む平面上で交差するように設けられ、ワ
イヤガイド孔の中央部から入口開口に至る入口部及び出
口開口に至る出口部はワイヤを真直状態で前記天井壁部
及び底壁部に沿わしめることができる大きさの出入口部
に形成されているので、ワイヤは天井壁部の傾きから底
壁部の傾きの範囲内で任意の所望の傾きでウェッジに挿
入されガイドされる。In the wedge of the present invention, the ceiling wall portion and the bottom wall portion in the central portion of the wire guide hole have different inclinations with respect to the lower end surface portion of the wedge respectively, and when the wires are laid straight on the ceiling wall portion and the bottom wall portion. Wires are provided so as to intersect each other on a plane including the vibration imparting surface portion of the lower end surface portion, and an inlet portion from a central portion of the wire guide hole to an inlet opening and an outlet portion to an outlet opening straightly wire the ceiling wall. Since it is formed on the entrance and exit part that is large enough to run along the bottom part and the bottom wall part, the wire is inserted into the wedge at any desired tilt within the range from the tilt of the ceiling wall part to the tilt of the bottom wall part. Be guided.
例えば第１図例では、ワイヤ供給角度が３０°から６０
°の機種（４５°，あれば３５°，５５°等無段階的
に）に巾広く用いることができる。また例えば第１図に
おいて、ワイヤ１０′の傾きとして第１ボンディングを
確実に行い、ワイヤ１０の傾きとしてワイヤガイド孔入
口でワイヤを折曲することなく第２ボンディング部付近
のピンなどを逃げて第２ボンディングを行うことも可能
となる。For example, in the example of FIG. 1, the wire supply angle is 30 ° to 60 °.
It can be widely used for models of ° (45 °, if there is 35 °, 55 ° infinitely). Further, for example, in FIG. 1, the first bonding is reliably performed as the inclination of the wire 10 ′, and the inclination of the wire 10 allows the pin or the like near the second bonding portion to escape without bending the wire at the entrance of the wire guide hole. It is also possible to perform two bonding.
本考案の実施例を第１〜３図を用いて説明する。 An embodiment of the present invention will be described with reference to FIGS.
第１，２図において、ワイヤガイド孔２はウェッジ１の
前側面部から下端面部へ斜めに貫通して設けられている
（ワイヤガイド孔２の開口が設けられている側面部が臨
む方を前、反対を後とする）。下端面部はワイヤガイド
孔２の開口より後方の面がウェッジ１の軸心に垂直の振
動付与面部６に形成され、前方の面は上方に傾斜して設
けらている。1 and 2, the wire guide hole 2 is provided obliquely penetrating from the front side surface portion of the wedge 1 to the lower end surface portion (the side where the opening of the wire guide hole 2 is provided faces the front side). , Opposite to later). A lower surface of the lower end surface of the wire guide hole 2 is formed on the vibration applying surface 6 perpendicular to the axis of the wedge 1, and a front surface of the lower surface is inclined upward.
ワイヤガイド孔２の中央部３の天井壁部４及び底壁部５
は断面半円形状の凹曲壁で、それぞれの振動付与面部６
に対する傾きは、天井壁部４が６０°、底壁部５が３０
°に形成されている。また天井壁部４と底壁部５とは、
天井壁部４に沿わしめた実線で示すワイヤ１０と底壁部
５に沿わしめた２点鎖線で示すワイヤ１０′とが振動付
与面部６を含む平面上の点Ｐで交差する位置に設けられ
ている。中央部３の側壁部７，７は振動付与面部６に垂
直にかつワイヤ１０の径に見合った間隔をあけて互いに
平行に設けられている。The ceiling wall portion 4 and the bottom wall portion 5 of the central portion 3 of the wire guide hole 2
Is a concave curved wall having a semicircular cross section, and each vibration applying surface portion 6
The ceiling wall 4 is 60 ° and the bottom wall 5 is 30 °.
