JPH0610675Y2 - プラズマ処理装置 - Google Patents

プラズマ処理装置

Info

Publication number
JPH0610675Y2
JPH0610675Y2 JP1988037183U JP3718388U JPH0610675Y2 JP H0610675 Y2 JPH0610675 Y2 JP H0610675Y2 JP 1988037183 U JP1988037183 U JP 1988037183U JP 3718388 U JP3718388 U JP 3718388U JP H0610675 Y2 JPH0610675 Y2 JP H0610675Y2
Authority
JP
Japan
Prior art keywords
vacuum chamber
plasma
cover
counter electrode
electric resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988037183U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01140821U (US06521211-20030218-C00004.png
Inventor
藤次 中対
豊 掛樋
成一 渡辺
則男 仲里
啓治 植山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1988037183U priority Critical patent/JPH0610675Y2/ja
Publication of JPH01140821U publication Critical patent/JPH01140821U/ja
Application granted granted Critical
Publication of JPH0610675Y2 publication Critical patent/JPH0610675Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)
JP1988037183U 1988-03-23 1988-03-23 プラズマ処理装置 Expired - Lifetime JPH0610675Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988037183U JPH0610675Y2 (ja) 1988-03-23 1988-03-23 プラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988037183U JPH0610675Y2 (ja) 1988-03-23 1988-03-23 プラズマ処理装置

Publications (2)

Publication Number Publication Date
JPH01140821U JPH01140821U (US06521211-20030218-C00004.png) 1989-09-27
JPH0610675Y2 true JPH0610675Y2 (ja) 1994-03-16

Family

ID=31263762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988037183U Expired - Lifetime JPH0610675Y2 (ja) 1988-03-23 1988-03-23 プラズマ処理装置

Country Status (1)

Country Link
JP (1) JPH0610675Y2 (US06521211-20030218-C00004.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2554039Y2 (ja) * 1991-11-01 1997-11-12 三洋電機株式会社 半導体薄膜形成装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6056431B2 (ja) * 1980-10-09 1985-12-10 三菱電機株式会社 プラズマエツチング装置
JPS58197733A (ja) * 1982-05-14 1983-11-17 Hitachi Ltd 半導体デバイス製造装置

Also Published As

Publication number Publication date
JPH01140821U (US06521211-20030218-C00004.png) 1989-09-27

Similar Documents

Publication Publication Date Title
US5269881A (en) Plasma processing apparatus and plasma cleaning method
KR100745942B1 (ko) 유도 결합 플라즈마 처리 장치
JPH08339984A (ja) プラズマ処理装置
EP0841838B1 (en) Plasma treatment apparatus and plasma treatment method
JPH0610675Y2 (ja) プラズマ処理装置
US4909183A (en) Apparatus for plasma CVD
JP2641463B2 (ja) プラズマ処理装置
JPH06236858A (ja) プラズマ処理装置
JPS60245213A (ja) プラズマ処理装置
JPH10302997A (ja) プラズマ処理装置
JPS61159572A (ja) 連続スパツタ装置
JPH0528757Y2 (US06521211-20030218-C00004.png)
JPS63254731A (ja) プラズマ処理装置
JP3401104B2 (ja) 半導体成膜装置
JP2586081Y2 (ja) プラズマ処理装置
JPS6068619A (ja) プラズマcvd装置
JPS643338B2 (US06521211-20030218-C00004.png)
JPS62270777A (ja) プラズマcvd装置
JP2001168037A (ja) プラズマ処理装置
JPS58175823A (ja) プラズマ気相成長装置の反応管
JPH0666297B2 (ja) 減圧処理装置及びその絶縁物容器
JPS58117870A (ja) 皮膜形成装置
JPH05335262A (ja) プラズマ処理装置
JPS6128372B2 (US06521211-20030218-C00004.png)
JPH0350723A (ja) プラズマエッチング装置