JPH06187673A - Stamper for producing optical disk and its production - Google Patents

Stamper for producing optical disk and its production

Info

Publication number
JPH06187673A
JPH06187673A JP33570792A JP33570792A JPH06187673A JP H06187673 A JPH06187673 A JP H06187673A JP 33570792 A JP33570792 A JP 33570792A JP 33570792 A JP33570792 A JP 33570792A JP H06187673 A JPH06187673 A JP H06187673A
Authority
JP
Japan
Prior art keywords
layer
stamper
electroforming
manufacturing
hardness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33570792A
Other languages
Japanese (ja)
Inventor
Toshiyuki Muto
敏之 武藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP33570792A priority Critical patent/JPH06187673A/en
Publication of JPH06187673A publication Critical patent/JPH06187673A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/263Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
    • B29C45/2632Stampers; Mountings thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

PURPOSE:To prevent foreign matter such as dust from affecting the front side of a stamper even if the foreign matter gets between the rear side of the stamper and a metal mold. CONSTITUTION:A three-layered structure consisting of 1st, 2nd and 3rd layers 2, 3, 4 of materials different from each other in hardness from the surface is imparted to a stamper 1. The material of the 2nd layer 3 is harder than that of the 3rd layer 4. When the stamper 1 is fitted to a molding machine, even if foreign matter gets between the rear side of the stamper 1 and a metal mold on the fitting side, the relatively soft 3rd layer 4 absorbs the foreign matter, the relatively hard 2nd layer 3 acts as a barrier and the foreign matter is prevented from affecting the 1st layer 2 or the front side of the stamper 1 without considerably increasing the thickness of the stamper 1.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、光ディスク製造用スタ
ンパ及びその製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stamper for manufacturing an optical disk and a manufacturing method thereof.

【0002】[0002]

【従来の技術】一般に、この種のスタンパはニッケルな
どの単一材質により形成されている。その製造工程の概
略を説明すると、まず、露光・現像の終了したガラス原
盤上に表面導電処理(ニッケルスパッタ)を行って、ニ
ッケル膜を形成する。次いで、ニッケル電鋳によりスタ
ンパの厚さが数100μm程度まで厚くなるようにす
る。この後、裏面の鏡面研磨工程、ガラス原盤剥離工
程、レジスト除去工程、外径・内径のカット工程を経る
ことにより、光ディスク製造用スタンパが完成するとい
うものである。
2. Description of the Related Art Generally, this type of stamper is made of a single material such as nickel. Explaining the outline of the manufacturing process, first, a surface conductive treatment (nickel sputtering) is performed on a glass master after exposure and development to form a nickel film. Then, the thickness of the stamper is increased to about several 100 μm by nickel electroforming. After that, a mirror polishing step on the back surface, a glass master disc removing step, a resist removing step, and an outer diameter / inner diameter cutting step are performed to complete an optical disk manufacturing stamper.

【0003】[0003]

【発明が解決しようとする課題】ところが、このような
スタンパによる場合、射出成形において、スタンパ裏面
とスタンパ取付け側金型との間に埃やごみなどの異物が
入り込み、スタンパ表面にその影響が現れることがあ
る。
However, in the case of using such a stamper, in injection molding, foreign matters such as dust and dust enter between the stamper rear surface and the stamper mounting side mold, and the influence appears on the stamper surface. Sometimes.

【0004】一般に、スタンパに比べ、金型は硬いの
で、ごみなどの異物はスタンパ側の射出成形時の圧力で
めり込んでしまう。ここに、スタンパが充分に厚い場合
はスタンパ表面への影響は無視し得るが、一般的である
数100μm程度の厚さのスタンパの場合にはスタンパ
表面が凸状に変形してしまうことがある。このようなス
タンパの変形は、製造されるべきディスクの製品不良を
生ずるだけでなく、スタンパ自体が使えなくなってしま
う不都合を生ずる。
Generally, since the mold is harder than the stamper, foreign matters such as dust are caught by the pressure at the time of injection molding on the stamper side. Here, when the stamper is sufficiently thick, the influence on the stamper surface can be ignored, but in the case of a typical stamper having a thickness of about several hundreds of μm, the stamper surface may be deformed into a convex shape. . Such deformation of the stamper not only causes a product defect of the disk to be manufactured, but also causes a problem that the stamper itself cannot be used.

