JPH0621238Y2 - 半導体素子接着剤塗布装置 - Google Patents

半導体素子接着剤塗布装置

Info

Publication number
JPH0621238Y2
JPH0621238Y2 JP1987080437U JP8043787U JPH0621238Y2 JP H0621238 Y2 JPH0621238 Y2 JP H0621238Y2 JP 1987080437 U JP1987080437 U JP 1987080437U JP 8043787 U JP8043787 U JP 8043787U JP H0621238 Y2 JPH0621238 Y2 JP H0621238Y2
Authority
JP
Japan
Prior art keywords
semiconductor element
element adhesive
drum
adhesive
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987080437U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63188941U (enrdf_load_stackoverflow
Inventor
雅人 清
正一 川嶋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1987080437U priority Critical patent/JPH0621238Y2/ja
Publication of JPS63188941U publication Critical patent/JPS63188941U/ja
Application granted granted Critical
Publication of JPH0621238Y2 publication Critical patent/JPH0621238Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1987080437U 1987-05-26 1987-05-26 半導体素子接着剤塗布装置 Expired - Lifetime JPH0621238Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987080437U JPH0621238Y2 (ja) 1987-05-26 1987-05-26 半導体素子接着剤塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987080437U JPH0621238Y2 (ja) 1987-05-26 1987-05-26 半導体素子接着剤塗布装置

Publications (2)

Publication Number Publication Date
JPS63188941U JPS63188941U (enrdf_load_stackoverflow) 1988-12-05
JPH0621238Y2 true JPH0621238Y2 (ja) 1994-06-01

Family

ID=30931242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987080437U Expired - Lifetime JPH0621238Y2 (ja) 1987-05-26 1987-05-26 半導体素子接着剤塗布装置

Country Status (1)

Country Link
JP (1) JPH0621238Y2 (enrdf_load_stackoverflow)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57167266A (en) * 1981-04-10 1982-10-15 Hitachi Ltd Squeezee thrusting mechanism for screen printing machine
JPS6214962A (ja) * 1985-07-15 1987-01-23 Shinkawa Ltd 接着剤塗布装置

Also Published As

Publication number Publication date
JPS63188941U (enrdf_load_stackoverflow) 1988-12-05

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