JPH05188583A - Pellicle - Google Patents
PellicleInfo
- Publication number
- JPH05188583A JPH05188583A JP614392A JP614392A JPH05188583A JP H05188583 A JPH05188583 A JP H05188583A JP 614392 A JP614392 A JP 614392A JP 614392 A JP614392 A JP 614392A JP H05188583 A JPH05188583 A JP H05188583A
- Authority
- JP
- Japan
- Prior art keywords
- pellicle
- frame
- reticle
- film
- foreign matter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、投影露光に用いるレチ
クルやマスクに貼りつけられるペリクルの構造に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a pellicle attached to a reticle or mask used for projection exposure.
【０００２】半導体装置の製造工程において、ウエーハ
上にパターンをステッパーやアライナーを用い投影手段
で転写する際には、転写原盤としてレチクルやマスクが
用いられるが、この場合レチクルやマスクに異物が付着
していると、この異物が転写されて転写パターンに欠陥
を生じが不良になる。In a semiconductor device manufacturing process, when a pattern is transferred onto a wafer by a projection means using a stepper or an aligner, a reticle or a mask is used as a transfer master. In this case, foreign matter is attached to the reticle or the mask. If this occurs, the foreign matter is transferred and a defect is caused in the transfer pattern, resulting in a defect.
【０００３】そこで、室内雰囲気等から堆積付着する上
記異物をレチクルやマスク面から離れたデフォーカス面
に付着させて、異物の転写を防止する役目を果たすのが
ペリクルであるが、このペリクルを使用しても、ペリク
ル内への異物の侵入、ステッパーやアライナーの解像度
向上等により、異物の転写は跡を絶たず改善が望まれて
いる。Therefore, it is the pellicle that serves to prevent the transfer of the foreign matter by adhering the above-mentioned foreign matter deposited and adhered from the indoor atmosphere or the like to the defocus surface away from the reticle and the mask surface. However, due to the intrusion of foreign matter into the pellicle and the improvement in the resolution of the stepper and aligner, the transfer of foreign matter is continuously desired to be improved.
【０００４】[0004]
【従来の技術】図３は従来のペリクルのマウント（装
着）状態を示す模式図で、(a) は平面図、(b) はＡ−Ａ
断面図である。2. Description of the Related Art FIG. 3 is a schematic view showing a conventional pellicle mounted state, in which (a) is a plan view and (b) is AA.
FIG.
【０００５】同図において、51はレチクル（またはマス
ク）基板、52はエボキシ樹脂等からなるペリクル枠、53
はニトロセルローズ等よりなるペリクル膜、54はペリク
ル枠52にペリクル膜53を固着する第１の接着材、55はペ
リクル枠52をレチクル基板51面に固着する第２の接着材
を示す。In the figure, 51 is a reticle (or mask) substrate, 52 is a pellicle frame made of an epoxy resin, and 53.
Is a pellicle film made of nitrocellulose or the like, 54 is a first adhesive material for fixing the pellicle film 53 to the pellicle frame 52, and 55 is a second adhesive material for fixing the pellicle frame 52 to the surface of the reticle substrate 51.
【０００６】この図のように従来のペリクル56はペリク
ル膜53が樹脂製のペリクル枠52に接着固着さた構造を有
し、レチクル基板51に対し接着材55により固着された状
態でレチクル基板51と共に保管、移動及び露光が行われ
ていた。そして、上記工程中に堆積付着する異物をレチ
クル基板51から離間したペリクル膜53上のデフォーカス
面に堆積付着させることによって、上記異物に起因する
パターンの転写不良発生の防止がなされていた。As shown in the figure, a conventional pellicle 56 has a structure in which a pellicle film 53 is adhered and fixed to a resin-made pellicle frame 52, and the reticle substrate 51 is fixed to the reticle substrate 51 with an adhesive material 55. It was stored, moved, and exposed together. Then, by depositing and adhering foreign matter deposited and adhered during the above process on the defocus surface on the pellicle film 53 separated from the reticle substrate 51, the occurrence of pattern transfer failure due to the foreign matter is prevented.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、上記の
ような従来のペリクルは、ペリクル56がレチクル基板51
上に接着材55によって接着マウントされる方式であるた
めに、接着に際して発生し勝ちな接着材55に起因する異
物57や接着の際の雰囲気に混在していた異物57は、ペリ
クル56内の空洞部58に閉じ込められた儘になり、これら
の異物57が露光時に帯電移動してレチクル基板51上に付
着し、この異物57の付着によって転写パターンに欠陥を
生ずるという問題があった。またペリクル56の接着が不
完全な場合には、その隙間からペリクル56内の空洞部58
に外部雰囲気中から異物57が侵入するという問題も生じ
ていた。However, in the conventional pellicle as described above, the pellicle 56 is the reticle substrate 51.
