JPS63188941U - - Google Patents

Info

Publication number
JPS63188941U
JPS63188941U JP8043787U JP8043787U JPS63188941U JP S63188941 U JPS63188941 U JP S63188941U JP 8043787 U JP8043787 U JP 8043787U JP 8043787 U JP8043787 U JP 8043787U JP S63188941 U JPS63188941 U JP S63188941U
Authority
JP
Japan
Prior art keywords
semiconductor device
adhesive
drum
device adhesive
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8043787U
Other languages
Japanese (ja)
Other versions
JPH0621238Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987080437U priority Critical patent/JPH0621238Y2/en
Publication of JPS63188941U publication Critical patent/JPS63188941U/ja
Application granted granted Critical
Publication of JPH0621238Y2 publication Critical patent/JPH0621238Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本考案の一実施例を示す断面図、第
２図は、本考案の他の実施例を示す断面図、第３
図は、従来の半導体素子接着剤塗布装置を示す図
である。 １…ドラム部、２…ブロツク、３…スキージ部
、４…吐出口、５…間隔調節部、６…供給ポート
、７…圧力調節ポート、８…半導体素子接着剤、
９…アイランド、１０…圧力調節器、１１…フイ
ルタ・レギユレータ、１２…半導体素子接着剤塗
布装置本体、１３…シリンジ、１４…圧縮空気、
１５…ニードル。 FIG. 1 is a sectional view showing one embodiment of the invention, FIG. 2 is a sectional view showing another embodiment of the invention, and FIG. 3 is a sectional view showing another embodiment of the invention.
The figure shows a conventional semiconductor device adhesive coating device. DESCRIPTION OF SYMBOLS 1... Drum part, 2... Block, 3... Squeegee part, 4... Discharge port, 5... Spacing adjustment part, 6... Supply port, 7... Pressure adjustment port, 8... Semiconductor element adhesive,
9... Island, 10... Pressure regulator, 11... Filter regulator, 12... Semiconductor element adhesive coating device body, 13... Syringe, 14... Compressed air,
15...Needle.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子接着剤を塗布して半導体素子を固定
する半導体素子接着剤塗布装置において、半導体
素子接着剤を貯めておくドラム部と、リードフレ
ームアイランド及び半導体素子寸法に合わせて、
交換着脱可能な半導体素子接着剤吐出口と、ドラ
ム内壁と接触させながら回転運動をさせるブロツ
クと、半導体素子接着剤を塗布する為に前記ブロ
ツクに取り付けられているスキージ部と、前記ス
キージ部とトラム内壁との間隔を調節し、半導体
素子接着剤の塗布量を調節させる間隔調節部と、
前記ドラム部の内部圧力の調節を行なう圧力調節
ポートと、半導体素子接着剤を一定量ずつ前記ド
ラム部の内部に供給する供給ポートとを有するこ
とを特徴とする半導体素子接着剤塗布装置。 In a semiconductor device adhesive applicator that applies semiconductor device adhesive to fix a semiconductor device, there is a drum section for storing semiconductor device adhesive, a lead frame island, and a drum section that matches the dimensions of the lead frame island and semiconductor device.
A replaceable and removable semiconductor device adhesive discharge port, a block that rotates while in contact with the inner wall of the drum, a squeegee portion attached to the block for applying semiconductor device adhesive, and the squeegee portion and the tram. a distance adjustment section that adjusts the distance between the inner wall and the amount of semiconductor element adhesive applied;
A semiconductor device adhesive application device, comprising: a pressure adjustment port for adjusting the internal pressure of the drum portion; and a supply port for supplying a fixed amount of semiconductor device adhesive into the drum portion.
JP1987080437U 1987-05-26 1987-05-26 Semiconductor element adhesive coating device Expired - Lifetime JPH0621238Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987080437U JPH0621238Y2 (en) 1987-05-26 1987-05-26 Semiconductor element adhesive coating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987080437U JPH0621238Y2 (en) 1987-05-26 1987-05-26 Semiconductor element adhesive coating device

Publications (2)

Publication Number Publication Date
JPS63188941U true JPS63188941U (en) 1988-12-05
JPH0621238Y2 JPH0621238Y2 (en) 1994-06-01

Family

ID=30931242

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987080437U Expired - Lifetime JPH0621238Y2 (en) 1987-05-26 1987-05-26 Semiconductor element adhesive coating device

Country Status (1)

Country Link
JP (1) JPH0621238Y2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57167266A (en) * 1981-04-10 1982-10-15 Hitachi Ltd Squeezee thrusting mechanism for screen printing machine
JPS6214962A (en) * 1985-07-15 1987-01-23 Shinkawa Ltd Apparatus for applying adhesive

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57167266A (en) * 1981-04-10 1982-10-15 Hitachi Ltd Squeezee thrusting mechanism for screen printing machine
JPS6214962A (en) * 1985-07-15 1987-01-23 Shinkawa Ltd Apparatus for applying adhesive

Also Published As

Publication number Publication date
JPH0621238Y2 (en) 1994-06-01

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