【0005】[0005]

【課題を解決するための手段】請求項1記載の発明で
は、硬さの異なる材質による第1層、第2層及び第3層
をスタンパ表面側から順に備えて少なくとも前記第2層
を前記第3層より硬い材質により形成した3層構造より
なるスタンパとした。
According to a first aspect of the present invention, a first layer, a second layer, and a third layer made of materials having different hardness are sequentially provided from the stamper surface side, and at least the second layer is provided. The stamper has a three-layer structure formed of a material harder than the three layers.

【0006】この際、請求項2記載の発明では、第2層
を、ビッカース硬度が300〜400Hv範囲内の光沢
ニッケルにより形成し、請求項3記載の発明では、第3
層を、ビッカース硬度が100〜150Hv範囲内の純
銅により形成し、請求項4記載の発明では、第3層の硬
さを、取付け側金型の硬さに対して充分に小さくした。
In this case, in the second aspect of the invention, the second layer is formed of bright nickel having a Vickers hardness in the range of 300 to 400 Hv, and in the third aspect of the invention.
The layer is made of pure copper having a Vickers hardness in the range of 100 to 150 Hv, and in the invention according to claim 4, the hardness of the third layer is made sufficiently smaller than the hardness of the mounting side die.

【0007】このような光ディスク製造用スタンパの製
造方法として、請求項5記載の発明では、硬さの異なる
3種類の電鋳液を順次用いた3段階の電鋳工程により、
第1層、第2層及び第3層をスタンパ表面側から順に備
えて少なくとも前記第2層が前記第3層より硬い材質の
3層構造の光ディスク製造用スタンパを製造するように
した。
As a method of manufacturing such a stamper for manufacturing an optical disk, in the invention according to claim 5, a three-step electroforming process in which three kinds of electroforming liquids having different hardness are sequentially used,
The first layer, the second layer, and the third layer are sequentially provided from the front surface side of the stamper to manufacture a stamper for manufacturing an optical disc having a three-layer structure in which at least the second layer is harder than the third layer.

【0008】この際、請求項6記載の発明では、3段階
の電鋳工程の終了後にガラス原盤を剥離するようにし
た。
At this time, in the invention according to claim 6, the glass master is peeled off after the completion of the three-step electroforming process.

【0009】また、請求項7記載の発明では、第1層用
の電鋳工程と第2層用の電鋳工程との間にスタンパ裏面
に対する鏡面研磨工程を有するようにした。
According to the seventh aspect of the invention, a mirror polishing step for the back surface of the stamper is provided between the electroforming step for the first layer and the electroforming step for the second layer.

【0010】[0010]

【作用】請求項1記載の発明においては、硬さの異なる
材質からなる3層構造であって、スタンパ裏面側の第3
層よりも中間層である第2層のほうが硬いので、スタン
パ裏面と取付け側金型との間に異物がはさまっても軟ら
かめの第3層が異物を吸収し、硬めの第2層が障壁とな
るので、スタンパ厚さをそれ程厚くしなくても第1層な
いしは表面への影響を極力防止し得るものとなり、スタ
ンパ不良を軽減できる。
According to the first aspect of the present invention, there is provided a three-layer structure made of materials having different hardness, the third layer on the back side of the stamper.
Since the second layer, which is the intermediate layer, is harder than the layer, even if foreign matter is caught between the back surface of the stamper and the mold on the mounting side, the softer third layer absorbs the foreign matter and the harder second layer acts as a barrier. Therefore, the influence on the first layer or the surface can be prevented as much as possible without increasing the thickness of the stamper, and the stamper failure can be reduced.

【0011】請求項2記載の発明においては、硬めとす
る第2層をビッカース硬度が300〜400Hv範囲内
の光沢ニッケルにより形成することにより、一般的なニ
ッケルスタンパの製造工程を利用しながら充分硬質な層
とすることができる。
According to the second aspect of the present invention, the second layer to be made hard is formed of bright nickel having a Vickers hardness in the range of 300 to 400 Hv, so that it is sufficiently hard while utilizing a general nickel stamper manufacturing process. Can be any layer.

