JPS63188941U - - Google Patents

Info

Publication number
JPS63188941U
JPS63188941U JP8043787U JP8043787U JPS63188941U JP S63188941 U JPS63188941 U JP S63188941U JP 8043787 U JP8043787 U JP 8043787U JP 8043787 U JP8043787 U JP 8043787U JP S63188941 U JPS63188941 U JP S63188941U
Authority
JP
Japan
Prior art keywords
semiconductor device
adhesive
drum
device adhesive
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8043787U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0621238Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987080437U priority Critical patent/JPH0621238Y2/ja
Publication of JPS63188941U publication Critical patent/JPS63188941U/ja
Application granted granted Critical
Publication of JPH0621238Y2 publication Critical patent/JPH0621238Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1987080437U 1987-05-26 1987-05-26 半導体素子接着剤塗布装置 Expired - Lifetime JPH0621238Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987080437U JPH0621238Y2 (ja) 1987-05-26 1987-05-26 半導体素子接着剤塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987080437U JPH0621238Y2 (ja) 1987-05-26 1987-05-26 半導体素子接着剤塗布装置

Publications (2)

Publication Number Publication Date
JPS63188941U true JPS63188941U (enrdf_load_stackoverflow) 1988-12-05
JPH0621238Y2 JPH0621238Y2 (ja) 1994-06-01

Family

ID=30931242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987080437U Expired - Lifetime JPH0621238Y2 (ja) 1987-05-26 1987-05-26 半導体素子接着剤塗布装置

Country Status (1)

Country Link
JP (1) JPH0621238Y2 (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57167266A (en) * 1981-04-10 1982-10-15 Hitachi Ltd Squeezee thrusting mechanism for screen printing machine
JPS6214962A (ja) * 1985-07-15 1987-01-23 Shinkawa Ltd 接着剤塗布装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57167266A (en) * 1981-04-10 1982-10-15 Hitachi Ltd Squeezee thrusting mechanism for screen printing machine
JPS6214962A (ja) * 1985-07-15 1987-01-23 Shinkawa Ltd 接着剤塗布装置

Also Published As

Publication number Publication date
JPH0621238Y2 (ja) 1994-06-01

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