Since the method is adhesively mounted on the upper side by the adhesive material 55, the foreign material 57 caused by the adhesive material 55 that tends to occur during bonding and the foreign material 57 mixed in the atmosphere at the time of bonding are cavities in the pellicle 56. There is a problem that the foreign matter 57 becomes trapped in the portion 58 and these foreign matters 57 are charged and moved during exposure and adhere to the reticle substrate 51, and the adhesion of the foreign matter 57 causes a defect in the transfer pattern. If the pellicle 56 is not completely adhered, the cavity 58 inside the pellicle 56 will be removed through the gap.
Another problem is that the foreign matter 57 enters from the outside atmosphere.
【０００８】更にまた、近時、ステッパーやアライナー
の解像度の向上に伴い、ペリクル膜上に付着した異物も
投影され易くなってきているが、従来の接着方式のペリ
クルにおいては、ペリクル接着後即ちペリクルマウント
後の洗浄が困難なため、ペリクル膜上に投影されるよう
な大きさの異物が付着したペリクルマウント体は、接着
用の樹脂を溶解してレチクル若しくはマスク基板面から
ペリクルを剥離し、新たなペリクルを接着して使用しな
ければならず、このペリクル貼り代えに多大の時間と工
数を要するという問題もあった。Further, recently, as the resolution of the stepper and the aligner is improved, the foreign matters attached to the pellicle film are also more likely to be projected. However, in the conventional adhesion type pellicle, after the pellicle adhesion, that is, the pellicle. Since it is difficult to clean after mounting, the pellicle mount body with foreign matter of a size projected on the pellicle film dissolves the adhesive resin and peels off the pellicle from the reticle or mask substrate surface. There is also a problem that it is necessary to bond and use such a pellicle, and it takes a lot of time and man-hours to replace the pellicle.
【０００９】そこで、本発明は、レチクル若しくはマス
ク基板上にペリクルを固着するペリクルマウントの際の
ペリクル内の空洞部に閉じ込められる異物の量をできる
だけ少なく抑えると同時にペリクルマウント後に外部か
ら侵入する異物をなくし、且つ前記空洞部に滞留する異
物が帯電してレチクル若しくはマスク基板上に付着する
のを防止し、且つ異物汚染したペリクル膜の清浄な膜へ
の張替えを容易にし、異物付着に起因する転写パターン
の欠陥不良を防止することを目的とする。Therefore, according to the present invention, the amount of foreign matter trapped in the cavity of the pellicle during the pellicle mount for fixing the pellicle on the reticle or mask substrate is suppressed as much as possible, and at the same time, the foreign matter entering from the outside after the pellicle mount is mounted. Transferring due to foreign matter adhesion is eliminated, and foreign matter staying in the cavity is prevented from being charged and adhered to the reticle or mask substrate, and the pellicle film contaminated with foreign matter is easily replaced with a clean film. The purpose is to prevent defective defects of the pattern.
【００１０】[0010]
【課題を解決するための手段】上記課題の解決は、導電
性樹脂からなり、一方の開口面にマスク基板に対する真
空吸着手段を有し且つ他方の開口面にペリクル膜張着面
を有するペリクル枠と、該ペリクル枠のペリクル膜張着
面側に、該ペリクル枠に外挿される締めつけ枠により張
着されたペリクル膜とを有してなり、露光時に該ペリク
ル枠に電位が付与される本発明によるペリクルによって
達成される。To solve the above-mentioned problems, a pellicle frame made of a conductive resin, having a vacuum suction means for a mask substrate on one opening surface and a pellicle film sticking surface on the other opening surface. And a pellicle film adhered to the pellicle film-adhering surface side of the pellicle frame by a tightening frame externally inserted to the pellicle frame, and a potential is applied to the pellicle frame during exposure. Achieved by pellicle by.
