JPH059957B2 - - Google Patents
Info
- Publication number
- JPH059957B2 JPH059957B2 JP63025913A JP2591388A JPH059957B2 JP H059957 B2 JPH059957 B2 JP H059957B2 JP 63025913 A JP63025913 A JP 63025913A JP 2591388 A JP2591388 A JP 2591388A JP H059957 B2 JPH059957 B2 JP H059957B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- forming
- substrate
- electrical components
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 26
- 238000007639 printing Methods 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 238000000206 photolithography Methods 0.000 claims 2
- 239000011810 insulating material Substances 0.000 claims 1
- 239000004973 liquid crystal related substance Substances 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 12
- 239000011229 interlayer Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 230000002950 deficient Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4685—Manufacturing of cross-over conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63025913A JPH01201989A (ja) | 1988-02-05 | 1988-02-05 | 絶縁基板上の配線形成方法 |
US07/303,241 US4934045A (en) | 1988-02-05 | 1989-01-30 | Method of producing electric circuit patterns |
US07/495,758 US5072519A (en) | 1988-02-03 | 1990-03-19 | Method of producing electric circuit patterns |
US07/495,757 US5025555A (en) | 1988-02-05 | 1990-03-19 | Method of producing electric circuit patterns |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63025913A JPH01201989A (ja) | 1988-02-05 | 1988-02-05 | 絶縁基板上の配線形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01201989A JPH01201989A (ja) | 1989-08-14 |
JPH059957B2 true JPH059957B2 (ko) | 1993-02-08 |
Family
ID=12179016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63025913A Granted JPH01201989A (ja) | 1988-02-03 | 1988-02-05 | 絶縁基板上の配線形成方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01201989A (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100644804B1 (ko) * | 1999-11-16 | 2006-11-13 | 삼성전자주식회사 | 액정표시장치 및 이의 조립방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5427957A (en) * | 1977-08-03 | 1979-03-02 | Canon Kk | Multiilayer wiring |
JPS582037A (ja) * | 1981-06-29 | 1983-01-07 | Oki Electric Ind Co Ltd | Ic等の実装方法 |
-
1988
- 1988-02-05 JP JP63025913A patent/JPH01201989A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5427957A (en) * | 1977-08-03 | 1979-03-02 | Canon Kk | Multiilayer wiring |
JPS582037A (ja) * | 1981-06-29 | 1983-01-07 | Oki Electric Ind Co Ltd | Ic等の実装方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH01201989A (ja) | 1989-08-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |