JPH06196575A - Information indicating method on the surface of semiconductor chip - Google Patents

Abstract

PURPOSE:To ensure acquisition of predetermined information concerning a semiconductor chip even when information printed on the surface of the semiconductor device is missed or when a record preserved at a manufacturer is discarded. CONSTITUTION:Information, e.g. production lot number, wafer manufacturer name, history, inspection results, is printed in the form of a bar code 14 onto a semiconductor chip 12 or a tape printed with the information is stuck to the semiconductor chip 12 at a step preceding the step for sealing the semiconductor chip 12 with resin mold 18 or the like. This method allows acquisition of the information by unsealing the semiconductor device and reading out the bar code even when the record of the semiconductor device is discarded because of the expiration of preservation period or when the print on the surface of the semiconductor device is missed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for displaying information on the surface of a semiconductor chip, which displays information such as the manufacturing lot number, history, and inspection result of the semiconductor chip on the surface of the semiconductor chip.

[0002]

2. Description of the Related Art A conventional semiconductor device has no information such as a history of a chip of the semiconductor other than the marking on the surface and the marking on the plastic mold.

When a market failure occurs in such a semiconductor device, the cause investigation and the estimation of the scope of the investigation are left in the manufacturing factory or the like based on the marking on the surface of the semiconductor device or the plastic mold marking. It was done by following the recorded records.

[0004]

However, it is impossible to investigate when the record of the corresponding semiconductor device is expired and discarded, and the marking on the semiconductor device is easily deteriorated by the solvent in the mounting process. However, if it was unclear and unreadable, the investigation was completely impossible.

Further, even if there is a record in a manufacturing factory, conventionally, only information on the entire manufacturing lot is used, and it is possible to determine what position of the wafer the semiconductor device in question is and what kind of inspection result result. There was a problem that it was not possible to confirm the information for each chip, such as when there was.

The present invention has been made in view of the above-mentioned problems of the prior art, and even if the markings or markings on the surface of the semiconductor device are deteriorated and unclear, the recording at the manufacturing factory is abolished. Even after being rejected, it is possible to trace the semiconductor device and to confirm from which position on which wafer the chip of the semiconductor device comes. It is an object of the present invention to provide a method of displaying information on the surface of.

[0007]

According to the present invention, chip information including the manufacturing lot and history of the semiconductor chip is added to the surface of the semiconductor chip in a step before the sealing of the semiconductor chip. The above object is achieved by a method of displaying information on the surface of the.

The information may be added by at least one of printing on the surface of the semiconductor chip and attaching a tape on which information is written.

The printing may be done with a conductive ink material.

The tape may be made of a conductive material.

[0011]

According to the present invention, the necessary information is added to the surface of the semiconductor chip in the step before the semiconductor chip is molded. Therefore, when the failure occurs, the chip information can be read. Thus, even if the printing or marking on the surface of the semiconductor device is unclear or the record in the factory is lost, information such as history of the semiconductor chip can be traced and investigated.

According to the second aspect, information is easily added by printing on the surface of the semiconductor chip or attaching an information tape.

According to the third aspect, it is possible to prevent the conductive ink material from being charged with static electricity on the surface of the semiconductor chip, thereby ensuring the normal operation of the apparatus.

According to the present invention, the tape of the conductive material can prevent static electricity from being charged, and can also shield the electromagnetic field from the outside and disperse heat.
Further, by widening the tape as much as possible, it is possible to prevent the semiconductor chip from being damaged.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of displaying information on the surface of a semiconductor chip according to the present invention will be described below in detail with reference to the drawings.

In the first embodiment of the present invention, as shown in FIGS. 1 to 3, from a semiconductor wafer 10 to a semiconductor chip 1
In the wafer process of manufacturing 2, the chip tool including the manufacturing lot, history and the like is printed on the surface of each semiconductor chip 12 on the semiconductor wafer 10 as the bar code 14 by the stamp tool 16.

More specifically, the bar code 14 is printed on a cover film such as a polyimide coat for relaxing the tension covering the surface of the semiconductor chip 12 and preventing scratches.

