TWI238897B - Master plate manufacturing method of light control film - Google Patents

Abstract

There is provided a master plate manufacturing method of light control film, which comprises plating a first metal layer on a glass substrate, uniformly coating a photoresist layer on top of the first metal layer, performing a first etching by a photolithography process and etching the first metal layer, plating a second metal layer with a shielding mask on the first metal layer so that the first metal layer and the second metal layer form a two-level micro structure, plating a conductive layer on the glass substrate, and electroplating a nickel sheet on the conductive layer, so that the nickel sheet forms a corresponding two-level recessed vessel by the two-level micro structure of the first metal layer and the second metal layer.

Description

1238897 V. Description of the invention (1)

V [Technical field to which the invention belongs] The present invention relates to a method for manufacturing a master of Lig h t C ο n t r ο 1 F i 1 m (light control film). [Previous Technology] Traditional light control films are manufactured by coating the film material on a master and then rolling by a roll forming machine to form a film state; however, existing light control films (Light C 〇ntr〇 The master of 1 F i 1 m) is a master made of Shi Xi wafer after being cast into a nickel plate. During the manufacturing process, the following questions will be generated; "1 · In silicon wafer 9 0 (that is, the semiconductor industry) Wafers) are usually manufactured in fixed sizes of five inches, six inches, eight inches, or twelve inches. Therefore, in order to conform to the rolling dimensions of the roll forming machine, the nickel plate 9 1 that has been recast must pass through For a single cutting and bonding process, please refer to Figure 3. The cutting of the silicon wafer 90 during the manufacturing process will reduce the usable area, although it will pass through most of the cut silicon wafers. The finished nickel plate 91 is rejoined to form a predetermined area. The manufacturing process is obviously complicated, and the cutting and joining must meet the requirements of precision. Therefore, the nickel plate 91 needs to rely on cutting and joining. Most clamps can be completed (not shown in the figure). The production will also be higher. 2 · After the nickel plates 9 1 are joined, the seam 9 2 between the nickel plates 9 1 will produce a film material at the seam 9 2 position during the manufacture of the light control film and withstand rolling. The rolling pressure of the compression molding machine is uneven and easy to break, so the manufacturing yield is low (see Figure 4). 3 · During the manufacturing process of the light control film, each nickel plate 9 1 has a seam 9 2 will-After the light control film is manufactured, its optical structure 9 3 will be produced

Page 5 1238897 V. Description of the invention (2) t Discontinuous conditions, and the unusable parts 9 4 are formed. These unusable parts 9 4 must be removed, which will limit the size of the light control film. It also causes waste of materials. 4 · The silicon wafer 90 was formed into an optical structure 9 3 through a yellow light process, and was then re-cored to form a recording plate 9 1 '. Due to the characteristics of the material of the dream wafer 90, the silicon wafer was peeled off when the nickel plate 91 was peeled. 90 is very easy to crack. The cracked silicon wafer 90 will remain in the optical structure 9 3 3 of the nickel plate 9 1, making this nickel plate 9 1 unusable or requiring additional processing to remove the remaining The silicon wafer 90 will also increase the manufacturing

cost. H [Summary of the Invention] The main purpose of the present invention is to solve the above-mentioned problems and provide a method for manufacturing a light control film (light control film), which can be used as a substrate without cutting through the glass substrate. , So that the manufactured nickel sheet does not need to go through the joining process, so the nickel sheet does not produce the flaws caused by the seams, so the light control film manufactured by rolling does not have a joint. Due to the flaws in the seam, the area that can be used will not be limited, and the loss of materials can also be reduced. At the same time, the present invention does not require complicated clamping fixtures during manufacturing, so the manufacturing cost can be reduced. And the completed nickel foil master will not cause the film material to be cracked due to uneven force during rolling, so as to ensure a high yield during production; not to cause discontinuities due to seams, so I will not have The unusable part can reduce the generation of waste, and the glass substrate can ensure the stability of the master of the nickel sheet. In order to achieve the foregoing objects, the present invention is a Light Control ^

