JPH06151011A - Connector with built-in hybrid plate - Google Patents

Abstract

PURPOSE:To efficiently remove heat generated in a semiconductor part and a resistor so as to prevent mutual thermal interference in a connector with a built-in hybrid plate. CONSTITUTION:In a connector with a built-in hybrid plate 4, on which a semiconductor part 9 is mounted, inside a casing 1. A heat conducting plate 8 connected directly to the casing 1 is housed inside the casing 1. The heat conducting plate 8 is brought into contact in the vicinity of right under the semiconductor part 9. Accordingly, the casing 1 absorbs heat generated in the semiconductor part 9 via the heat conducting plate 8 so as to radiate the heat. Meanwhile, a contact 2 radiates heat of a resistor 14 of the hybrid plate 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid board built-in connector, and more particularly to a cooling structure for semiconductor parts to be mounted on the hybrid board.

[0002]

2. Description of the Related Art A conventional example represented by Japanese Patent Publication No. 2-50349 has a structure in which heat generated by a semiconductor component mounted on a hybrid plate and a large number of impedance matching resistors is radiated through a contact. The bent base is attached along the surface of the hybrid plate to promote the heat release.

[0003]

As described above, in the conventional connector having a built-in hybrid board, the entire hybrid board is heated by the heat generated by the semiconductor components and the resistor.
The structure is such that the heat of the hybrid plate is radiated only through the contact connecting to the terminal of the hybrid plate.

Therefore, the heat generated by the semiconductor component is conducted to the entire hybrid board and adversely affects the characteristics such as other resistances.
Further, it is not possible to effectively prevent the heat generation of the semiconductor component itself and the heat generation of the resistance from becoming a disturbance factor of the characteristics of the semiconductor component, and the heat release is limited in the case of relying only on the contacts connected to the terminals of the hybrid board. Therefore, it is difficult to quickly remove the heat generated by the semiconductor component.

[0005]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems in a hybrid board built-in connector, and properly releases heat from the semiconductor components and resistors to ensure the reliability of the connector. As a means for this, a heat conduction plate is provided in a casing containing a hybrid plate having the semiconductor component that generates heat, the base end is integrally attached to the casing, and the tip is brought into contact with the hybrid plate, and the contact position Is set on the surface of the hybrid plate near the semiconductor component mounting surface, and the casing is effectively used as a heat radiating means for the semiconductor component.

[0006]

With the above structure, the heat generated by the semiconductor component on the hybrid plate is immediately absorbed by the heat conducting plate in the vicinity thereof and is absorbed and dispersed by the casing. The casing has an outer surface with a large area, and the heat generated by the semiconductor component is absorbed and dispersed in the casing via the heat conducting plate to radiate the heat, thereby promoting cooling of the semiconductor component.

On the other hand, the contact connected to the hybrid board is responsible for heat dissipation such as the impedance matching resistance and the control resistance of the semiconductor component possessed by the hybrid board, and can complementarily accelerate the heat dissipation of the resistor and the semiconductor component, and the heat of both of them. A highly reliable hybrid board built-in connector can be provided by effectively preventing characteristic changes due to

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A casing 1 contains a hybrid plate 4 having a semiconductor component 9 which generates heat during operation, and holds a block 3 having a large number of contacts 2 implanted in its front opening. The contact 2 has one end protruding outward to be used for connection with another connector, and the other end protruding into the casing to be brought into contact with a terminal 5 (conductive pad) juxtaposed on the front edge of the hybrid plate, Solder and fix the contact parts.

The casing 1 is made of metal, and the surface facing the surface of the hybrid plate 4 is formed by a lid 6 which can be inserted and removed, and the entire casing 1 except for the front opening has substantially the same shape as the casing. Protective cover made of insulator 7
It is stored inside.

The present invention does not require the presence of the protective cover 7. In the casing 1, there is a heat conducting plate accommodating space 1 behind the casing, that is, behind the hybrid plate 4.
0, the heat conducting plate 8 is provided in the accommodation space 10,
The base end of the heat conduction plate 8 is integrally attached to the casing forming wall, and the tip is brought into contact with the hybrid plate 4, and the contact position is near the mounting surface of the semiconductor component 9, for example, a hybrid just below the mounting surface. The surface of the board. The heat conducting plate 8 is formed of a leaf spring as shown in FIGS.
The seat plate 8a at the base end thereof is fixed to the inner surface of the casing forming wall and integrally attached with a fastener 11 such as a screw or a tack, and the seat plate 8a is attached.
The tip of the heat conducting piece 8b extended from the above is elastically pressure-contacted with the surface of the hybrid plate immediately below the semiconductor component.

As another example, as shown in FIG. 3, a heat conducting piece composed of a leaf spring which extends along the side portion of the semiconductor component on the heat conducting plate 8 and comes into pressure contact with the upper surface of the hybrid plate 4. 8b and a heat conducting piece 8c composed of a leaf spring that comes into pressure contact with the lower surface immediately below the semiconductor component, and absorbs heat while sandwiching the rear edge of the hybrid plate 4 by both heat conducting pieces 8b and 8c. To do.

