JPH06204499A - IV族元素ドープIII−V族化合物半導体を有するp−n接合デバイス - Google Patents
IV族元素ドープIII−V族化合物半導体を有するp−n接合デバイスInfo
- Publication number
- JPH06204499A JPH06204499A JP5208123A JP20812393A JPH06204499A JP H06204499 A JPH06204499 A JP H06204499A JP 5208123 A JP5208123 A JP 5208123A JP 20812393 A JP20812393 A JP 20812393A JP H06204499 A JPH06204499 A JP H06204499A
- Authority
- JP
- Japan
- Prior art keywords
- superlattice
- layer
- type
- layers
- doped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02392—Phosphides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02461—Phosphides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02463—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02505—Layer structure consisting of more than two layers
- H01L21/02507—Alternating layers, e.g. superlattice
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02543—Phosphides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02576—N-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02579—P-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/81—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation
- H10D62/815—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW]
- H10D62/8161—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW] potential variation due to variations in composition or crystallinity, e.g. heterojunction superlattices
- H10D62/8162—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW] potential variation due to variations in composition or crystallinity, e.g. heterojunction superlattices having quantum effects only in the vertical direction, i.e. layered structures having quantum effects solely resulting from vertical potential variation
- H10D62/8164—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW] potential variation due to variations in composition or crystallinity, e.g. heterojunction superlattices having quantum effects only in the vertical direction, i.e. layered structures having quantum effects solely resulting from vertical potential variation comprising only semiconductor materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/854—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs further characterised by the dopants
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Recrystallisation Techniques (AREA)
- Light Receiving Elements (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US934840 | 1986-11-25 | ||
US07/934,840 US5268582A (en) | 1992-08-24 | 1992-08-24 | P-N junction devices with group IV element-doped group III-V compound semiconductors |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06204499A true JPH06204499A (ja) | 1994-07-22 |
Family
ID=25466161
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5208123A Pending JPH06204499A (ja) | 1992-08-24 | 1993-08-24 | IV族元素ドープIII−V族化合物半導体を有するp−n接合デバイス |
Country Status (7)
Country | Link |
---|---|
US (1) | US5268582A (en, 2012) |
EP (1) | EP0585003A3 (en, 2012) |
JP (1) | JPH06204499A (en, 2012) |
KR (1) | KR100270857B1 (en, 2012) |
CA (1) | CA2100492C (en, 2012) |
SG (1) | SG42926A1 (en, 2012) |
TW (1) | TW275700B (en, 2012) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002314118A (ja) * | 2001-04-16 | 2002-10-25 | Sumitomo Electric Ind Ltd | 受光素子 |
JP2008538052A (ja) * | 2005-04-01 | 2008-10-02 | メアーズ テクノロジーズ, インコーポレイテッド | 半導体接合を画定するドーピングされた領域を有する超格子及び隣接する半導体層を有する半導体素子 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2781097B2 (ja) * | 1992-01-30 | 1998-07-30 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
US5594750A (en) * | 1995-06-06 | 1997-01-14 | Hughes Aircraft Company | Selectively Si-doped InAs/A1AsSb short-period-superlattices as N-type cladding layers for mid-IR laser structures grown on InAs substrates |
JP2718406B2 (ja) * | 1995-12-19 | 1998-02-25 | 日本電気株式会社 | 電界効果トランジスタ |
JP3763667B2 (ja) * | 1998-04-23 | 2006-04-05 | 株式会社東芝 | 半導体発光素子 |
US6043143A (en) * | 1998-05-04 | 2000-03-28 | Motorola, Inc. | Ohmic contact and method of manufacture |
US6097041A (en) * | 1998-08-24 | 2000-08-01 | Kingmax Technology Inc. | Light-emitting diode with anti-reflector |