【0012】請求項3記載の発明においては、裏面に位
置する第3層をビッカース硬度が100〜150Hv範
囲内の純銅により形成することにより、一般的なニッケ
ルスタンパの場合のように電鋳工程を利用でき、かつ、
充分な軟質の層が得られ、さらには、熱伝導率が高いの
でスタンパ‐金型間の温度調節もスムーズとなる。
According to the third aspect of the present invention, the third layer located on the back surface is formed of pure copper having a Vickers hardness in the range of 100 to 150 Hv, so that the electroforming step is performed as in a general nickel stamper. Available and
A sufficiently soft layer can be obtained, and since the thermal conductivity is high, the temperature control between the stamper and the mold becomes smooth.

【0013】請求項4記載の発明においては、裏面に位
置する第3層の硬さが取付け側金型の硬さに対して充分
に小さいので、金型に傷がつきにくく金型の寿命が伸び
るものとなる。
In the invention according to claim 4, since the hardness of the third layer located on the back surface is sufficiently smaller than the hardness of the mounting side die, the die is less likely to be damaged and the life of the die is reduced. It will grow.

【0014】請求項5記載の発明においては、3種類の
電鋳液を順次用いた3段階の電鋳工程で3層構造のスタ
ンパを製造することにより、電鋳浴への電極の取付け部
分などを共通化することができ、低コストかつ高効率で
製造できる。
According to the fifth aspect of the invention, a stamper having a three-layer structure is manufactured by a three-step electroforming process in which three kinds of electroforming liquids are sequentially used, so that an electrode mounting portion for an electroforming bath, etc. Can be standardized, and can be manufactured at low cost and with high efficiency.

【0015】請求項6記載の発明においては、3段階の
電鋳工程途中ではガラス原盤を剥離しないので、スタン
パ表面に対する異物の混入を防止できる。
According to the sixth aspect of the invention, since the glass master is not peeled off during the electroforming process of three steps, it is possible to prevent foreign matter from entering the surface of the stamper.

【0016】請求項7記載の発明においては、第1層用
の電鋳工程と第2層用の電鋳工程との間にスタンパ裏面
に対する鏡面研磨工程を有するので、第1層と第2層と
の界面が平坦となり、より平滑性に優れたスタンパを製
造し得るものとなる。
According to the invention of claim 7, there is a mirror polishing step for the back surface of the stamper between the electroforming step for the first layer and the electroforming step for the second layer. Therefore, the first layer and the second layer are formed. The interface with and becomes flat, and a stamper with more excellent smoothness can be manufactured.

【0017】[0017]

【実施例】本発明の一実施例を図面に基づいて説明す
る。本実施例の光ディスク製造用のスタンパ1は、基本
的には、図1に示すような第1層2と第2層3と第3層
4とを順に積層形成した3層構造からなる。ここに、第
1層2側がスタンパ表面となるもので、第1層2表面に
転写用の微小凹凸5が形成されている。このような3層
構造において、本実施例では、各層2,3,4を各々硬
さの異なる材質により形成するとともに、その硬さを第
2層3>第1層2>第3層4なる大小関係に設定したも
のである。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings. The stamper 1 for manufacturing an optical disk according to the present embodiment basically has a three-layer structure in which a first layer 2, a second layer 3 and a third layer 4 are sequentially laminated as shown in FIG. Here, the stamper surface is on the side of the first layer 2, and the minute irregularities 5 for transfer are formed on the surface of the first layer 2. In such a three-layer structure, in this embodiment, each of the layers 2, 3 and 4 is formed of a material having different hardness, and the hardness is as follows: second layer 3> first layer 2> third layer 4. It is set to a size relationship.

