JPH061918A - 紙質剥離用オルガノポリシロキサン組成物 - Google Patents
紙質剥離用オルガノポリシロキサン組成物Info
- Publication number
- JPH061918A JPH061918A JP5019157A JP1915793A JPH061918A JP H061918 A JPH061918 A JP H061918A JP 5019157 A JP5019157 A JP 5019157A JP 1915793 A JP1915793 A JP 1915793A JP H061918 A JPH061918 A JP H061918A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy
- composition
- paper
- peeling
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 41
- 239000000203 mixture Substances 0.000 title claims abstract description 35
- -1 alkenyl siloxane Chemical class 0.000 claims abstract description 39
- 239000004593 Epoxy Substances 0.000 claims abstract description 30
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000003054 catalyst Substances 0.000 claims abstract description 24
- 229910052990 silicon hydride Inorganic materials 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- 239000002683 reaction inhibitor Substances 0.000 claims abstract description 7
- 229920001187 thermosetting polymer Polymers 0.000 claims description 16
- 229910052697 platinum Inorganic materials 0.000 claims description 10
- 125000003700 epoxy group Chemical group 0.000 claims description 8
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical group C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 claims description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 abstract description 9
- 238000004873 anchoring Methods 0.000 abstract description 9
- 230000004044 response Effects 0.000 abstract description 8
- 238000001723 curing Methods 0.000 abstract description 5
- 230000007774 longterm Effects 0.000 abstract description 3
- 239000002904 solvent Substances 0.000 abstract description 2
- 238000013006 addition curing Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000008199 coating composition Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 7
- 229920002554 vinyl polymer Polymers 0.000 description 7
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 238000007259 addition reaction Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000011067 equilibration Methods 0.000 description 3
- 238000006459 hydrosilylation reaction Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- SLJFKNONPLNAPF-UHFFFAOYSA-N 3-Vinyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1C(C=C)CCC2OC21 SLJFKNONPLNAPF-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000005046 Chlorosilane Substances 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- TVJPBVNWVPUZBM-UHFFFAOYSA-N [diacetyloxy(methyl)silyl] acetate Chemical compound CC(=O)O[Si](C)(OC(C)=O)OC(C)=O TVJPBVNWVPUZBM-UHFFFAOYSA-N 0.000 description 2
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000007171 acid catalysis Methods 0.000 description 2
- 239000003377 acid catalyst Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229920005573 silicon-containing polymer Polymers 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- UHUUYVZLXJHWDV-UHFFFAOYSA-N trimethyl(methylsilyloxy)silane Chemical compound C[SiH2]O[Si](C)(C)C UHUUYVZLXJHWDV-UHFFFAOYSA-N 0.000 description 2
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- LSWYGACWGAICNM-UHFFFAOYSA-N 2-(prop-2-enoxymethyl)oxirane Chemical compound C=CCOCC1CO1 LSWYGACWGAICNM-UHFFFAOYSA-N 0.000 description 1
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- XAYDWGMOPRHLEP-UHFFFAOYSA-N 6-ethenyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1CCCC2OC21C=C XAYDWGMOPRHLEP-UHFFFAOYSA-N 0.000 description 1
