JPH0612614Y2 - 回路基板ユニツト - Google Patents
回路基板ユニツトInfo
- Publication number
- JPH0612614Y2 JPH0612614Y2 JP1987055321U JP5532187U JPH0612614Y2 JP H0612614 Y2 JPH0612614 Y2 JP H0612614Y2 JP 1987055321 U JP1987055321 U JP 1987055321U JP 5532187 U JP5532187 U JP 5532187U JP H0612614 Y2 JPH0612614 Y2 JP H0612614Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- connection
- board unit
- film substrate
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 27
- 239000011888 foil Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 238000003860 storage Methods 0.000 description 8
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 239000008188 pellet Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987055321U JPH0612614Y2 (ja) | 1987-04-14 | 1987-04-14 | 回路基板ユニツト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987055321U JPH0612614Y2 (ja) | 1987-04-14 | 1987-04-14 | 回路基板ユニツト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63162464U JPS63162464U (enrdf_load_stackoverflow) | 1988-10-24 |
| JPH0612614Y2 true JPH0612614Y2 (ja) | 1994-03-30 |
Family
ID=30883113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987055321U Expired - Lifetime JPH0612614Y2 (ja) | 1987-04-14 | 1987-04-14 | 回路基板ユニツト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0612614Y2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2737545B2 (ja) * | 1992-06-17 | 1998-04-08 | 日立電線株式会社 | 半導体装置用フィルムキャリアテープ及びその製造方法 |
| JP4693958B2 (ja) * | 2000-05-30 | 2011-06-01 | オプトレックス株式会社 | 液晶表示装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6013274B2 (ja) * | 1976-09-20 | 1985-04-05 | 日本メクトロン株式会社 | フレキシブルサ−キツトに於ける端子構造及びその製造方法 |
| JPS5432474U (enrdf_load_stackoverflow) * | 1977-08-08 | 1979-03-03 | ||
| JPS5632474U (enrdf_load_stackoverflow) * | 1979-08-17 | 1981-03-30 | ||
| JPS56169390A (en) * | 1980-05-29 | 1981-12-26 | Sharp Kk | Method of connecting wire |
-
1987
- 1987-04-14 JP JP1987055321U patent/JPH0612614Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63162464U (enrdf_load_stackoverflow) | 1988-10-24 |
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