JPH06123924A - Substrate holder - Google Patents
Substrate holderInfo
- Publication number
- JPH06123924A JPH06123924A JP27215192A JP27215192A JPH06123924A JP H06123924 A JPH06123924 A JP H06123924A JP 27215192 A JP27215192 A JP 27215192A JP 27215192 A JP27215192 A JP 27215192A JP H06123924 A JPH06123924 A JP H06123924A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- gas
- mounting surface
- supplying
- pores
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体素子や液晶表示
素子等の製造用の露光装置に備えられた、基板を載置し
て吸着固定するホルダ装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a holder device, which is provided in an exposure apparatus for manufacturing semiconductor elements, liquid crystal display elements and the like, for mounting a substrate and fixing it by suction.
【０００２】[0002]
【従来の技術】従来のこの種の装置は、図３に示すよう
な構成であった。即ち、ホルダ基盤１は、基板を載置す
る載置面３と、載置面３上に開口５ａを有する貫通気孔
５を備えている。この貫通気孔５は、正圧気体を供給す
る正圧制御部８と負圧気体を供給する負圧制御部９とに
接続されており、載置面３上に基板２を載置し、負圧制
御部９によって貫通気孔５に負圧気体を供給する（貫通
気孔５を真空に引く）ことによって基板２を載置面３上
に吸着固定する。また基板２に対する露光等の処理が終
了した後は、正圧制御部８によって貫通気孔５に正圧気
体を供給して（例えば大気圧の気体を供給する）吸着固
定を解除し、昇降腕６を上昇して載置面３から基板２を
分離する。その後、基板２は不図示の搬送装置によって
搬送される。2. Description of the Related Art A conventional device of this type has a structure as shown in FIG. That is, the holder base 1 includes a mounting surface 3 on which a substrate is mounted, and through holes 5 having openings 5 a on the mounting surface 3. This through-hole 5 is connected to a positive pressure control unit 8 that supplies a positive pressure gas and a negative pressure control unit 9 that supplies a negative pressure gas, and the substrate 2 is placed on the mounting surface 3 to make a negative pressure. The substrate 2 is adsorbed and fixed onto the mounting surface 3 by supplying negative pressure gas to the through-holes 5 (pulling the through-holes 5 into a vacuum) by the pressure control unit 9. After the processing such as exposure of the substrate 2 is completed, the positive pressure control unit 8 supplies positive pressure gas to the through-holes 5 (for example, supplies atmospheric pressure gas) to release the suction fixation, and the lifting arm 6 is moved. And the substrate 2 is separated from the mounting surface 3. After that, the substrate 2 is transferred by a transfer device (not shown).
【０００３】[0003]
【発明が解決しようとする課題】上記の如き従来の技術
においては、基板がガラス等の絶縁物の場合、基板を載
置面から分離する際に静電気が発生し、基板が帯電する
ことがあった。被露光物が帯電すると、静電気的な力が
作用して粉塵等の異物が基板に吸着し、製品の欠陥とな
る問題があった。また、静電気帯電量によっては放電を
起こし、基板に塗布されたレジストに穴を開けるなどの
問題があった。In the prior art as described above, when the substrate is an insulating material such as glass, static electricity may be generated when the substrate is separated from the mounting surface, and the substrate may be charged. It was When the object to be exposed is charged, there is a problem that electrostatic force acts and foreign matter such as dust is adsorbed on the substrate, resulting in a product defect. In addition, there is a problem that electric discharge occurs depending on the amount of electrostatic charge, and holes are formed in the resist applied to the substrate.
【０００４】本発明は、上記問題点に鑑みて成されたも
のであり、ホルダの載置面から基板を分離する際に発生
する静電気が基板に帯電するのを低減することを目的と
する。The present invention has been made in view of the above problems, and it is an object of the present invention to reduce static electricity generated on a substrate when the substrate is separated from a mounting surface of a holder.