Thereafter, the semiconductor chip 12 is sealed with a resin mold 18, as shown in FIG. 3, for example. Reference numeral 20 in FIG. 3 indicates a lead terminal, and 22 indicates a bonding wire.

The information represented by the bar code 14 is
Specifically, the manufacturing lot number of the semiconductor wafer 10,
Wafer maker name, presence / absence of trouble in manufacturing process, history of initial value of leak current, presence / absence of appearance flaw, inspection result such as probe test result, and further information on position of the semiconductor chip 12 on the semiconductor wafer 10. To do.

In this case, the information printed or stamped on the surface of the resin mold 18 is deteriorated and becomes unclear, or the record of the semiconductor chip 12 is discarded due to the expiration of the storage period. Even if the semiconductor device 24 is unsealed and the barcode 14 printed on the semiconductor chip 12 is read, the above various information can be obtained.

Next, a second embodiment of the present invention shown in FIGS. 4 and 5 will be described.

In the second embodiment, the tape 26 on which various kinds of information similar to the above is previously printed is attached to each semiconductor chip 12,
The tape is applied by the tape applicator 28. The tape 26 is attached on the cover film as in the first embodiment.

As described above, the semiconductor chip 12 to which the tape 26 is attached can obtain information such as the history of the semiconductor chip 12 by opening the semiconductor device as in the case of the first embodiment. Therefore, it is possible to prevent the occurrence of defects in the manufacturing process of the semiconductor chip 12.

Further, for example, conventionally, there is a case where a collet is used in which the semiconductor chip is obliquely grasped so as not to damage the semiconductor chip.
Since the semiconductor chip 12 can be gripped by the ordinary flat collet without damaging it by sticking it to the required position, a special collet for obliquely gripping is unnecessary.

When the tape 26 is made of a conductive material such as aluminum, an electromagnetic shield effect can be obtained and the heat generated in the semiconductor chip can be made uniform and dispersed. At this time, if the tape 26 is attached in the vicinity of the output transistor, the uniform distribution of heat becomes more effective. In addition, the tape 26 made of a conductive material
By using, it is possible to prevent electrostatic charge that causes dielectric breakdown or induced charge.

In the printing of the bar code 14 in the first embodiment as well, by using a conductive ink or material, it is possible to similarly release the charge and increase the resistance to static electricity.

Further, in the first embodiment, when the bar code 14 is printed by using, for example, lead ink, it is possible to read predetermined information by X-ray from the outside without destroying the semiconductor device 24. .

In each of the above embodiments, various information is displayed by printing or tape sticking on the cover film such as the polyimide coat of the semiconductor chip, but the present invention is not limited to this. Alternatively, printing or tape attachment may be performed at any stage as long as it is a process before sealing the semiconductor chip with a resin mold or the like.

[Brief description of drawings]

FIG. 1 is a plan view showing a process of implementing an information display method on the surface of a semiconductor chip according to the present invention.

FIG. 2 is an enlarged plan view showing a part of the semiconductor chip of FIG.

FIG. 3 is a partial cross-sectional perspective view showing a semiconductor chip resin-molded.

FIG. 4 is a perspective view showing a process of carrying out the method of the second embodiment of the present invention.

FIG. 5 is an enlarged perspective view showing a semiconductor chip in the embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Semiconductor wafer 12 ... Semiconductor chip 14 ... Bar code 16 ... Stamp tool 18 ... Resin mold 20 ... Lead terminal 22 ... Bonding wire 24 ... Semiconductor device 26 ... Tape 28 ... Tape applicator

Claims (4)

[Claims] 1. A method of displaying information on the surface of a semiconductor chip, wherein chip information including a manufacturing lot and history of the semiconductor chip is added to the surface of the semiconductor chip in a step before sealing the semiconductor chip. 2. The information on the surface of a semiconductor chip according to claim 1, wherein the information is added by at least one of printing on the surface of the semiconductor chip and attaching a tape on which information is written. Display method. 3. The method for displaying information on the surface of a semiconductor chip according to claim 2, wherein the printing is performed using a conductive ink material. 4. The method for displaying information on the surface of a semiconductor chip according to claim 2, wherein the tape is made of a conductive material.