Formed in °. Further, the ceiling wall portion 4 and the bottom wall portion 5 are
A wire 10 shown by a solid line along the ceiling wall 4 and a wire 10 'shown by a chain double-dashed line along the bottom wall 5 are provided at positions intersecting at a point P on a plane including the vibration giving surface 6. ing. The side wall portions 7, 7 of the central portion 3 are provided perpendicularly to the vibration imparting surface portion 6 and in parallel with each other with an interval corresponding to the diameter of the wire 10.
ウェッジ１の前側面部に設けた開口から中央部３に至る
入口部８及び中央部３からウェッジ１の下端面部に設け
た開口に至る出口部９はワイヤがワイヤ１０，１０′の
いずれの状態でも真直状態を保つことが可能な大きさの
拡開した孔に形成されているが、出口部９の後縁部即ち
振動付与面部６の前端孔縁部６′は天井壁部４の延長上
に形成して点Ｐを振動付与面部６近傍とするともに、出
口部９の側壁部の間隔を中央部３の側壁部７，７と同じ
にしてワイヤをどの傾きで挿入してもワイヤの導出部分
が常に振動付与面部６に垂直で中心線Ｌを含む平面内に
位置するようにしてある。The inlet 8 from the opening provided on the front side surface portion of the wedge 1 to the central portion 3 and the outlet portion 9 from the central portion 3 to the opening provided on the lower end surface portion of the wedge 1 have a wire in either state of wire 10 or 10 '. However, it is formed as an expanded hole having a size capable of maintaining a straight state, but the rear edge of the outlet portion 9, that is, the front end hole edge portion 6 ′ of the vibration imparting surface portion 6 is an extension of the ceiling wall portion 4. And the point P is formed in the vicinity of the vibration applying surface portion 6 and the side wall portions of the outlet portion 9 are arranged at the same intervals as the side wall portions 7 and 7 of the central portion 3 to lead out the wire at any inclination. The portion is always located in a plane perpendicular to the vibration imparting surface portion 6 and including the center line L.
第３図は別の実施例で出口部９の孔と中央部３の孔が同
じ数式で表わされる孔形状のものである。中央部３は第
１，２図と同様に形成されている。FIG. 3 shows another embodiment in which the hole of the outlet portion 9 and the hole of the central portion 3 have the same hole shape. The central portion 3 is formed similarly to FIGS.
以上、底壁部５を３０°、天井壁部４を６０°とした例
で説明したが、天井壁部４と底壁部５はワイヤを沿わし
めたときにワイヤが点Ｐで交差する如き異なる傾きでそ
れぞれ所望の傾きに設けることができる。In the above description, the bottom wall portion 5 is 30 ° and the ceiling wall portion 4 is 60 °. However, in the ceiling wall portion 4 and the bottom wall portion 5, when the wires are routed, the wires intersect at a point P. Different inclinations can be provided to desired inclinations.
本考案のウェッジはワイヤガイド孔の中央部の天井壁部
と底壁部はそれぞれウェッジの下端面部に対する傾きを
異ならしめられるとともに天井壁部と底壁部にワイヤを
真直状態で沿わしめたときにワイヤが前記下端面部の振
動付与面部を含む平面上で交差するように設けられ、ワ
イヤガイド孔の中央部から入口開口に至る入口部及び出
口開口に至る出口部はワイヤを真直状態で前記天井壁部
及び底壁部に沿わしめることができる大きさの出入口部
に形成されているので、ワイヤの供給角度が異なる機種
にも使用でき、またワイヤ先端部の傾きを任意の所望の
傾きにして確実に第１ボンディングを行うこと、及びワ
イヤガイド孔入口でワイヤを折曲することなく第２ボン
ディング部付近のピンなどを逃げて第２ボンディングを
行うことができる。The wedge of the present invention is a ceiling wall part at the center of the wire guide hole.
The bottom wall and the bottom wall,
The wires are different from each other and are attached to the ceiling wall and the bottom wall.
When the wires are laid straight, the wire will not
It is provided so as to intersect on a plane including the motion imparting surface part,
The entrance and exit from the center of the ear guide hole to the entrance opening
The outlet part leading to the mouth opening is the above-mentioned ceiling wall part with the wire straightened.