【０００５】[0005]
【課題を解決するための手段】上記目的のため本発明で
は、基板（２）を載置する載置面（３）と、載置面に開
口（５ａ）を持つ複数の貫通気孔（５）とを有し、気孔
（５）に負圧気体を供給することによって基板を載置面
に吸着固定し、また気孔に正圧気体を供給することによ
って吸着固定を解除する基板ホルダにおいて、載置面上
に開口（５ａ）の少なくとも１つを包囲するように形成
され、基板と微小面積で接触するとともに、基板との間
で密閉空間（４）を形成する複数の堤状部材（３ａ）
と；正圧気体として、密閉空間に対して高湿度の気体を
供給する高湿度気体供給手段（１０）と；基板の吸着を
解除した後に、基板に対してイオン化した気体を供給す
るイオン化気体供給手段（１１）とを備えたこととし
た。In order to achieve the above object, the present invention provides a mounting surface (3) on which a substrate (2) is mounted, and a plurality of through holes (5) having openings (5a) on the mounting surface. In a substrate holder having a substrate holder for holding a substrate on a mounting surface by suction by supplying a negative pressure gas to the pores (5) and releasing a suction pressure by supplying a positive pressure gas to the pores. A plurality of bank-shaped members (3a) which are formed so as to surround at least one of the openings (5a) on the surface, contact the substrate with a small area, and form a closed space (4) between the substrate and the substrate.
A high-humidity gas supply means (10) for supplying a high-humidity gas to the closed space as a positive pressure gas; and an ionized gas supply for supplying an ionized gas to the substrate after releasing the adsorption of the substrate And means (11).
【０００６】また、基板（２）を載置する載置面（３）
と、載置面に開口（５ａ）を持つ複数の貫通気孔（５）
とを有し、気孔（５）に負圧気体を供給することによっ
て基板を載置面に吸着固定し、また気孔に正圧気体を供
給することによって吸着固定を解除する基板ホルダにお
いて、載置面上に開口（５ａ）の少なくとも１つを包囲
するように形成され、基板と微小面積で接触するととも
に、基板との間で密閉空間（４）を形成する複数の堤状
部材（３ａ）と；正圧気体として、密閉空間に対して高
湿度の気体を供給する高湿度気体供給手段（１０）とを
備えたこととした。A mounting surface (3) on which the substrate (2) is mounted
And a plurality of through holes (5) having openings (5a) on the mounting surface
In a substrate holder having a substrate holder for holding a substrate on a mounting surface by suction by supplying a negative pressure gas to the pores (5) and releasing a suction pressure by supplying a positive pressure gas to the pores. A plurality of bank-shaped members (3a) formed on the surface so as to surround at least one of the openings (5a), contacting the substrate with a small area, and forming a sealed space (4) between the substrate and the bank; A high-humidity gas supply means (10) for supplying a high-humidity gas to the closed space as the positive pressure gas is provided.
【０００７】さらに、基板（２）を載置する載置面
（３）と、載置面に開口した複数の貫通気孔（５）とを
有し、気孔（５）に負圧気体を供給することによって基
板を載置面に吸着固定し、また気孔に正圧気体を供給す
ることによって吸着固定を解除する基板ホルダにおい
て、正圧気体として高湿度の気体を供給する高湿度気体
供給手段（１０）と；基板の吸着を解除した後に、基板
に対してイオン化した気体を供給するイオン化気体供給
手段（１１）とを備えたこととした。Further, it has a mounting surface (3) on which the substrate (2) is mounted and a plurality of through pores (5) opened in the mounting surface, and negative pressure gas is supplied to the pores (5). In this way, in the substrate holder in which the substrate is adsorbed and fixed on the mounting surface and the adsorption and fixation is released by supplying positive pressure gas to the pores, high humidity gas supply means (10) for supplying high humidity gas as positive pressure gas. ) ;; and ionization gas supply means (11) for supplying an ionized gas to the substrate after the adsorption of the substrate is released.