【００１１】[0011]
【作用】即ち本発明のペリクルにおいては、レチクル若
しくはマスク基板上へのマウント方式を真空吸着方式に
し、これによってペリクルのマウント及び取外しを容易
にしてペリクル内部に侵入した異物の除去を可能にする
と共に、接着材に起因する異物の発生を回避した。That is, in the pellicle of the present invention, the mounting method on the reticle or the mask substrate is a vacuum suction method, which facilitates the mounting and removal of the pellicle and enables the removal of foreign matter that has penetrated into the pellicle. The generation of foreign matter due to the adhesive material was avoided.
【００１２】またペリクル枠上へのペリクル膜の張着を
接着で行わず外挿枠による締めつけ方式にすることによ
り異物汚染したペリクル膜の清浄なペリクル膜への張替
えを容易にした。Further, the pellicle film is not attached to the pellicle frame by adhesion, but by a tightening method using an outer frame, the pellicle film contaminated with foreign matter can be easily replaced with a clean pellicle film.
【００１３】更にまた、ペリクル枠に導電性樹脂を使用
し、このペリクル枠に電位を付与することにより、ペリ
クル内部の帯電した異物粒子をペリクル枠上に引きつ
け、異物粒子がペリクル内の空間部で移動してレチクル
若しくはマスク面に付着するのを防止した。Furthermore, a conductive resin is used for the pellicle frame, and a potential is applied to the pellicle frame, so that the charged foreign particles inside the pellicle are attracted onto the pellicle frame, and the foreign particles are generated in the space inside the pellicle. It was prevented from moving and adhering to the reticle or mask surface.
【００１４】以上によりペリクルの内部及びペリクル膜
上に存在する異物粒子の量を減少させると同時に、ペリ
クル内に滞留する異物粒子のレチクル若しくはマスク面
への付着も防止されて、異物の投影による転写パターン
の欠陥が防止される。As described above, the amount of foreign particles existing inside the pellicle and on the pellicle film is reduced, and at the same time, the foreign particles remaining in the pellicle are prevented from adhering to the reticle or the mask surface. Pattern defects are prevented.
【００１５】[0015]
【実施例】以下本発明を、図示実施例により具体的に説
明する。図１は本発明に係るペリクルの一実施例の模式
図で、(a) はペリクル平面図、(b) はペリクルＡ−Ａ断
面図、(c) はペリクルマウント断面図、図２は本発明に
係るペリクルの他の実施例の模式図で、(a) はペリクル
平面図、(b) はペリクルＡ−Ａ断面図、(c) はペリクル
マウント断面図である。全図を通じ同一対象物は同一符
合で示す。EXAMPLES The present invention will be described in detail below with reference to illustrated examples. FIG. 1 is a schematic view of an embodiment of a pellicle according to the present invention. (A) is a pellicle plan view, (b) is a pellicle A-A sectional view, (c) is a pellicle mount sectional view, and FIG. 2 is the present invention. 6A and 6B are schematic views of another embodiment of the pellicle according to the present invention. FIG. 7A is a pellicle plan view, FIG. 7B is a pellicle AA sectional view, and FIG. The same object is denoted by the same reference numeral throughout the drawings.
【００１６】本発明に係るペリクル２は例えば図１(a)
及び(b) に示すように、導電体フィラー等の混入により
導電性が付与された導電性樹脂からなるペリクル枠３の
一方の開口面S1側に、この枠面に沿って開口部を有する
枠状の凹部４が設けられ、この凹部４から側壁を貫通し
てペリクル枠３の外側にリークバルブを兼ねる真空排気
用バルブ５が導出され、更にペリクル枠３の外部側面に
は給電端子６が設けられる。また、前記枠状の凹部４が
設けられる側のペリクル枠３の表面には前記凹部４の両
側に凹部４に沿って例えばオーリング等からなるリング
状の真空パッキン7A及び7Bが枠状に気密に固着される。
そして、このペリクル枠３の他方の開口面S2側にはニト
ロセルローズ或いはポリビニルアセタール等からなる厚
さ0.01ｍｍ程度のペリクル膜８がペリクル枠３に外挿さ
れる締めつけ枠９によって張設固定された構造を有す
る。A pellicle 2 according to the present invention is shown in FIG. 1 (a), for example.