As another example, as shown in FIGS. 4 and 5, a heat conduction plate 8 which can be integrally molded with the casing 1 can be provided in the heat conduction plate accommodation space 10. The heat conduction plate 8 is formed from the support wall 12 formed by projecting the casing forming wall in the heat conduction plate accommodation space 10 inward.
Is integrally molded so as to extend toward the casing 1. The tip surface of the casing 1 is brought into contact with the lower surface of the hybrid plate, that is, the facing surface immediately below the mounting surface of the semiconductor component 9, and the casing 1 via the heat conduction plate 8.
To conduct and dissipate heat to and from.

In any of the above embodiments, the rear edge of the hybrid plate 4 can be loaded at the contact position. The hybrid plate 4 has its front edge portion supported by the contact 2 and its rear edge portion supported by the heat conduction plate 8 as described above. The hybrid plate 4 has casings 1 on its left and right side edges.
The front and rear edges are supported by the contact 2 and the heat conduction plate 8 while being engaged and supported in the grooves 13 provided on the left and right side edge portions inside.

The heat conducting plate 8 thermally connects the hybrid plate 4 on which the semiconductor component 9 is mounted and the casing 1, and the heat generated by the semiconductor component is transferred to the casing 1 via the heat conducting plate 8 which is in direct contact therewith. It is conducted, diffused to the whole area of the casing having a large area, and radiated. The casing 1 is formed of a metal having a good heat dissipation property, for example, a metal casting such as a zinc alloy, but the casing 1 may be made of a synthetic resin.

The hybrid plate 4 includes the semiconductor component 9
Control resistor or a large number of impedance matching resistors 14 arranged at the output end, and a capacitor 15 is mounted. These resistors 14 are adhered to the upper surface or the lower surface of the hybrid plate 4 by printing or the like, the outer surface thereof is protected by an insulating layer covering the surface of the hybrid plate 4, and the tip of the heat conducting plate 8 is insulated by the insulating layer. Intimately contact the layer surface.

[0016]

According to the present invention, the heat generated by the semiconductor component is directly absorbed by the heat conducting plate, is absorbed and diffused by the casing through the heat conducting plate, and the heat generated by the semiconductor component is transmitted to the hybrid plate. Does not adversely affect the resistance and other characteristics of the device, and the heat generated by the device itself is directly absorbed by the heat conducting plate, conducted to the casing, diffused, and radiated well from the outer surface of the casing. It is possible to favorably prevent the characteristics from changing due to heat generated by itself or heat generated by resistance. On the other hand, the contact serves only to dissipate the heat generated by the resistor, and the heat dissipation and cooling of the hybrid plate are promoted more than ever before. Therefore, the problem of characteristic deterioration due to heat in the hybrid board built-in connector can be effectively prevented, and a highly reliable connector can be provided. Further, the hybrid plate can be stably incorporated with the front edge supported by the contact and the rear edge supported by the heat conduction plate.
Further, by forming the heat conducting plate with a spring plate and bringing it into pressure contact with the surface of the hybrid plate, it is possible to favorably promote heat conduction from the latter to the former.

[Brief description of drawings]

FIG. 1 is a cross-sectional plan view showing the inside of a hybrid board built-in connector.

FIG. 2 is a sectional view taken along the line 1A-A of FIG.

FIG. 3 is a cross-sectional side view showing the inside of a hybrid board built-in connector showing another example.

FIG. 4 is a sectional view taken along line BB of FIG. 3 disclosing the inside of the hybrid board built-in connector.

[Explanation of symbols]

 1 Casing 2 Contact 4 Hybrid plate 8 Heat conduction plate 9 Semiconductor parts

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[Procedure amendment]

[Submission date] October 18, 1993

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] Brief description of the drawing

[Correction method] Change

[Correction content]

[Brief description of drawings]

FIG. 1 is a cross-sectional plan view showing the inside of a hybrid board built-in connector.

FIG. 2 is a sectional view taken along the line 1A-A of FIG.

FIG. 3 is a cross-sectional side view showing the inside of a hybrid board built-in connector showing another example.

FIG. 4 is a cross-sectional view showing the interior of the hybrid board built-in connector in FIG. 3 in plan view.

FIG. 5 is a sectional view taken along line BB of FIG. 4 which discloses the inside of the connector with a built-in hybrid board.

[Explanation of symbols] 1 casing 2 contact 4 hybrid plate 8 heat conduction plate 9 semiconductor component

Claims (3)

[Claims] 1. A connector comprising a casing having a plurality of contacts arranged to be connected to another connector at a front portion thereof, a hybrid plate built in the casing, and a heat-generating semiconductor component mounted on the hybrid plate. A built-in hybrid plate, characterized in that a heat conduction plate is provided in the casing, a base end of the heat conduction plate is integrally attached to the casing, and the tip is brought into contact with a hybrid plate surface near the mounting surface of the semiconductor component. connector. 2. The hybrid board built-in connector according to claim 1, wherein the heat conduction plate is formed of an elastic plate, and the tip of the heat conduction plate is brought into pressure contact with the hybrid plate. 3. The hybrid board built-in connector according to claim 1, wherein the hybrid board is supported by the tip of the heat conducting plate.