【０００８】[0008]
【作用】本発明では、基板と載置面との接触面積を小さ
くしたため、静電気の発生量を抑えることができる。ま
た、基板の吸着を解除する際に正圧気体として高湿度の
気体を供給するため、基板の環境が高湿度となり、静電
気の発生量と基板の帯電量を抑えることができる。さら
に、吸着を解除した基板に対してイオン化された空気を
供給するため、帯電した静電気が中和される。In the present invention, since the contact area between the substrate and the mounting surface is reduced, the amount of static electricity generated can be suppressed. Further, since high humidity gas is supplied as the positive pressure gas when the adsorption of the substrate is released, the environment of the substrate becomes high humidity, and the amount of static electricity generated and the amount of charge on the substrate can be suppressed. Further, since the ionized air is supplied to the substrate from which the adsorption has been released, the charged static electricity is neutralized.
【０００９】[0009]
【実施例】図１は、本発明の第１の実施例による基板ホ
ルダの概略的な構成を示す図である。（ａ）は平面図、
（ｂ）は側断面図である。ホルダ基盤１は、ホルダ表面
に開口５ａを有する貫通気孔５を備えている。また、ホ
ルダ表面には開口５ａを包囲するように堤状部材３ａが
設けられており、この堤状部材３ａ上に基板を載置した
場合に基板２と堤状部材３ａとで密閉空間４を形成す
る。尚、この密閉空間４の幅（堤状部材３ａ同士の間
隔）及び容積は、基板の保持力を損なうことなく基板と
の接触面積を小さくし、且つ基板２の平面度に影響を与
えないような幅及び容積となっている。また、この密閉
空間４は貫通気孔５を介して正圧制御部８及び負圧制御
部９と接続されているが、正圧制御部８にはさらに湿度
制御装置１０が設けられている。堤状部材３ａ上に基板
２を載置して吸着固定する際は、負圧制御部９によって
密閉空間４を真空に引けばよく、また基板２の吸着固定
を解除する際は、正圧制御部８からの気体を湿度制御装
置１０によって高湿度（およそ５０〜６０％）の気体と
して密閉空間４に対して供給する。1 is a diagram showing a schematic structure of a substrate holder according to a first embodiment of the present invention. (A) is a plan view,
(B) is a side sectional view. The holder base 1 is provided with through holes 5 having openings 5a on the holder surface. Further, a bank-shaped member 3a is provided on the holder surface so as to surround the opening 5a, and when a substrate is placed on this bank-shaped member 3a, the substrate 2 and the bank-shaped member 3a form a closed space 4. Form. The width (space between the bank-shaped members 3a) and the volume of the closed space 4 reduce the contact area with the substrate without impairing the holding force of the substrate, and do not affect the flatness of the substrate 2. It has a wide width and volume. The closed space 4 is connected to the positive pressure control unit 8 and the negative pressure control unit 9 via the through holes 5, and the positive pressure control unit 8 is further provided with a humidity control device 10. When the substrate 2 is placed on the bank member 3a and fixed by suction, the closed space 4 may be evacuated by the negative pressure control section 9, and when the substrate 2 is released from the suction and fixed, positive pressure control is performed. The gas from the portion 8 is supplied to the closed space 4 as a high humidity (approximately 50 to 60%) gas by the humidity control device 10.
【００１０】図２は、本発明の第２の実施例による基板
ホルダの概略的な構成を示す図である。（ａ）は平面
図、（ｂ）は側断面図である。ホルダ基板１の構成は、
図１に示す第１の実施例と同様であるが、正圧制御部８
は湿度制御部１０の他にさらにイオン化空気発生装置１
１を備えている。この場合、基板２の真空吸着を解除し
た後、昇降腕６によって基板２を堤状部材３ａから分離
して不図示の搬送装置に受け渡すまでの間は、イオン化
空気発生装置１１によってイオン化された気体を供給す
る。これによって、仮に基板２が帯電してしまったとし
ても、基板の帯電量を減少することができる。また、高
湿度の気体とイオン化された気体とを別々に供給する必
要はなく、基板２の真空吸着を解除する際に供給する気
体を高湿度のイオン化された気体としても構わない。
尚、基板が正負のいずれに帯電しているかによって供給
する気体を正負いずれにイオン化させるか変わってくる
が、これは、基板の帯電状態を検出するセンサ等を設け
ることで解決できる。FIG. 2 is a diagram showing a schematic structure of a substrate holder according to a second embodiment of the present invention. (A) is a plan view and (b) is a side sectional view. The structure of the holder substrate 1 is
Same as the first embodiment shown in FIG. 1, but with the positive pressure controller 8
Is an ionized air generator 1 in addition to the humidity controller 10.