1238897 V. Description of the invention (3) ^ F i 1 m (light control film) master manufacturing method, which includes the following steps: First step: providing a flat glass substrate having a predetermined size; second step: Plating a first metal layer on the glass substrate; third step: uniformly coating a photoresist layer on the top surface of the first metal layer on the glass substrate;-

Fourth step ... Cover the photoresist layer with a photomask and perform exposure. The photomask has a plurality of holes of a predetermined shape, so that the photoresist layer is exposed according to the holes of the predetermined shape to form most exposed portions and Most unexposed parts; U Fifth step: immerse the glass substrate combined with a photoresist layer in a developing solution, and develop one of the most exposed portions and most unexposed portions of the photoresist layer to be developed. And make the first metal layer be etched relative to the photoresist layer to reveal most of the etched part that is pre-performed to the next step; the sixth step: immerse the glass substrate showing the majority of the etched part into a metal etch In the liquid, most of the etched portion of the first metal layer is etched away, and the first metal layer forms most of the remaining portion. Step 7: peel off the remaining photoresist layer and clean the glass substrate exposed at the same time. , Most of the remaining portions of the first metal layer are exposed; the eighth step: covering the first metal layer with a shielding cover, the shielding cover covering the majority of the first metal layer On each

Page 7 1238897 V. Description of the invention (4) ^ A penetrating hole with a predetermined pattern and isolating the first metal layer and the glass substrate from the outside; Step 9: Most of the remaining portions of the first metal layer Partly, and shovel a second metal layer by evaporation or sputtering at the position of the penetration hole of the shielded cover, and then remove the shielded cover; tenth step: on the first metal layer A conductive layer is plated with the second metal layer and the bare glass-substrate; eleventh step ... electroforming a nickel sheet on the conductive layer; twelfth step: the nickel sheet and the first metal Layer, the second metal layer, and the glass substrate are separated to form a master of a light-controlling film; a two-step recess is formed on the nickel sheet opposite to the two-step microstructure of the first metal layer and the second metal layer groove. The above and other objects and advantages of the present invention can be easily understood from the detailed description and accompanying drawings of the selected embodiments below. Of course, the present invention allows some differences in the arrangement or arrangement of other parts, but the selected embodiment is described in detail in this specification and its structure is shown in the drawings. [Embodiment] Please refer to FIG. 1 to FIG. 2. The figure shows the structure of the embodiment 4 of the present invention. This is for illustrative purposes only and is not limited by this structure in patent applications. In this embodiment, a mother-to-plate manufacturing method of L i g h t C ο n t r ο 1 F i 1 m (light control film) includes the following steps:

Page 8 1238897 V. Description of the invention (5), the first step: provide a flat glass substrate 10, the substrate 10 has a predetermined size, and its size is provided by a roll forming machine (not shown) for rolling The second step: a first metal layer 1 1 is deposited on the glass substrate 10 by evaporation or sputtering. In this embodiment, chromium metal (C r) is used as the first metal layer 11. The thickness of the first metal layer 11 is maintained between 0.5um ~ lum. The third step: a photoresist layer 12 is evenly coated on the top surface of the first metal layer 11 on the glass substrate 10, and the photoresist layer 12 may be a positive type photoresistor or a negative type photoresist, such as : Clariant A ζ ρ462〇; and its viscosity is between 100 ~ 1600 centipoise (cps). The fourth step: the glass substrate 10 coated with the photoresist layer 12 in the third step is subjected to 9 3 X :, preheating for 3 minutes, and then the top surface is covered with a photomask 2 with UV light (1 2 mj (2, 5 seconds left and right) for exposure. The mask 2 has a plurality of holes 21 with a predetermined shape, so that the photoresist layer 12 is exposed with a predetermined shape to form a majority of exposed portions 1 2 1 and a majority. Unexposed section 1 2 2. Fifth step: The semi-finished product after the exposure in the fourth step is immersed in the developer 3 5 The developer 3 is a developer of A ζ-4 0 0 K, and the majority of the exposed portions of the photoresist layer 1 2 1 2 1 or unexposed portion 1 2 2 is developed and etched; in this embodiment, most of the exposed portions 1 2 1 are removed as an illustration, and most of the exposed portions 1 2 1 of the photoresist layer 12 are taken as an example. The portion 1 2 1 is etched by the developing solution, and the thickness is reduced downward to be removed, and the first metal layer 1 1 is exposed relative to the majority exposed portion 1 2 1.