As shown in (b) and (b), the pellicle frame 3 made of a conductive resin to which conductivity is imparted by mixing a conductor filler or the like is provided on one side of the opening surface S 1 of the pellicle frame 3 along the frame surface. A frame-shaped recess 4 is provided, a vacuum exhaust valve 5 that also functions as a leak valve is led out of the pellicle frame 3 through the side wall from the recess 4, and a power supply terminal 6 is provided on the outer side surface of the pellicle frame 3. It is provided. Further, on the surface of the pellicle frame 3 on the side where the frame-shaped recess 4 is provided, ring-shaped vacuum packings 7A and 7B made of, for example, O-rings are hermetically sealed on both sides of the recess 4 along the recess 4. Stuck to.
Then, on the other opening surface S 2 side of the pellicle frame 3, a pellicle film 8 made of nitrocellulose or polyvinyl acetal or the like and having a thickness of about 0.01 mm is stretched and fixed by a tightening frame 9 which is externally inserted into the pellicle frame 3. Have a structure.
【００１７】そして、ペリクルマウントに際しては、ク
リーンな雰囲気中で、図１(c) に示すようにレチクル
（またはマスク）基板１の一面上に上記ペリクル2Aを載
置し、ペリクル枠３から導出された真空排気用バルブ５
からペリクル枠３の凹部４内を真空に排気した後に前記
真空排気用バルブ５を閉じることにより、ペリクル2Aを
前記真空パッキン7A及び7Bを介してレチクル若しくはマ
スク基板１上に吸着固定させる。When mounting the pellicle, the pellicle 2A is placed on one surface of the reticle (or mask) substrate 1 as shown in FIG. 1 (c) in a clean atmosphere and led out from the pellicle frame 3. Vacuum exhaust valve 5
After the inside of the recess 4 of the pellicle frame 3 is evacuated to a vacuum, the vacuum evacuation valve 5 is closed, so that the pellicle 2A is adsorbed and fixed onto the reticle or the mask substrate 1 through the vacuum packings 7A and 7B.
【００１８】また、レチクル（またはマスク）基板１の
他面上にも上記一面上と同様に、上記一面側同様のペリ
クル2Bが吸着固定される。そして更に上記ペリクル2A、
2Bの導電性を有するペリクル枠３には給電端子６からプ
ラス或いはマイナスの電位が付与される。Further, a pellicle 2B similar to the above-mentioned one surface side is sucked and fixed onto the other surface of the reticle (or mask) substrate 1 as in the above-mentioned one surface. And further, the pellicle 2A,
A positive or negative potential is applied from the power supply terminal 6 to the pellicle frame 3 having the conductivity of 2B.
【００１９】本発明に係るペリクル12は例えば図２(a)
及び(b) に示すように構成することもできる。即ち、こ
の実施例においては、前記実施例同様導電性を有するペ
リクル枠13の一開口面S1側の枠状を有する表面に、この
表面に沿って、可撓性及び気密性を有する例えばゴム或
いは塩化ビニール等からなる枠状の吸盤14がその基部に
おいて接着材15等により固着されており、同ペリクル枠
13の他の開口面S2上に前記実施例同様にペリクル膜８
が、ペリクル枠13に外挿される締めつけ枠９によって張
設固定された構造を有する。A pellicle 12 according to the present invention is shown in FIG. 2 (a), for example.
It can also be configured as shown in (b). That is, in this embodiment, as in the case of the above-described embodiments, the pellicle frame 13 having a conductive surface has a frame-like surface on the side of the one opening surface S 1 , and along this surface, a flexible and airtight material such as rubber. Alternatively, a frame-shaped suction cup 14 made of vinyl chloride or the like is fixed at its base portion with an adhesive material 15 or the like, and the pellicle frame is the same.