1 is provided. In this case, after the vacuum suction of the substrate 2 is released, the substrate 2 is ionized by the ionized air generator 11 until the substrate 2 is separated from the bank-shaped member 3a by the elevating arm 6 and transferred to the transport device (not shown). Supply gas. As a result, even if the substrate 2 is charged, the amount of charge on the substrate can be reduced. Further, it is not necessary to separately supply the high-humidity gas and the ionized gas, and the gas supplied when releasing the vacuum adsorption of the substrate 2 may be the high-humidity ionized gas.
Depending on whether the substrate is positively or negatively charged, whether the supplied gas is positively or negatively ionized varies. This can be solved by providing a sensor or the like for detecting the charged state of the substrate.
【００１１】上記の各実施例は、図３に示す従来の基板
ホルダにおけるホルダ基盤（即ち、堤状部材のないホル
ダ基盤）にも適用することが可能である。尚、この場
合、基板とホルダ基盤との接触面積が大きくなるため基
板をホルダ基盤から分離する際に帯電する可能性が大き
くなる。よって、正圧制御部８は湿度制御部とイオン化
空気発生装置の両方を備えることが望ましい。Each of the above-described embodiments can be applied to the holder base in the conventional substrate holder shown in FIG. 3 (that is, the holder base without a bank member). In this case, since the contact area between the substrate and the holder base becomes large, the possibility of being charged when the substrate is separated from the holder base increases. Therefore, it is desirable that the positive pressure controller 8 includes both the humidity controller and the ionized air generator.
【００１２】また、上記の実施例では、イオン化した気
体を供給することとしたが、これに代えてアルゴン＝メ
タンガスのような電離作用を有するガスを供給するよう
にしても同様の効果が得られる。さらに、イオン化した
気体又は電離作用を有するガスは、気孔５を介して供給
する必要はなく、別系統の吹き出し口を設けて直接基板
に対して供給しても構わない。Further, in the above embodiment, the ionized gas is supplied, but the same effect can be obtained by supplying a gas having an ionizing action such as argon = methane gas instead. . Furthermore, the ionized gas or the gas having an ionizing action does not have to be supplied through the pores 5, but may be directly supplied to the substrate by providing a blowout port of another system.
【００１３】[0013]
【発明の効果】以上のように本発明では、基板の帯電量
を抑えることが可能となる他、万一基板が帯電した場合
でもこれを中和することができ、静電気によって基板に
悪影響を及ぼすことがなくなる。As described above, according to the present invention, the charge amount of the substrate can be suppressed, and even if the substrate is charged, it can be neutralized, and the substrate is adversely affected by static electricity. Will disappear.
【図１】本発明の第１の実施例による基板ホルダの概略
的な構成を示す図FIG. 1 is a diagram showing a schematic configuration of a substrate holder according to a first embodiment of the present invention.
【図２】本発明の第２の実施例による基板ホルダの概略
的な構成を示す図FIG. 2 is a diagram showing a schematic configuration of a substrate holder according to a second embodiment of the present invention.
【図３】従来の技術による基板ホルダの概略的な構成を
示す図FIG. 3 is a diagram showing a schematic configuration of a substrate holder according to a conventional technique.
