JPS62183580U - - Google Patents

Info

Publication number
JPS62183580U
JPS62183580U JP6986486U JP6986486U JPS62183580U JP S62183580 U JPS62183580 U JP S62183580U JP 6986486 U JP6986486 U JP 6986486U JP 6986486 U JP6986486 U JP 6986486U JP S62183580 U JPS62183580 U JP S62183580U
Authority
JP
Japan
Prior art keywords
container
supply port
unit
lead frame
passing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6986486U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6986486U priority Critical patent/JPS62183580U/ja
Publication of JPS62183580U publication Critical patent/JPS62183580U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａは本考案の一実施例を示す半断面図、
第１図ｂは第１図ａの主要部拡大断面図、第２図
ａ，ｂは本考案の使用状態を示す説明図、第３図
は従来例を示す半断面図である。 １……ノズル、２……シリンジ、２ａ……ペー
スト、３……デイスペンサ、５……ホルダ、６…
…スライダ、７……ナツト、８……ガイド、９…
…リードフレーム、９ａ……アイランド、１０…
…レール面。 FIG. 1a is a half-sectional view showing an embodiment of the present invention;
FIG. 1b is an enlarged sectional view of the main part of FIG. 1a, FIGS. 2a and 2b are explanatory views showing the usage state of the present invention, and FIG. 3 is a half sectional view showing a conventional example. 1... Nozzle, 2... Syringe, 2a... Paste, 3... Dispenser, 5... Holder, 6...
...Slider, 7...Natsuto, 8...Guide, 9...
...Lead frame, 9a...Island, 10...
...Rail surface.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 容器に収容された粘性液体を該容器に設けた供
給口に通して半導体部品のリードフレーム又は基
板上に塗布するユニツトにおいて、供給口の外周
に高さ調整可能なガイドを有することを特徴とす
る液体材料供給ユニツト。 A unit for applying a viscous liquid contained in a container to a lead frame or a substrate of a semiconductor component by passing it through a supply port provided in the container, characterized by having a height-adjustable guide on the outer periphery of the supply port. Liquid material supply unit.
JP6986486U 1986-05-09 1986-05-09 Pending JPS62183580U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6986486U JPS62183580U (en) 1986-05-09 1986-05-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6986486U JPS62183580U (en) 1986-05-09 1986-05-09

Publications (1)

Publication Number Publication Date
JPS62183580U true JPS62183580U (en) 1987-11-21

Family

ID=30910977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6986486U Pending JPS62183580U (en) 1986-05-09 1986-05-09

Country Status (1)

Country Link
JP (1) JPS62183580U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009142729A (en) * 2007-12-12 2009-07-02 Toshiba Corp Needle unit and dispenser apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009142729A (en) * 2007-12-12 2009-07-02 Toshiba Corp Needle unit and dispenser apparatus

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