The pellicle film 8 is formed on the other opening surface S 2 of 13 as in the previous embodiment.
However, it has a structure in which it is stretched and fixed by a tightening frame 9 which is externally inserted in the pellicle frame 13.
【００２０】ここで上記枠状吸盤は、所要の厚さの可撓
性を有するコム或いは塩化ビニールにより形成され、前
記のように、ペリクル枠13の一開口面S1側の枠状表面の
全面に沿って配設されるような枠状を有し、ペリクル枠
13に接着される基部の底面14A がペリクル枠13の前記枠
状表面に沿うように平坦に形成され、この基部からこの
吸盤の開口する先端面14B に向かって大きな鈍角の開口
角を有してラッパ状に拡がった形状を有し、その先端面
14B がレチクル（またはマスク）基板１に圧着した際に
レチクル（またはマスク）基板面に気密に密着するよう
な所定の角度で平坦に研摩されている。Here, the frame-shaped suction cup is formed of a flexible comb or vinyl chloride having a required thickness, and as described above, the entire frame-shaped surface on the side of one opening surface S 1 of the pellicle frame 13 is formed. Has a frame shape that is arranged along the
The bottom surface 14A of the base that is adhered to 13 is formed flat along the frame-shaped surface of the pellicle frame 13, and has a large obtuse opening angle from this base toward the front end surface 14B of the suction cup. It has a flared shape and its tip surface
14B is flatly ground at a predetermined angle so as to be airtightly adhered to the surface of the reticle (or mask) substrate when pressure-bonded to the reticle (or mask) substrate 1.
【００２１】そしてペリクルマウントは、同図(c) に示
すように、レチクル若しくはマスク基板１上にペリクル
12を吸盤14面を介して圧接する。これにより、吸盤14の
内側に形成される空洞部15が押しつぶされ、吸盤14の復
元力により前記空洞部15が減圧状態になってペリクル12
は上記吸盤14と共にレチクル（またはマスク）基板１上
に固着される。なおこのペリクルの固着保持時間を、吸
盤14の材質、肉圧、形状等を適切に選択することによ
り、１時間程度の連続露光時間には十分に耐えるように
することは容易である。The pellicle mount is mounted on the reticle or mask substrate 1 as shown in FIG.
12 is pressed against the suction cup 14 surface. As a result, the cavity 15 formed inside the suction cup 14 is crushed, and the cavity 15 is decompressed by the restoring force of the suction cup 14 and the pellicle 12
Is fixed on the reticle (or mask) substrate 1 together with the suction cup 14. It should be noted that it is easy to make the pellicle sticking and holding time sufficiently endure the continuous exposure time of about 1 hour by appropriately selecting the material, the wall pressure, the shape and the like of the suction cup 14.
【００２２】また、露光に際して、導電性を有するペリ
クル枠12に給電端子６を介して電位が付与されるのは、
前記実施例と同様である。During exposure, a potential is applied to the conductive pellicle frame 12 via the power supply terminal 6,
This is similar to the above embodiment.
【００２３】[0023]
【発明の効果】以上実施例に示したように本発明に係る
ペリクルにおいては、レチクル若しくはマスク基板面へ
のペリクルの固着が真空吸着手段によってなされる。従
ってペリクルを前記基板面に固着する際に接着材等によ
る異物の発生がなく、且つ雰囲気中からペリクル内に異
物が侵入した際にも容易にペリクルを剥離して除去し再
固着することができる。従ってペリクル内に存在する異
物の量を従来に比べ大幅に減少させることができる。As described in the above embodiments, in the pellicle according to the present invention, the pellicle is fixed to the surface of the reticle or the mask substrate by the vacuum suction means. Therefore, when the pellicle is fixed to the surface of the substrate, no foreign matter is generated by an adhesive or the like, and even when the foreign matter enters the pellicle from the atmosphere, the pellicle can be easily peeled and removed to be fixed again. .. Therefore, the amount of foreign matter existing in the pellicle can be significantly reduced as compared with the conventional case.