【0018】より具体的には、第1層2はビッカース硬
度が200〜300Hv範囲のニッケル材質、第2層3
はビッカース硬度が300〜400Hv範囲の光沢ニッ
ケル材質、第3層4はビッカース硬度が100〜150
Hv範囲の純銅材質により形成される。第2層3用の光
沢ニッケルは、ニッケルに不純物を混ぜたものであり、
様々なバリエーションが得られる。また、第3層4用の
銅は、ニッケルに比べ軟らかく、かつ、ニッケル同様に
電鋳で形成できる。なお、第3層4の硬度は金型が傷つ
かないように金型の硬度に対して充分に小さい(軟らか
い)ものでなければならない。
More specifically, the first layer 2 is made of a nickel material having a Vickers hardness of 200 to 300 Hv, and the second layer 3 is made of nickel.
Is a bright nickel material having a Vickers hardness of 300 to 400 Hv, and the third layer 4 has a Vickers hardness of 100 to 150.
It is made of pure copper material in the Hv range. The bright nickel for the second layer 3 is a mixture of nickel and impurities,
Various variations can be obtained. Further, the copper for the third layer 4 is softer than nickel and can be formed by electroforming like nickel. The hardness of the third layer 4 must be sufficiently small (soft) with respect to the hardness of the mold so as not to damage the mold.

【0019】このような硬度分布を持たせた3層構造の
スタンパ1によれば、異物混入に対してその影響を受け
にくい利点を持つ。その原理を図2に示す。スタンパ1
は裏面側なる第3層4を成形機の取付け側金型6上に取
付けて射出成形による光ディスク製造に供されるが、取
付け側金型6上に取付ける際に図2(a)に示すように
スタンパ1との間にごみなどの異物7が入り込んだとし
ても、図2(b)に示すように、硬い第2層3の下部に
軟らかい第3層4が存在してこの第3層4中に取込み吸
収されることになる。図中の矢印は取込み吸収時に生ず
る歪方向を示す。よって、スタンパ1を通常の厚さ程度
のものとしても、第1層2ないしは微小凹凸5を有する
その表面が異物7の影響によって凸状に変形するような
ことが殆どなくなる。
The stamper 1 having a three-layer structure having such hardness distribution has an advantage that it is hardly affected by foreign matter. The principle is shown in FIG. Stamper 1
The third layer 4 on the back side is mounted on the mounting side mold 6 of the molding machine to be used for optical disk production by injection molding. When mounting on the mounting side mold 6, as shown in FIG. Even if a foreign matter 7 such as dust enters between the stamper 1 and the stamper 1, a soft third layer 4 exists under the hard second layer 3 as shown in FIG. It will be taken in and absorbed inside. The arrow in the figure indicates the strain direction that occurs during uptake and absorption. Therefore, even if the stamper 1 has a normal thickness, the surface of the first layer 2 or the fine irregularities 5 is hardly deformed into a convex shape due to the influence of the foreign matter 7.

【0020】ところで、このようなスタンパ1の製造方
法について、図3及び図4を参照して説明する。従来の
ニッケルスタンパの場合であれば、基本的にはニッケル
電鋳工程を主体とするが、本実施例のスタンパ1を製造
する上では、光沢ニッケル電鋳工程、銅電鋳工程とを加
えた3段階の電鋳工程を経て製造される。
A method of manufacturing the stamper 1 will be described with reference to FIGS. 3 and 4. In the case of the conventional nickel stamper, the nickel electroforming process is basically the main component, but in producing the stamper 1 of this embodiment, a bright nickel electroforming process and a copper electroforming process were added. It is manufactured through a three-step electroforming process.