- 101100110026 Danio rerio ascl1b gene Proteins 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229920003354 Modic® Polymers 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- MFIBZDZRPYQXOM-UHFFFAOYSA-N [dimethyl-[3-(oxiran-2-ylmethoxy)propyl]silyl]oxy-dimethyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound C1OC1COCCC[Si](C)(C)O[Si](C)(C)CCCOCC1CO1 MFIBZDZRPYQXOM-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000013005 condensation curing Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- JBSLOWBPDRZSMB-FPLPWBNLSA-N dibutyl (z)-but-2-enedioate Chemical compound CCCCOC(=O)\C=C/C(=O)OCCCC JBSLOWBPDRZSMB-FPLPWBNLSA-N 0.000 description 1
- STRNXFOUBFLVIN-UHFFFAOYSA-N diethyl but-2-ynedioate Chemical compound CCOC(=O)C#CC(=O)OCC STRNXFOUBFLVIN-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 239000012632 extractable Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000009965 odorless effect Effects 0.000 description 1
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 description 1
- 229920001558 organosilicon polymer Polymers 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Adhesive Tapes (AREA)
- Paper (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US83318092A | 1992-02-10 | 1992-02-10 | |
| US833180 | 1992-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH061918A true JPH061918A (ja) | 1994-01-11 |
Family
ID=25263677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5019157A Withdrawn JPH061918A (ja) | 1992-02-10 | 1993-02-08 | 紙質剥離用オルガノポリシロキサン組成物 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0556023A1 (Direct) |
| JP (1) | JPH061918A (Direct) |
| KR (1) | KR930017980A (Direct) |
| CA (1) | CA2087766A1 (Direct) |
| FI (1) | FI930554L (Direct) |
| TW (1) | TW198054B (Direct) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997029723A1 (en) * | 1996-02-14 | 1997-08-21 | Nitto Denko Corporation | Item-packaging sheet for sanitary napkins and sanitary napkins packaged in said sheet |
| JPH11172197A (ja) * | 1997-09-30 | 1999-06-29 | General Electric Co <Ge> | 印刷適性のある紙剥離組成物 |
| JP2006213816A (ja) * | 2005-02-03 | 2006-08-17 | Ge Toshiba Silicones Co Ltd | 剥離性硬化皮膜形成用シリコーン組成物 |
| CN1923939A (zh) * | 1996-10-08 | 2007-03-07 | 日立化成工业株式会社 | 半导体装置、粘合剂和粘合膜 |
| JP2008127415A (ja) * | 2006-11-17 | 2008-06-05 | Shin Etsu Chem Co Ltd | 押し出し成型用シリコーンゴム組成物及びその製造方法 |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE50103601D1 (de) | 2000-07-22 | 2004-10-21 | Goldschmidt Ag Th | Hitzestabile, korrosionsinhibierende Polyorganosiloxanharze |
| FR2903112A1 (fr) | 2006-06-29 | 2008-01-04 | Rhodia Recherches & Tech | Composition silicone reticulable pour la realisation de revetements anti-adherents pour supports souples et additif promoteur d'accrochage contenu dans cette composition |
| GB0616021D0 (en) | 2006-08-14 | 2006-09-20 | Dow Corning | Silicone release coating compositions |
| CN105517534A (zh) * | 2013-07-11 | 2016-04-20 | 莫门蒂夫性能材料股份有限公司 | 双模式固化有机硅组合物 |
| CN110382645B (zh) | 2016-12-23 | 2021-07-09 | 陶氏（上海）投资有限公司 | 聚有机硅氧烷离型涂层以及其制备方法和用途 |
| CN111032604B (zh) | 2017-10-19 | 2020-10-30 | 美国陶氏有机硅公司 | 含有可用作氢化硅烷化反应抑制剂的2-取代的-1-炔基-1-环己醇的聚有机硅氧烷组合物 |
| EP3645651B1 (en) | 2017-10-19 | 2023-09-06 | Dow Silicones Corporation | A method for fabricating a flexible organic light emitting diode using a pressure sensitive adhesive composition |
| CN113166418A (zh) | 2018-12-21 | 2021-07-23 | 美国陶氏有机硅公司 | 用于制备官能化聚有机硅氧烷的方法 |
| KR102861859B1 (ko) | 2018-12-21 | 2025-09-22 | 다우 실리콘즈 코포레이션 | 다작용성 유기실록산의 제조 방법 및 이를 함유하는 조성물 |
| EP3898776B1 (en) | 2018-12-21 | 2023-03-01 | Dow Silicones Corporation | Polyfunctional organosiloxanes, compositions containing same, and methods for the preparation thereof |
| WO2020131366A1 (en) | 2018-12-21 | 2020-06-25 | Dow Silicones Corporation | Polyfunctional organosiloxanes, compositions containing same, and methods for the preparation thereof |
| CN113795539B (zh) | 2019-05-16 | 2023-08-04 | 美国陶氏有机硅公司 | 聚硅氧烷受控剥离添加剂、其制备方法及剥离涂料组合物 |
| US20220315798A1 (en) | 2019-08-22 | 2022-10-06 | Dow Silicones Corporation | Polyorganosiloxane release coating composition |