【００２４】また、ペリクル膜の張着が接着によらず締
めつけ枠によってなされるので、ペリクル膜が異物汚染
した際に清浄なペリクル膜との張り代えが可能且つ容易
で、ペリクル膜に付着する異物の量を大幅に減少でき
る。Further, since the pellicle film is adhered to the pellicle film by the tightening frame instead of adhering, it can be easily and easily replaced with a clean pellicle film when the pellicle film is contaminated with foreign matter. The amount of can be greatly reduced.
【００２５】更にまた、ペリクル枠を導電性にし、この
ペリクル枠に電位が付与されるので、除去しきれずペリ
クル内に残留し帯電した異物粒子をレチクル若しくはマ
スク基板から引き離してペリクル枠側に引きつけ固定さ
せる。Furthermore, since the pellicle frame is made electrically conductive and a potential is applied to the pellicle frame, the foreign particles remaining in the pellicle that cannot be completely removed and are charged are separated from the reticle or the mask substrate and attracted and fixed to the pellicle frame side. Let
【００２６】以上により本発明のペリクルによれば、投
影露光に際しレチクル若しくはマスク基板上に付着する
異物粒子の量は激減し、この基板上の異物粒子に起因す
る転写パターンの欠陥は従来に比べ大幅に減少する。As described above, according to the pellicle of the present invention, the amount of foreign particles adhering to the reticle or the mask substrate during projection exposure is drastically reduced, and the defects of the transfer pattern due to the foreign particles on the substrate are significantly larger than those in the prior art. Decrease to.
【００２７】また、ペリクルマウントが接着方式でなく
真空吸着方式なので、ペリクルの取外し交換が容易にな
り、ペリクルマウント工数が大幅に減少する。従って本
発明は、微細化される高集積度の半導体装置の歩留り及
び信頼性の向上、工数削減に寄与するところが大きい。Further, since the pellicle mount is a vacuum suction type instead of an adhesive type, it is easy to remove and replace the pellicle, and the pellicle mount man-hour is greatly reduced. Therefore, the present invention greatly contributes to improvement in yield and reliability of the highly integrated semiconductor device which is miniaturized and reduction in the number of steps.
【図１】 本発明に係るペリクルの一実施例の模式図FIG. 1 is a schematic view of an embodiment of a pellicle according to the present invention.
【図２】 本発明に係るペリクルの他の実施例の模式図FIG. 2 is a schematic view of another embodiment of the pellicle according to the present invention.
【図３】 従来のペリクルの模式図FIG. 3 is a schematic diagram of a conventional pellicle
１ レチクル（またはマスク）基板 ２、2A、2B ペリクル ３ ペリクル枠 ４ 枠状の凹部 ５ 真空排気用バルブ ６ 給電端子 7A、7B 真空パッキン ８ ペリクル膜 ９ 締めつけ枠 1 reticle (or mask) substrate 2, 2A, 2B pellicle 3 pellicle frame 4 frame-shaped recess 5 vacuum exhaust valve 6 power supply terminals 7A, 7B vacuum packing 8 pellicle film 9 tightening frame
Claims (3)
チクル若しくはマスク基板に対する真空吸着手段を有
し、他方の開口面にペリクル膜張着面を有するペリクル
枠と、 該ペリクル枠のペリクル膜張着面側に、該ペリクル枠に
外挿される締めつけ枠により張着されたペリクル膜とを
有してなり、 露光時に該ペリクル枠に電位が付与されることを特徴と
するペリクル。1. A pellicle frame made of a conductive resin, having a vacuum suction means for a reticle or a mask substrate on one opening surface, and a pellicle film attachment surface on the other opening surface, and a pellicle film of the pellicle frame. A pellicle characterized by comprising a pellicle film attached to the attachment surface side by a tightening frame that is externally inserted into the pellicle frame, and a potential is applied to the pellicle frame during exposure.
一方の枠面に該枠面に沿って設けた枠状の凹部と、該凹
部の開口部の周囲に固着されたパッキン材と該凹部から
該ペリクル枠内を介して導出された真空排気兼リーク用
のバルブにより構成されていることを特徴とする請求項
１記載のペリクル。2. The vacuum suction means comprises a frame-shaped recess provided on the one frame surface of the pellicle frame along the frame surface, and a packing material fixed around the opening of the recess. 2. The pellicle according to claim 1, wherein the pellicle is composed of a valve for vacuum exhaustion and leakage, which is led out from the concave portion through the inside of the pellicle frame.