【0021】まず、図3(a)に示すように露光・現像
が完了してレジスト8により微小凹凸9が形成されたガ
ラス原盤10を用意する。次いで、同図(b)に示すよ
うに、ガラス原盤10の現像面上にニッケルスパッタに
よるニッケル膜11を形成する表面導電処理を行う。次
に、同図(c)に示すように、ニッケル電鋳液を用いて
ニッケル電鋳工程を行い、ニッケルによる第1層2を形
成する。第1層2の形成後、同図(d)に示すように、
第1層2の裏面側に対して光沢ニッケル電鋳工程を行
い、光沢ニッケルによる第2層3を形成する。この際、
第1層2が導電層として用いられる。また、光沢ニッケ
ル電鋳は、ニッケル電鋳浴に各種有機光沢剤を混入させ
て行えばよい。光沢ニッケルは、一般論として、結晶が
細かく硬度が増す特性を持つ。第2層3の形成後、同図
(e)に示すように、第2層3の裏面側に対して銅電鋳
工程を行い、純銅による第3層4を形成する。
First, as shown in FIG. 3A, there is prepared a glass master disk 10 on which exposure / development has been completed and fine irregularities 9 have been formed by the resist 8. Next, as shown in FIG. 3B, a surface conductive treatment is performed to form a nickel film 11 by nickel sputtering on the developing surface of the glass master 10. Next, as shown in FIG. 3C, a nickel electroforming process is performed using a nickel electroforming solution to form the first layer 2 of nickel. After forming the first layer 2, as shown in FIG.
A bright nickel electroforming process is performed on the back surface side of the first layer 2 to form the second layer 3 of bright nickel. On this occasion,
The first layer 2 is used as a conductive layer. The bright nickel electroforming may be performed by mixing various organic brightening agents in a nickel electroforming bath. As a general theory, bright nickel has characteristics that the crystals are fine and the hardness increases. After the second layer 3 is formed, a copper electroforming step is performed on the back surface side of the second layer 3 to form the third layer 4 of pure copper, as shown in FIG.

【0022】この後、スタンパ1の裏面に対する研磨工
程を行い、同図(f)に示すようにガラス原盤10及び
レジストの剥離工程を行い、最後に、スタンパ1の外径
・内径カット工程を行うことで、図1に示したような3
層構造のスタンパ1が完成する。即ち、基本的には3段
階の電鋳工程を順次行うことで形成されるので、電鋳浴
への電極の取付け部分などを共通化することができ、低
コストにて製造できる。また、各電鋳工程の途中ではガ
ラス原盤10の剥離を行わず、最終工程にてガラス原盤
10の剥離を行うので、表面側に異物等が入り込むのが
極力防止される。即ち、後工程で裏面の鏡面研磨を行う
際に、スタンパ表面に欠陥発生の原因となる研磨剤など
の異物が入り込まないようにするため、最後までガラス
原盤10を密着させておくほうがよいからである。
After that, a polishing process is performed on the back surface of the stamper 1, a glass master 10 and a resist peeling process are performed as shown in FIG. 3F, and finally, an outer diameter / inner diameter cutting process of the stamper 1 is performed. Therefore, as shown in FIG.
The layered stamper 1 is completed. That is, since it is basically formed by sequentially performing the three-step electroforming process, it is possible to share the electrode mounting portion and the like to the electroforming bath and to manufacture at low cost. Further, since the glass master 10 is not peeled off in the middle of each electroforming step, and the glass master 10 is peeled off in the final step, it is possible to prevent foreign matters and the like from entering the surface side as much as possible. That is, when mirror-polishing the back surface in a later step, it is better to keep the glass master 10 in close contact until the end in order to prevent foreign substances such as abrasives that cause defects from entering the stamper surface. is there.

【0023】なお、ニッケル電鋳工程と光沢ニッケル電
鋳工程との間に、その段階でのスタンパ裏面(第1層裏
面)に対する鏡面研磨工程を付加すれば、形成される第
1層2と第2層3との界面が極めて平坦になるので、よ
り平坦性に優れたスタンパ1が得られるものとなる。
If a mirror polishing step for the back surface of the stamper (back surface of the first layer) at that stage is added between the nickel electroforming step and the bright nickel electroforming step, the first layer 2 and the second layer to be formed will be formed. Since the interface with the two layers 3 becomes extremely flat, the stamper 1 having more excellent flatness can be obtained.

【0024】[0024]

【発明の効果】請求項1記載の発明によれば、硬さの異
なる材質からなる3層構造であって、スタンパ裏面側の
第3層よりも中間層である第2層のほうが硬いスタンパ
構造としたので、スタンパ裏面と取付け側金型との間に
異物がはさまっても軟らかめの第3層が異物を吸収し、
硬めの第2層が障壁となるため、スタンパ厚さをそれ程
厚くしなくても第1層ないしは表面への影響を極力防止
することができ、スタンパ不良の発生を軽減できる。
According to the first aspect of the invention, the stamper structure has a three-layer structure made of materials having different hardness, and the second layer which is the intermediate layer is harder than the third layer on the back side of the stamper. Therefore, even if foreign matter is caught between the back surface of the stamper and the mold on the mounting side, the soft third layer absorbs the foreign matter,
Since the harder second layer serves as a barrier, the influence on the first layer or the surface can be prevented as much as possible without increasing the stamper thickness, and the occurrence of stamper failure can be reduced.