Page 9 1238897 V. Description of the invention (6) Most of the etched parts in the next step are preliminarily 1 1 1. The sixth step: immerse the semi-finished product that has completed the fifth step in a metal etching solution 4 oct. Layer 1 1, most of the etched portion 1 1 1 of the first metal layer 11 is not protected by the isolation of the photoresist layer 12, so the majority of the etched portion 1 1 1 is removed by etching, leaving only the Most of the remaining portions of the first metal layer 11 are 112 °. The seventh step: peel off the remaining photoresist layer 12 by chemical or mechanical processing, and clean the exposed glass substrate 10 at the same time. The first metal layer The majority of the remaining parts of 1 1 1 2 are revealed. Eighth step: covering the first metal layer 11 with a shielding cover 5, the shielding cover 5 has a predetermined pattern on each of the most reserved portions 1 1 2 of the first metal layer 11. The through hole 5 1 isolates the first metal layer 11 and the glass substrate 10 from the outside. Ninth step: on the most reserved portions 1 1 2 of the first metal layer 1 1 and at the position of the penetrating hole 51 of the shielding cover 5, a second is deposited by evaporation or forging The metal layer 1 3 is made of chromium metal (C r), and the thickness of the second metal layer 13 is maintained between 0.5uui and luni, and then the cover 5 Remove. Tenth step: After the ninth step is completed, a conductive layer 14 is plated by electroplating or electroless plating, and the conductive layer 14 covers the first metal layer 1 1 and the second metal layer 13 and the bare glass substrate 1 〇. Eleventh step: electroforming a nickel sheet 60 on the conductive layer 14.

Page 10 1238897 V. Description of the invention (7), Twelfth step: Separate the nickel sheet 60 from the first metal layer 1 1, the second metal layer 1 3, and the glass substrate 10 to form A master of a light-controlling film; the nickel sheet 60 uses a two-stage microstructure of the first metal layer 1 1 and the second metal layer 13, and a second-stage groove 6 1. In the manufacturing process of the master of the present invention, the glass substrate 10 does not need to be cut, and the manufactured nickel sheet 60 does not need to go through the bonding process, so the nickel sheet 60 produced is not There will be seam flaws. Therefore, the light control film 70 manufactured by rolling will not have seam flaws, so the area that can be used will not be limited, and the loss of materials can be reduced. . At the same time, the present invention does not require complicated clamping fixtures during manufacture, so the manufacturing cost can be reduced. Because the manufactured nickel sheet 60 has no seam problem as the nickel plate manufactured by the conventional technology silicon wafer, when the light control film 70 is rolled with a roll forming machine (see Figure 2) (Shown), it will not cause the film material to rupture due to uneven force during rolling to ensure the production yield. In addition, the nickel sheet 60 of the present invention does not have the problem of seams, so the optical structure 7 1 on the light control film 70 produced does not have discontinuities due to seams, so it does not There are unusable parts, which can reduce the generation of waste, and the usable area $ of the light control film 70 is not limited to meet the needs of different occasions. In addition, due to the characteristics of the material of the glass substrate 10, when the electroformed nickel sheet 60 is to be peeled off, there will be no breakage, so it is possible to ensure the stability of the nickel sheet 60 master.