| US12163049B2 (en) | 2019-09-26 | 2024-12-10 | Dow Silicones Corporation | Silicone release coating composition and methods for the preparation and use of same |
| KR102861865B1 (ko) | 2019-10-30 | 2025-09-22 | 다우 실리콘즈 코포레이션 | 무용매형 폴리오가노실록산 펠릿 및 이의 제조 공정 및 용도 |
| EP4051748A4 (en) | 2019-10-31 | 2023-08-16 | Dow Silicones Corporation | SILICIONE-BASED PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND METHODS OF PREPARING AND USING IT |
| WO2021113058A1 (en) | 2019-12-02 | 2021-06-10 | Dow Silicones Corporation | Composition for preparing a release coating |
| WO2021113321A1 (en) | 2019-12-02 | 2021-06-10 | Dow Silicones Corporation | Composition for preparing a release coating |
| US12497549B2 (en) | 2019-12-02 | 2025-12-16 | Dow Silicones Corporation | Composition for preparing a release coating |
| CN113207295B (zh) | 2019-12-02 | 2022-06-03 | 美国陶氏有机硅公司 | 用于制备防粘涂料的组合物 |
| EP4085116A1 (en) | 2019-12-30 | 2022-11-09 | Dow Silicones Corporation | Pressure sensitive adhesive composition |
| WO2021138152A1 (en) | 2019-12-30 | 2021-07-08 | Dow Silicones Corporation | Composition for preparing a release coating, release coating composition, and related methods |
| EP4085113A1 (en) | 2019-12-30 | 2022-11-09 | Dow Silicones Corporation | Composition for preparing a release coating, release coating composition, and related methods |
| JP7029001B2 (ja) | 2020-01-15 | 2022-03-02 | ダウ シリコーンズ コーポレーション | シリコーン感圧接着剤組成物並びにその調製方法及びその使用 |
| JP2023530836A (ja) | 2020-06-22 | 2023-07-20 | ダウ シリコーンズ コーポレーション | 低強度放射線硬化性シリコーン剥離コーティング組成物並びにその調製及び使用のための方法 |
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| KR20240026214A (ko) | 2022-03-30 | 2024-02-27 | 다우 실리콘즈 코포레이션 | 실리콘 감압성 접착제용 경화성 조성물 |
| WO2024006430A1 (en) | 2022-06-30 | 2024-01-04 | Dow Silicones Corporation | Composition for preparing a release coating |
| KR20250111330A (ko) | 2022-11-23 | 2025-07-22 | 다우 실리콘즈 코포레이션 | 이형 코팅 제조용 조성물 및 코팅된 기재의 제조 방법 |
| TW202523744A (zh) * | 2023-12-12 | 2025-06-16 | 美商陶氏有機矽公司 | 穩定之環氧聚矽氧 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4256870A (en) * | 1979-05-17 | 1981-03-17 | General Electric Company | Solventless release compositions, methods and articles of manufacture |
| JPH0279852A (ja) * | 1988-09-16 | 1990-03-20 | Fuji Photo Film Co Ltd | 湿し水不要感光性平版印刷版 |
-
1992
- 1992-04-13 TW TW081102860A patent/TW198054B/zh active
-
1993
- 1993-01-21 CA CA002087766A patent/CA2087766A1/en not_active Abandoned
- 1993-02-08 JP JP5019157A patent/JPH061918A/ja not_active Withdrawn
- 1993-02-09 EP EP93300937A patent/EP0556023A1/en not_active Withdrawn
- 1993-02-09 KR KR1019930001732A patent/KR930017980A/ko not_active Withdrawn
- 1993-02-09 FI FI930554A patent/FI930554L/fi not_active Application Discontinuation
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997029723A1 (en) * | 1996-02-14 | 1997-08-21 | Nitto Denko Corporation | Item-packaging sheet for sanitary napkins and sanitary napkins packaged in said sheet |
| CN1923939A (zh) * | 1996-10-08 | 2007-03-07 | 日立化成工业株式会社 | 半导体装置、粘合剂和粘合膜 |
| CN1923939B (zh) | 1996-10-08 | 2012-12-12 | 日立化成工业株式会社 | 半导体装置、粘合剂和粘合膜 |
| JPH11172197A (ja) * | 1997-09-30 | 1999-06-29 | General Electric Co <Ge> | 印刷適性のある紙剥離組成物 |
| JP2006213816A (ja) * | 2005-02-03 | 2006-08-17 | Ge Toshiba Silicones Co Ltd | 剥離性硬化皮膜形成用シリコーン組成物 |
| JP2008127415A (ja) * | 2006-11-17 | 2008-06-05 | Shin Etsu Chem Co Ltd | 押し出し成型用シリコーンゴム組成物及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| FI930554A7 (fi) | 1993-08-11 |
| KR930017980A (ko) | 1993-09-21 |
| TW198054B (Direct) | 1993-01-11 |
| FI930554L (fi) | 1993-08-11 |
| EP0556023A1 (en) | 1993-08-18 |
| CA2087766A1 (en) | 1993-08-11 |
| FI930554A0 (fi) | 1993-02-09 |
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