【0025】請求項2記載の発明によれば、硬めとする
第2層をビッカース硬度が300〜400Hv範囲内の
光沢ニッケルにより形成したので、一般的にニッケルス
タンパの製造工程を利用しながら充分硬質な層とするこ
とができる。
According to the second aspect of the present invention, since the second layer to be hardened is made of bright nickel having a Vickers hardness of 300 to 400 Hv, it is generally sufficiently hard while utilizing the nickel stamper manufacturing process. Can be any layer.

【0026】請求項3記載の発明によれば、裏面に位置
する第3層をビッカース硬度が100〜150Hv範囲
内の純銅により形成したので、一般的なニッケルスタン
パの場合のように電鋳工程を利用でき、かつ、充分な軟
質の層が得られるとともに、熱伝導率が高いのでスタン
パ‐金型間の温度調節もスムーズとなる。
According to the third aspect of the present invention, the third layer located on the back surface is formed of pure copper having a Vickers hardness of 100 to 150 Hv. Therefore, the electroforming step is performed as in the case of a general nickel stamper. A layer that can be used and is sufficiently soft is obtained, and since the thermal conductivity is high, the temperature control between the stamper and the mold becomes smooth.

【0027】請求項4記載の発明によれば、裏面に位置
する第3層の硬さを取付け側金型の硬さに対して充分に
小さくしたので、金型に傷がつきにくく金型の寿命を伸
ばすことができる。
According to the invention of claim 4, since the hardness of the third layer located on the back surface is made sufficiently smaller than the hardness of the die on the mounting side, the die is less likely to be scratched. The life can be extended.

【0028】請求項5記載の発明によれば、3種類の電
鋳液を順次用いた3段階の電鋳工程で3層構造のスタン
パを製造するようにしたので、電鋳浴への電極の取付け
部分などを共通化することができ、低コストかつ高効率
で製造することができる。
According to the fifth aspect of the invention, the stamper having a three-layer structure is manufactured by a three-step electroforming process in which three kinds of electroforming liquids are sequentially used. The mounting portion and the like can be made common, and the manufacturing can be performed at low cost and with high efficiency.

【0029】請求項6記載の発明によれば、3段階の電
鋳工程途中ではガラス原版を剥離しないようにしたの
で、スタンパ表面に対する異物の混入を防止して、欠陥
の発生を極力軽減することができる。
According to the sixth aspect of the invention, since the glass original plate is not peeled off during the three-step electroforming process, foreign matter is prevented from entering the stamper surface and the occurrence of defects is reduced as much as possible. You can

【0030】請求項7記載の発明によれば、第1層用の
電鋳工程と第2層用の電鋳工程との間にスタンパ裏面に
対する鏡面研磨工程を付加したので、第1層と第2層と
の界面が平坦となり、より平滑性に優れたスタンパを製
造することができる。
According to the invention of claim 7, a mirror polishing step for the back surface of the stamper is added between the electroforming step for the first layer and the electroforming step for the second layer. The interface with the two layers becomes flat, and a stamper having more excellent smoothness can be manufactured.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示すスタンパの断面構造図
である。
FIG. 1 is a sectional structural view of a stamper showing an embodiment of the present invention.

【図2】異物混入に対する効果を原理的に示す断面構造
図である。
FIG. 2 is a cross-sectional structural view showing the principle of the effect of foreign matter mixing.

【図3】スタンパ製造工程を順に示す断面図である。FIG. 3 is a cross-sectional view showing a stamper manufacturing process in order.

【図4】製造工程を順に示すブロック図である。FIG. 4 is a block diagram sequentially showing a manufacturing process.