１ ホルダ基盤 ３ａ 堤状部材 ４ 密閉空間 １０ 湿度制御部 １１ イオン化空気発生装置 1 Holder Base 3a Levee Member 4 Sealed Space 10 Humidity Control Section 11 Ionized Air Generator
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 21/68 Ｐ 8418−4Ｍ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI technical display location H01L 21/68 P 8418-4M
Claims (3)
口を持つ複数の貫通気孔とを有し、該気孔に負圧気体を
供給することによって前記基板を前記載置面に吸着固定
し、また前記気孔に正圧気体を供給することによって前
記吸着固定を解除する基板ホルダにおいて、 前記載置面上に前記開口の少なくとも１つを包囲するよ
うに形成され、前記基板と微小面積で接触するととも
に、前記基板との間で密閉空間を形成する複数の堤状部
材と；前記正圧気体として、前記密閉空間に対して高湿
度の気体を供給する高湿度気体供給手段と；前記基板の
吸着を解除した後に、前記基板に対してイオン化した気
体を供給するイオン化気体供給手段とを備えたことを特
徴とする基板ホルダ。1. A mounting surface on which a substrate is mounted, and a plurality of through pores having openings in the mounting surface, wherein the substrate is mounted on the mounting surface by supplying negative pressure gas to the pores. In a substrate holder that is fixed by suction to the substrate and releases the suction and fixing by supplying positive pressure gas to the pores, the substrate holder is formed so as to surround at least one of the openings on the mounting surface, A plurality of bank-shaped members that make contact with each other in a minute area and form a closed space with the substrate; and a high-humidity gas supply unit that supplies a high-humidity gas to the closed space as the positive pressure gas. A substrate holder provided with an ionized gas supply means for supplying an ionized gas to the substrate after releasing the adsorption of the substrate.
口を持つ複数の貫通気孔とを有し、該気孔に負圧気体を
供給することによって前記基板を前記載置面に吸着固定
し、また前記気孔に正圧気体を供給することによって前
記吸着固定を解除する基板ホルダにおいて、 前記載置面上に前記開口の少なくとも１つを包囲するよ
うに形成され、前記基板と微小面積で接触するととも
に、前記基板との間で密閉空間を形成する複数の堤状部
材と；前記正圧気体として、前記密閉空間に対して高湿
度の気体を供給する高湿度気体供給手段とを備えたこと
を特徴とする基板ホルダ。2. A mounting surface on which a substrate is mounted, and a plurality of through pores having openings in the mounting surface, wherein the substrate is mounted on the mounting surface by supplying negative pressure gas to the pores. In a substrate holder that is fixed by suction to the substrate and releases the suction and fixing by supplying positive pressure gas to the pores, the substrate holder is formed so as to surround at least one of the openings on the mounting surface, A plurality of bank-shaped members that make contact with each other in a minute area and form a closed space with the substrate; and a high-humidity gas supply unit that supplies a high-humidity gas to the closed space as the positive pressure gas. A substrate holder comprising:
口した複数の貫通気孔とを有し、該気孔に負圧気体を供
給することによって前記基板を前記載置面に吸着固定
し、また前記気孔に正圧気体を供給することによって前
記吸着固定を解除する基板ホルダにおいて、 前記正圧気体として高湿度の気体を供給する高湿度気体
供給手段と；前記基板の吸着を解除した後に、前記基板
に対してイオン化した気体を供給するイオン化気体供給
手段とを備えたことを特徴とする基板ホルダ。3. A mounting surface on which a substrate is mounted, and a plurality of through pores opened in the mounting surface, and by supplying negative pressure gas to the pores, the substrate is placed on the mounting surface. In a substrate holder for adsorbing and fixing, and for releasing the adsorbing and fixing by supplying positive pressure gas to the pores, high humidity gas supply means for supplying high humidity gas as the positive pressure gas; A substrate holder comprising: an ionized gas supply means for supplying an ionized gas to the substrate after the release.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27215192A JPH06123924A (en) | 1992-10-12 | 1992-10-12 | Substrate holder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27215192A JPH06123924A (en) | 1992-10-12 | 1992-10-12 | Substrate holder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06123924A true JPH06123924A (en) | 1994-05-06 |