Page 11 1238897 V. Description of the invention (8) The disclosure of the embodiments described above is used to illustrate the present invention and is not intended to limit the present invention. Therefore, any change in numerical values or replacement of equivalent components should still belong to the scope of the present invention. ® Shou. From the above detailed description, those skilled in the art can understand that the present invention can indeed achieve the aforementioned purpose, and it has indeed complied with the provisions of the Patent Law, and filed a patent application.

Page 121238897 Simple explanation of the diagram [The diagram is simple. The first diagram is the second picture of the book. The third picture is the custom. The fourth picture is the custom control.] Part of the invention is Right C ο ntr ο 1 F i 1 m (light control film) Schematic diagram of the manufacturing method of the master. The light control film master of the invention is a schematic diagram when the light control film is turned over, which shows that the nickel sheet of the master is not connected, and it will not cause cracks. Schematic diagram of cutting and bonding of silicon wafers in a manufacturing method of a light control film master. Schematic illustration of the use of light to control the position of the seam of the film master, which can cause cracking when manufacturing a light film. [Illustration of drawing number (conventional hard wafer 90 seam 9 2 unusable part 9 4 (part of the present invention) glass substrate 10 etching part 1 1 1 photoresist layer 1 2 unexposed part 1 2 2 conductive layer 1 4 Photomask 2 Developer 3 Metal #etching liquid 4 Nickel plate 9 1 Optical structure 9 3 First metal layer 1 1 Most reserved part 1 Exposed part 1 2 1 Second metal layer 1 3 Hole 2 1 2

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Claims (1)

1238897 VI. Scope of patent application, 1. A method for manufacturing a light control film (light control film), including the following steps: First step: providing a flat glass substrate having a predetermined size; second step: in The glass substrate is plated with a first metal layer; the third step: uniformly coating a photoresist layer on the top surface of the first metal layer on the glass substrate; the fourth step: covering the photoresist layer with a A photomask, and performing exposure, the photomask has a plurality of holes of a predetermined shape, so that the photoresist layer is exposed according to the holes of the predetermined shape to form a majority of exposed portions and a majority of 0 unexposed portions; the fifth step: The glass substrate incorporating the photoresist layer is immersed in a developing solution, and one of the most exposed portions and the most unexposed portions of the photoresist layer is developed and removed, and the first metal layer is opposed to the photoresist layer. The portion to be etched reveals most of the etched portion that is pre-performed to the next step; The sixth step: immerse the glass substrate showing the majority of the etched portion ~ into a metal money engraving solution to the first metal Most of the remaining portions of the layer are removed in a moment, and the first metal layer forms most of the remaining portions. The seventh step: peel off the remaining photoresist layer, and simultaneously clean the exposed glass substrate of f, the first metal Most of the remaining portions of the layer are exposed; the eighth step: covering the first metal layer with a shielding cover%, the shielding cover is divided on the most remaining portions of the first metal layer. Page 15 1238897 VI. The scope of patent application has a ninth step of the predetermined glass substrate and the outside world, and a penetrating hole in the shielding shape, and the first metal layer and the glass are isolated; Wear a second metal layer on the mirror, and then place multiple layers of a metal through-hole layer to cover the mask. Step 10: On the first metal layer and the reserved portion, The second metal layer and the bare glass substrate are plated with a lead 2 4 The eleventh step, the twelfth step, the second metal layer, and the master; the second-order type of the recording layer is based on the application The patent (the light control film layer is between chromium (C 1 um). According to the patent application (the light control film is a positive photoresist and the patent application (the light control film layer is a metal complex. Step: In this step: The master plate r) surrounding the microstructure surrounding the glass substrate sheet of item 1) is used as the electrical layer; the conductive layer nickel sheet is separated to form the manufacturing material described in the second pair, and electroformed and the Firstly forming a nickel sheet; a metal layer, the first light-controlling film The first metal layer and the second gold step groove. The Light Control Film method, wherein the first metal maintains a thickness of 0.5 um to the master control method of the Light Control Film described in item 1). Wherein, the photoresist layer is one of the negative type photoresist. The method for manufacturing a master of the light control film described in item 1, wherein the second metal Page 16