一方の枠面に該枠面に沿って固着配設した枠状の可撓性
吸盤よりなることを特徴とする請求項１記載のペリク
ル。3. The vacuum suction means comprises a frame-shaped flexible suction cup fixedly arranged on the one frame surface of the pellicle frame along the frame surface. Pellicle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP614392A JPH05188583A (en) | 1992-01-17 | 1992-01-17 | Pellicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP614392A JPH05188583A (en) | 1992-01-17 | 1992-01-17 | Pellicle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05188583A true JPH05188583A (en) | 1993-07-30 |
Family
ID=11630297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP614392A Withdrawn JPH05188583A (en) | 1992-01-17 | 1992-01-17 | Pellicle |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05188583A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000036467A1 (en) * | 1998-12-14 | 2000-06-22 | Koninklijke Philips Electronics N.V. | Photomask provided with an esd-precluding envelope |
| WO2006006318A1 (en) * | 2004-06-02 | 2006-01-19 | Hoya Corporation | Mask blank, manufacturing method thereof and transfer plate manufacturing method |
| US20130021594A1 (en) * | 2011-07-22 | 2013-01-24 | Canon Kabushiki Kaisha | Exposure apparatus and device manufacturing method |
| WO2015174412A1 (en) * | 2014-05-16 | 2015-11-19 | 三井化学株式会社 | Pellicle frame, pellicle, frame member, exposure original plate, exposure device, and method for manufacturing semiconductor device |
| CN108873601A (en) * | 2017-05-10 | 2018-11-23 | 台湾积体电路制造股份有限公司 | Cuticula |
| CN112305854A (en) * | 2019-07-31 | 2021-02-02 | 台湾积体电路制造股份有限公司 | Lithographic apparatus, method of mounting a mask protection film, and method of manufacturing a wafer |
-
1992
- 1992-01-17 JP JP614392A patent/JPH05188583A/en not_active Withdrawn
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6309781B1 (en) | 1998-12-14 | 2001-10-30 | U.S. Philips Corporation | Photomask provided with an ESD-precluding envelope |
| WO2000036467A1 (en) * | 1998-12-14 | 2000-06-22 | Koninklijke Philips Electronics N.V. | Photomask provided with an esd-precluding envelope |
| WO2006006318A1 (en) * | 2004-06-02 | 2006-01-19 | Hoya Corporation | Mask blank, manufacturing method thereof and transfer plate manufacturing method |
| US9523926B2 (en) * | 2011-07-22 | 2016-12-20 | Canon Kabushiki Kaisha | Exposure apparatus and device manufacturing method |
| US20130021594A1 (en) * | 2011-07-22 | 2013-01-24 | Canon Kabushiki Kaisha | Exposure apparatus and device manufacturing method |
| JPWO2015174412A1 (en) * | 2014-05-16 | 2017-04-20 | 三井化学株式会社 | Pellicle frame, pellicle, frame member, exposure original plate, exposure apparatus, and semiconductor device manufacturing method |
| WO2015174412A1 (en) * | 2014-05-16 | 2015-11-19 | 三井化学株式会社 | Pellicle frame, pellicle, frame member, exposure original plate, exposure device, and method for manufacturing semiconductor device |
| CN108873601A (en) * | 2017-05-10 | 2018-11-23 | 台湾积体电路制造股份有限公司 | Cuticula |
| US10670959B2 (en) * | 2017-05-10 | 2020-06-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pellicle and method of using the same |
| TWI731114B (en) * | 2017-05-10 | 2021-06-21 | 台灣積體電路製造股份有限公司 | Pellicle and method for using pellicle |
| US11506971B2 (en) | 2017-05-10 | 2022-11-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pellicle and method of using the same |
| US11868041B2 (en) | 2017-05-10 | 2024-01-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pellicle and method of using the same |
| CN112305854A (en) * | 2019-07-31 | 2021-02-02 | 台湾积体电路制造股份有限公司 | Lithographic apparatus, method of mounting a mask protection film, and method of manufacturing a wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990408 |