【符号の説明】[Explanation of symbols]

1 スタンパ 2 第1層 3 第2層 4 第3層 6 取付け側金型 10 ガラス原盤 1 Stamper 2 1st Layer 3 2nd Layer 4 3rd Layer 6 Mounting Side Mold 10 Glass Master

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】 硬さの異なる材質による第1層、第2層
及び第3層をスタンパ表面側から順に備えて少なくとも
前記第2層を前記第3層より硬い材質により形成した3
層構造よりなることを特徴とする光ディスク製造用スタ
ンパ。
1. A first layer, a second layer, and a third layer made of materials having different hardness are provided in order from the stamper surface side, and at least the second layer is made of a material harder than the third layer.
A stamper for manufacturing an optical disc, which has a layered structure.
【請求項2】 第2層を、ビッカース硬度が300〜4
00Hv範囲内の光沢ニッケルにより形成したことを特
徴とする請求項1記載の光ディスク製造用スタンパ。
2. The second layer has a Vickers hardness of 300 to 4
The stamper for manufacturing an optical disc according to claim 1, wherein the stamper is formed of bright nickel within a range of 00Hv.
【請求項3】 第3層を、ビッカース硬度が100〜1
50Hv範囲内の純銅により形成したことを特徴とする
請求項1又は2記載の光ディスク製造用スタンパ。
3. The third layer has a Vickers hardness of 100-1.
The stamper for manufacturing an optical disk according to claim 1 or 2, wherein the stamper is made of pure copper within a range of 50 Hv.
【請求項4】 第3層の硬さを、取付け側金型の硬さに
対して充分に小さくしたことを特徴とする請求項1記載
の光ディスク製造用スタンパ。
4. The stamper for manufacturing an optical disk according to claim 1, wherein the hardness of the third layer is made sufficiently smaller than the hardness of the mounting die.
【請求項5】 硬さの異なる3種類の電鋳液を順次用い
た3段階の電鋳工程により、第1層、第2層及び第3層
をスタンパ表面側から順に備えて少なくとも前記第2層
が前記第3層より硬い材質の3層構造の光ディスク製造
用スタンパを製造するようにしたことを特徴とするスタ
ンパ製造方法。
5. A first layer, a second layer and a third layer are provided in order from the stamper surface side by a three-step electroforming process in which three kinds of electroforming liquids having different hardness are sequentially used, and at least the second layer is formed. A stamper manufacturing method, characterized in that a stamper for manufacturing an optical disc having a three-layer structure of which the layer is harder than the third layer is manufactured.
【請求項6】 3段階の電鋳工程の終了後にガラス原盤
を剥離するようにしたことを特徴とする請求項5記載の
スタンパ製造方法。
6. The stamper manufacturing method according to claim 5, wherein the glass master is peeled off after completion of the three-step electroforming process.
【請求項7】 第1層用の電鋳工程と第2層用の電鋳工
程との間にスタンパ裏面に対する鏡面研磨工程を有する
ことを特徴とする請求項5記載のスタンパ製造方法。
7. The stamper manufacturing method according to claim 5, further comprising a mirror polishing step for the back surface of the stamper between the electroforming step for the first layer and the electroforming step for the second layer.
JP33570792A 1992-12-16 1992-12-16 Stamper for producing optical disk and its production Pending JPH06187673A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33570792A JPH06187673A (en) 1992-12-16 1992-12-16 Stamper for producing optical disk and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33570792A JPH06187673A (en) 1992-12-16 1992-12-16 Stamper for producing optical disk and its production

Publications (1)

Publication Number Publication Date
JPH06187673A true JPH06187673A (en) 1994-07-08

Family

ID=18291585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33570792A Pending JPH06187673A (en) 1992-12-16 1992-12-16 Stamper for producing optical disk and its production

Country Status (1)

Country Link
JP (1) JPH06187673A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001084547A1 (en) * 2000-04-28 2001-11-08 Itac Limited Disc molding apparatus for compact disc

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001084547A1 (en) * 2000-04-28 2001-11-08 Itac Limited Disc molding apparatus for compact disc
JP2001312844A (en) * 2000-04-28 2001-11-09 Aitakku Kk Device for molding disk such as compact disk

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