JP2002175956A - Semiconductor device and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a semiconductor device which can be automated in its subsequent steps by applying an identification symbol to a chip itself to provide mechanical identification by the symbol. SOLUTION: An identification code 4 is provided at a predetermined position of a semiconductor chip 1, and the chip 1 is sealed in a package so that the identification code 4 can be externally read out from outside of the package 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device and a method for manufacturing the same, and more particularly, to a semiconductor device having an identification code in itself and a method for manufacturing the same.

[0002]

2. Description of the Related Art A conventional semiconductor device does not have information for identifying the chip itself. If the identification information is not written on the chip, when the chip is mixed with another device, the chip cannot be distinguished from each other, and there is a possibility that the chip cannot be used. In order to prevent this, conventionally, information such as a type name is stamped on the back surface of the package, and the stamp is visually read by a person to judge the information. However, this method has a problem that automation cannot be performed, and the cost for stamping and identification is high. Further, there is another problem that dust generated at the time of stamping on the back surface of the package increases the defective rate of the product.

[0003]

As described above, in a conventional semiconductor device, since information for identifying the chip itself is not described, a distinction is made when the chip is mixed with a chip of another device. There was a problem that there was no. In order to prevent this, a method of stamping information such as a type name on the back of the package has been adopted. However, there is a problem that the identification must be performed visually by an operator, and the entire work cannot be automated. There were drawbacks. Further, dust generated at the time of stamping has also been a problem. The present invention
Resolving this problem in a relatively simple way and marking the chip itself with an identification symbol allows for mechanical identification,
It is an object of the present invention to realize a semiconductor device and a method for manufacturing the same, which enable automation of subsequent steps.

[0004]

According to the present invention, there is provided a semiconductor device, comprising: an identification code provided at a predetermined position of a semiconductor chip; and the identification code being readable from outside the package. Is enclosed in a package.

In the method of manufacturing a semiconductor device, there is provided an identification code forming step of forming an identification code at a predetermined position on a semiconductor chip. The identification code provided in the identification code forming step is read and reflected in the subsequent steps. It is characterized by the following. Accordingly, it is possible to implement a semiconductor device and a method of manufacturing the same, which can be mechanically identified by writing an identification symbol on the chip itself, thereby enabling automation of subsequent steps.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor device according to the present invention and a method for manufacturing the same will be described below in detail with reference to the accompanying drawings.

FIG. 1 is an external view of a solid-state imaging device according to an embodiment of the semiconductor device of the present invention. In FIG.
Denotes a chip (corresponding to an imaging surface), reference numeral 2 denotes a package, reference numeral 3 denotes a bonding wire, and reference numeral 4 denotes an identification code. In the present invention, in a wafer processing step, when a processing pattern such as etching is exposed on a resist of a semiconductor substrate by a step-type projection exposure apparatus (hereinafter abbreviated as a stepper), an identification code 4 is simultaneously placed on an outer peripheral portion of the chip 1. Write it down. Then, in the subsequent package assembling step and inspection step, the chip 1 is identified by recognizing the identification code 4, and the subsequent processing can be automated. As the identification code 4, for example, a bar code or the like can be used, but it is not necessarily limited thereto.

By writing the identification code 4 by exposure processing in the wafer processing step in this way, it is possible to eliminate the work of marking the back surface of the package, which has been conventionally performed by the operator, and to perform the operation from the earlier chip stage. Since the individual can be identified, it is possible to easily and quickly identify and classify even if a chip is mistakenly mixed with a chip of another device without manual operation.

Next, a method for embedding the identification code 4 using a stepper will be described. FIG. 2 is a schematic configuration diagram of a conventional stepper. In FIG.
Is a light source, reference numeral 12 is a reticle, reference numeral 13 is a condenser lens,
Reference numeral 14 denotes a wafer, and reference numeral 15 denotes a stage. An enlarged pattern several times larger than the pattern of the semiconductor element is formed on the reticle 12, and the light from the light source 11 is
And the pattern is condensed by the condenser lens 13 to the wafer 1.
Exposure is carried out by projecting the light onto the surface 4. The stepper repeatedly exposes the same pattern of the reticle 12 to the wafer 14 to form a large number of chip patterns on the wafer 14.
The projection position of the reticle 12 is moved and positioned on the wafer 14 by the movement of the stage 15 on which the wafer 14 is mounted, and the wafer 14 is also moved up and down by the stage 15 so that the exposure focus is determined. Can be

FIG. 3 is a schematic structural view of a stepper used in the present invention. In FIG. 3, reference numeral 11 denotes a light source, reference numeral 12 denotes a reticle, reference numeral 13 denotes a condenser lens, reference numeral 14 denotes a wafer, reference numeral 15 denotes a stage, reference numeral 16 denotes a reticle dedicated to an identification code, and reference numeral 17 denotes a connection bracket. For convenience,
In FIG. 3, components having the same functions as those in FIG. 2 are denoted by the same reference numerals. The present invention differs from the conventional one shown in FIG. 2 in that an identification code dedicated reticle 16 connected to a stage 15 by a connection fitting 17 is provided between a condenser lens 13 and a wafer 14.