US7295586B2 (en) * | 2002-02-21 | 2007-11-13 | Finisar Corporation | Carbon doped GaAsSb suitable for use in tunnel junctions of long-wavelength VCSELs |
DE10317397A1 (de) * | 2003-04-15 | 2004-11-04 | Scheidt & Bachmann Gmbh | Vorrichtung zur Annahme von Münzen |
CA2581614A1 (en) * | 2004-10-01 | 2006-04-13 | Finisar Corporation | Vertical cavity surface emitting laser having multiple top-side contacts |
US7860137B2 (en) | 2004-10-01 | 2010-12-28 | Finisar Corporation | Vertical cavity surface emitting laser with undoped top mirror |
US7483212B2 (en) * | 2006-10-11 | 2009-01-27 | Rensselaer Polytechnic Institute | Optical thin film, semiconductor light emitting device having the same and methods of fabricating the same |
US8080820B2 (en) * | 2009-03-16 | 2011-12-20 | Intel Corporation | Apparatus and methods for improving parallel conduction in a quantum well device |
CN103579326B (zh) * | 2012-08-03 | 2016-12-21 | 电子科技大学 | 一种具有纵向复合缓冲层的氮化镓基高电子迁移率晶体管 |
WO2016105396A1 (en) * | 2014-12-23 | 2016-06-30 | Intel Corporation | Diffusion tolerant iii-v semiconductor heterostructures and devices including the same |
US10497814B2 (en) | 2014-12-23 | 2019-12-03 | Intel Corporation | III-V semiconductor alloys for use in the subfin of non-planar semiconductor devices and methods of forming the same |
JP6702268B2 (ja) * | 2017-06-15 | 2020-05-27 | 信越半導体株式会社 | エピタキシャルウェーハの製造方法 |
WO2019147602A1 (en) | 2018-01-29 | 2019-08-01 | Northwestern University | Amphoteric p-type and n-type doping of group iii-vi semiconductors with group-iv atoms |
US10411101B1 (en) | 2018-07-30 | 2019-09-10 | International Business Machines Corporation | P-N junction based devices with single species impurity for P-type and N-type doping |
DE102019003068A1 (de) * | 2019-04-30 | 2020-11-05 | 3-5 Power Electronics GmbH | Stapelförmige hochsperrende lnGaAS-Halbleiterleistungsdiode |
CN114341408B (zh) * | 2019-07-09 | 2024-10-29 | 集成太阳能私人有限公司 | 在(111)Si上生长的第III-V族材料的受控的n-掺杂的方法 |
JP7513484B2 (ja) * | 2020-10-09 | 2024-07-09 | 株式会社デンソー | 半導体装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4675709A (en) * | 1982-06-21 | 1987-06-23 | Xerox Corporation | Quantized layered structures with adjusted indirect bandgap transitions |
EP0133342B1 (en) * | 1983-06-24 | 1989-11-29 | Nec Corporation | A superlattice type semiconductor structure having a high carrier density |
JPS6453570A (en) * | 1987-08-25 | 1989-03-01 | Mitsubishi Electric Corp | Superlattice device |
JPH01171269A (ja) * | 1987-12-26 | 1989-07-06 | Fujitsu Ltd | 半導体装置 |
GB2223351A (en) * | 1988-09-28 | 1990-04-04 | Philips Electronic Associated | A method of manufacturing a semiconductor device having waveguide structure |
JP2646799B2 (ja) * | 1989-12-21 | 1997-08-27 | 日本電気株式会社 | 半導体多層膜 |
JPH045817A (ja) * | 1990-04-23 | 1992-01-09 | Hitachi Ltd | エピタキシャル成長層、その成長法、半導体装置及び高抵抗領域の製造方法 |
EP0565054A3 (en) * | 1992-04-09 | 1994-07-27 | Hughes Aircraft Co | N-type antimony-based strained layer superlattice and fabrication method |
-
1992
- 1992-08-24 US US07/934,840 patent/US5268582A/en not_active Expired - Lifetime
- 1992-10-20 TW TW081108328A patent/TW275700B/zh not_active IP Right Cessation
-
1993
- 1993-07-14 CA CA002100492A patent/CA2100492C/en not_active Expired - Fee Related
- 1993-07-31 KR KR1019930014815A patent/KR100270857B1/ko not_active Expired - Lifetime
- 1993-08-11 EP EP93306352A patent/EP0585003A3/en not_active Ceased
- 1993-08-11 SG SG1996000878A patent/SG42926A1/en unknown
- 1993-08-24 JP JP5208123A patent/JPH06204499A/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002314118A (ja) * | 2001-04-16 | 2002-10-25 | Sumitomo Electric Ind Ltd | 受光素子 |
JP2008538052A (ja) * | 2005-04-01 | 2008-10-02 | メアーズ テクノロジーズ, インコーポレイテッド | 半導体接合を画定するドーピングされた領域を有する超格子及び隣接する半導体層を有する半導体素子 |
Also Published As
Publication number | Publication date |
---|---|
EP0585003A2 (en) | 1994-03-02 |
SG42926A1 (en) | 1997-10-17 |
KR940004903A (ko) | 1994-03-16 |
US5268582A (en) | 1993-12-07 |
KR100270857B1 (ko) | 2000-12-01 |
EP0585003A3 (en) | 1996-01-31 |
TW275700B (en, 2012) | 1996-05-11 |
CA2100492C (en) | 1996-08-27 |
CA2100492A1 (en) | 1994-02-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20020527 |