Family
ID=17509802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27215192A Pending JPH06123924A (en) | 1992-10-12 | 1992-10-12 | Substrate holder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06123924A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0950248A (en) * | 1995-08-09 | 1997-02-18 | Nippon Maikuronikusu:Kk | Suction table of display panel |
| GB2383468A (en) * | 2001-08-30 | 2003-06-25 | Nec Corp | Wafer holder protecting wafer against electrostatic breakdown |
| JP2005017876A (en) * | 2003-06-27 | 2005-01-20 | Nsk Ltd | Workpiece chuck and its controlling method |
| WO2006090580A1 (en) * | 2005-02-24 | 2006-08-31 | Fujifilm Corporation | Method and mechanism for positioning and holding sheet body and drawing device using the method and the mechanism |
| JP2006319093A (en) * | 2005-05-12 | 2006-11-24 | Dainippon Screen Mfg Co Ltd | Substrate heat treatment apparatus |
| JP2007148414A (en) * | 2006-12-14 | 2007-06-14 | Nsk Ltd | Workpiece chuck and its controlling method |
| JP2007148462A (en) * | 2007-03-19 | 2007-06-14 | Nsk Ltd | Workpiece chuck and its controlling method |
| JP2007184572A (en) * | 2005-12-29 | 2007-07-19 | Au Optronics Corp | Apparatus for treating substrate, and base thereof |
| JP2007219537A (en) * | 2007-03-19 | 2007-08-30 | Nsk Ltd | Work chuck and its control method |
| JP2007258443A (en) * | 2006-03-23 | 2007-10-04 | Dainippon Screen Mfg Co Ltd | Heat treatment apparatus, and substrate sucking method |
| JP2010110858A (en) * | 2008-11-06 | 2010-05-20 | Disco Abrasive Syst Ltd | Holding table and cutting device |
| KR101337988B1 (en) * | 2006-09-07 | 2013-12-09 | 엘아이지에이디피 주식회사 | plasma processing apparatus and method for processing substrate using thereof |
-
1992
- 1992-10-12 JP JP27215192A patent/JPH06123924A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0950248A (en) * | 1995-08-09 | 1997-02-18 | Nippon Maikuronikusu:Kk | Suction table of display panel |
| GB2383468A (en) * | 2001-08-30 | 2003-06-25 | Nec Corp | Wafer holder protecting wafer against electrostatic breakdown |
| JP2005017876A (en) * | 2003-06-27 | 2005-01-20 | Nsk Ltd | Workpiece chuck and its controlling method |
| WO2006090580A1 (en) * | 2005-02-24 | 2006-08-31 | Fujifilm Corporation | Method and mechanism for positioning and holding sheet body and drawing device using the method and the mechanism |
| JP2006235238A (en) * | 2005-02-24 | 2006-09-07 | Fuji Photo Film Co Ltd | Sheet object positioning and holding method and mechanism, and drawing system using the same |
| JP2006319093A (en) * | 2005-05-12 | 2006-11-24 | Dainippon Screen Mfg Co Ltd | Substrate heat treatment apparatus |
| JP4666473B2 (en) * | 2005-05-12 | 2011-04-06 | 大日本スクリーン製造株式会社 | Substrate heat treatment equipment |
| JP2007184572A (en) * | 2005-12-29 | 2007-07-19 | Au Optronics Corp | Apparatus for treating substrate, and base thereof |
| JP2007258443A (en) * | 2006-03-23 | 2007-10-04 | Dainippon Screen Mfg Co Ltd | Heat treatment apparatus, and substrate sucking method |
| KR101337988B1 (en) * | 2006-09-07 | 2013-12-09 | 엘아이지에이디피 주식회사 | plasma processing apparatus and method for processing substrate using thereof |
| JP2007148414A (en) * | 2006-12-14 | 2007-06-14 | Nsk Ltd | Workpiece chuck and its controlling method |
| JP2007219537A (en) * | 2007-03-19 | 2007-08-30 | Nsk Ltd | Work chuck and its control method |
| JP2007148462A (en) * | 2007-03-19 | 2007-06-14 | Nsk Ltd | Workpiece chuck and its controlling method |
| JP2010110858A (en) * | 2008-11-06 | 2010-05-20 | Disco Abrasive Syst Ltd | Holding table and cutting device |
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