The operation of embedding the identification code 4 in the chip 1 by the stepper will be described. First, light projected from the light source 11 passes through the reticle 12 and is focused by the focusing lens 13. Then, the light condensed by the condensing lens 13 passes through the reticle 16 dedicated to the identification code, and
To expose the resist on the wafer 14 to form a pattern on the wafer 14. The identification code corresponding to each chip 1 is written on the identification code dedicated reticle 16. Therefore, on the wafer 14,
The identification code pattern of the identification code dedicated reticle 16 is formed simultaneously with the pattern of the reticle 12.

Moving to the next shot, the stage 15 is moved to form a pattern on the reticle 12 at another location on the wafer 14. At this time, since the identification code dedicated reticle 16 is connected to the stage 15, it moves in the same direction as the stage 15, and the next identification code pattern is formed simultaneously with the pattern of the reticle 12. As a result, the identification code 4 corresponding to each chip 1 is described, and information on the chip can be read by reading the identification code. Therefore, the package 2 is transparent and the chip 1 can be read from outside the package 2 like a solid-state imaging device. If the identification code 4 on the front surface can be read, operations after chip dicing, die bonding, wire bonding, packaging, marking, inspection processes, and the like can be automated based on this information.

Although the above description has been made with respect to the solid-state imaging device, in semiconductor devices other than the solid-state imaging device, an identification code is written on the semiconductor chip, and the semiconductor chip is packaged so that the identification code can be read from the outside. In the semiconductor device encapsulated in the above, the processing can be automated similarly.

[0014]

As described above, according to the first aspect of the present invention, an identification code is provided at a predetermined position on a semiconductor chip.
A semiconductor device is constructed by enclosing a semiconductor chip in a package so that the identification code can be read from the outside. Thus, the chip information and the semiconductor device on which the chip is mounted can be identified by mechanically recognizing the chip information. Therefore, subsequent steps can be automated.

According to a second aspect of the present invention, a bar code is used as the identification code. As a result, existing identification methods and identification software can be used, and identification can be performed easily and inexpensively.

According to a third aspect of the present invention, in a method of manufacturing a semiconductor device, an identification code forming step of forming an identification code at a predetermined position of a semiconductor chip is provided, and the identification code provided here is read and the subsequent steps are performed. Reflect it in the process. Thus, a chip, that is, a semiconductor device can be identified by mechanically recognizing chip information, and a semiconductor device manufacturing method capable of automating subsequent steps can be realized.

According to a fourth aspect of the present invention, a bar code is used as the identification code. As a result, the existing identification method and identification software can be used, and a semiconductor device manufacturing method that can easily and inexpensively identify a semiconductor device can be realized.

[Brief description of the drawings]

FIG. 1 is an external view of a solid-state imaging device which is an embodiment of a semiconductor device of the present invention.

FIG. 2 is a schematic configuration diagram of a conventional step-type projection exposure apparatus.

FIG. 3 is a schematic configuration diagram of a step-type projection exposure apparatus of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Chip, 2 ... Package, 3 ... Bonding wire, 4 ... Identification code, 11 ... Light source, 12 ... Reticle, 1
3 ... Condenser lens, 14 ... Wafer, 15 ... Stage, 1
6: Reticle dedicated to identification code, 17: Connection bracket.

Claims (4)

[Claims] 1. A semiconductor device wherein an identification code is provided at a predetermined position on a semiconductor chip, and the semiconductor chip is sealed in a package so that the identification code can be read from outside the package. 2. The semiconductor device according to claim 1, wherein the identification code is a bar code. 3. A semiconductor device having an identification code forming step of forming an identification code at a predetermined position on a semiconductor chip, wherein the identification code provided in the identification code forming step is read and reflected in subsequent steps. Manufacturing method. 4. The method according to claim 3, wherein the identification code is a bar code.