JPH0621237Y2 - セラミツクパツケ−ジ - Google Patents

セラミツクパツケ−ジ

Info

Publication number
JPH0621237Y2
JPH0621237Y2 JP1987114866U JP11486687U JPH0621237Y2 JP H0621237 Y2 JPH0621237 Y2 JP H0621237Y2 JP 1987114866 U JP1987114866 U JP 1987114866U JP 11486687 U JP11486687 U JP 11486687U JP H0621237 Y2 JPH0621237 Y2 JP H0621237Y2
Authority
JP
Japan
Prior art keywords
semiconductor chip
ceramic package
present
metal pedestal
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987114866U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6420727U (en:Method
Inventor
勇人 宇佐美
信勝 斎藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1987114866U priority Critical patent/JPH0621237Y2/ja
Publication of JPS6420727U publication Critical patent/JPS6420727U/ja
Application granted granted Critical
Publication of JPH0621237Y2 publication Critical patent/JPH0621237Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H10W70/682—
    • H10W72/884—

Landscapes

  • Die Bonding (AREA)
JP1987114866U 1987-07-27 1987-07-27 セラミツクパツケ−ジ Expired - Lifetime JPH0621237Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987114866U JPH0621237Y2 (ja) 1987-07-27 1987-07-27 セラミツクパツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987114866U JPH0621237Y2 (ja) 1987-07-27 1987-07-27 セラミツクパツケ−ジ

Publications (2)

Publication Number Publication Date
JPS6420727U JPS6420727U (en:Method) 1989-02-01
JPH0621237Y2 true JPH0621237Y2 (ja) 1994-06-01

Family

ID=31356000

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987114866U Expired - Lifetime JPH0621237Y2 (ja) 1987-07-27 1987-07-27 セラミツクパツケ−ジ

Country Status (1)

Country Link
JP (1) JPH0621237Y2 (en:Method)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57111050A (en) * 1980-12-26 1982-07-10 Fujitsu Ltd Semiconductor device
US4415025A (en) * 1981-08-10 1983-11-15 International Business Machines Corporation Thermal conduction element for semiconductor devices
JPS6183041U (en:Method) * 1984-11-07 1986-06-02

Also Published As

Publication number Publication date
JPS6420727U (en:Method) 1989-02-01

Similar Documents

Publication Publication Date Title
JPH06502962A (ja) ダイス固着構造
JP2527828B2 (ja) 半導体パッケ―ジ
US5150197A (en) Die attach structure and method
JPH0621237Y2 (ja) セラミツクパツケ−ジ
JP2001035977A (ja) 半導体装置用容器
JPS62213191A (ja) 光半導体用ステム
JPS63120431A (ja) 電力用半導体装置
JP2589520B2 (ja) 樹脂封止型半導体装置の製造方法
JP3036291B2 (ja) 半導体装置の実装構造
JPH0625007Y2 (ja) 多電源素子用パツケージ
JPH069508Y2 (ja) 多電源素子用パツケージ
JP2687678B2 (ja) 半導体用セラミックスパッケージ
JPS63308944A (ja) 半導体装置
JP2552158Y2 (ja) リードフレーム
JPH083017Y2 (ja) 半導体装置の容器
JPH0424947A (ja) 半導体用セラミックスパッケージ
JPH0382067A (ja) 樹脂封止型半導体装置
JPH08306849A (ja) 放熱部材及び該放熱部材を備えた半導体装置
JPH0936287A (ja) 半導体装置およびその製造方法
JPH0325247U (en:Method)
JPH05267492A (ja) セラミックパッケージ
JPH05267358A (ja) 半導体素子
JPH07122668A (ja) 半導体装置及びそのパッケージ
JPS62147736A (ja) 半導体素子の搭載方法
JPH06209022A (ja) 半導体用治具及び半導体装置