And a doorway of a size that can fit along the bottom wall
Since it is formed in the model, the model with different wire supply angle
Can also be used for tilting the wire tip to any desired
Make sure to tilt and perform the first bonding securely, and
Do not bend the wire at the inlet of the ear guide hole
Run the second bonding by escaping the pins near the bonding part.
It can be carried out.
【図面の簡単な説明】 第１図は本考案の実施例の縦断面図、第２図は第１図Ｉ
−Ｉ線矢視図、第３図は別の実施例の縦断面図、第４図
(a)(b)はそれぞれ従来例の縦断面図である。 １，１１，１１１…ウェッジ、２，２１，２１１…ワイ
ヤガイド孔、３，３１，３１１…中央部、４，４１，４
１１…天井壁部、５，５１，５１１…底壁部、６，６
１，６１１…振動付与面部、７…側壁部、８…入口部、
９…出口部、１０，１０′…ワイヤ。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a longitudinal sectional view of an embodiment of the present invention, and FIG. 2 is FIG.
-I line arrow view, FIG. 3 is a longitudinal sectional view of another embodiment, FIG.
(a) and (b) are vertical sectional views of a conventional example. 1, 11, 111 ... Wedge, 2, 21, 21 ... Wire guide hole, 3, 31, 311 ... Central part, 4, 41, 4
11 ... Ceiling wall part, 5, 51, 511 ... Bottom wall part, 6, 6
1, 611 ... Vibration imparting surface portion, 7 ... Side wall portion, 8 ... Inlet portion,
9 ... Exit part, 10, 10 '... Wire.
Claims (1)
開口し出口をボンディングウェッジの下端面部に開口し
たワイヤガイド孔を有するボンディングウェッジにおい
て、前記ワイヤガイド孔の中央部の天井壁部と底壁部は
それぞれ前記下端面部に対する傾きを異ならしめられる
とともに天井壁部と底壁部にワイヤを真直状態で沿わし
めたときにワイヤが前記下端面部の振動付与面部を含む
平面上で交差するように設けられ、該中央部から入口開
口に至る入口部及び出口開口に至る出口部はワイヤを真
直状態で前記天井壁部及び底壁部に沿わしめることがで
きる大きさの出入口部に形成されていることを特徴とす
るボンディングウェッジ。1. A bonding wedge having a wire guide hole having an inlet opening at one side surface of the bonding wedge and an outlet opening at a lower end surface of the bonding wedge, wherein a ceiling wall portion and a bottom wall portion at a central portion of the wire guide hole are provided. Are provided so as to have different inclinations with respect to the lower end surface portion and the wires intersect each other on a plane including the vibration imparting surface portion of the lower end surface portion when the wires are laid straight on the ceiling wall portion and the bottom wall portion. The inlet portion extending from the central portion to the inlet opening and the outlet portion reaching the outlet opening are formed in an inlet / outlet portion having a size that allows the wire to run straight along the ceiling wall portion and the bottom wall portion. Characteristic bonding wedge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988103292U JPH0621240Y2 (en) | 1988-08-05 | 1988-08-05 | Bonding wedge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988103292U JPH0621240Y2 (en) | 1988-08-05 | 1988-08-05 | Bonding wedge |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0226242U JPH0226242U (en) | 1990-02-21 |
| JPH0621240Y2 true JPH0621240Y2 (en) | 1994-06-01 |
Family
ID=31333990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988103292U Expired - Lifetime JPH0621240Y2 (en) | 1988-08-05 | 1988-08-05 | Bonding wedge |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0621240Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2574054B2 (en) * | 1990-07-12 | 1997-01-22 | 沖電気工業株式会社 | Wire bonder and wire bonding method |
| JP5953385B1 (en) * | 2015-02-25 | 2016-07-20 | 本田技研工業株式会社 | vehicle |
-
1988
- 1988-08-05 JP JP1988103292U patent/JPH0621240Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0226242U (en) | 1990-02-21 |
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