JPH01201989A - 絶縁基板上の配線形成方法 - Google Patents

絶縁基板上の配線形成方法

Info

Publication number
JPH01201989A
JPH01201989A JP63025913A JP2591388A JPH01201989A JP H01201989 A JPH01201989 A JP H01201989A JP 63025913 A JP63025913 A JP 63025913A JP 2591388 A JP2591388 A JP 2591388A JP H01201989 A JPH01201989 A JP H01201989A
Authority
JP
Japan
Prior art keywords
wiring
group
chip
liquid crystal
wiring group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63025913A
Other languages
English (en)
Japanese (ja)
Other versions
JPH059957B2 (ko
Inventor
Akira Mase
晃 間瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP63025913A priority Critical patent/JPH01201989A/ja
Priority to US07/303,241 priority patent/US4934045A/en
Publication of JPH01201989A publication Critical patent/JPH01201989A/ja
Priority to US07/495,757 priority patent/US5025555A/en
Priority to US07/495,758 priority patent/US5072519A/en
Publication of JPH059957B2 publication Critical patent/JPH059957B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP63025913A 1988-02-03 1988-02-05 絶縁基板上の配線形成方法 Granted JPH01201989A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP63025913A JPH01201989A (ja) 1988-02-05 1988-02-05 絶縁基板上の配線形成方法
US07/303,241 US4934045A (en) 1988-02-05 1989-01-30 Method of producing electric circuit patterns
US07/495,757 US5025555A (en) 1988-02-05 1990-03-19 Method of producing electric circuit patterns
US07/495,758 US5072519A (en) 1988-02-03 1990-03-19 Method of producing electric circuit patterns

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63025913A JPH01201989A (ja) 1988-02-05 1988-02-05 絶縁基板上の配線形成方法

Publications (2)

Publication Number Publication Date
JPH01201989A true JPH01201989A (ja) 1989-08-14
JPH059957B2 JPH059957B2 (ko) 1993-02-08

Family

ID=12179016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63025913A Granted JPH01201989A (ja) 1988-02-03 1988-02-05 絶縁基板上の配線形成方法

Country Status (1)

Country Link
JP (1) JPH01201989A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100644804B1 (ko) * 1999-11-16 2006-11-13 삼성전자주식회사 액정표시장치 및 이의 조립방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5427957A (en) * 1977-08-03 1979-03-02 Canon Kk Multiilayer wiring
JPS582037A (ja) * 1981-06-29 1983-01-07 Oki Electric Ind Co Ltd Ｉｃ等の実装方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5427957A (en) * 1977-08-03 1979-03-02 Canon Kk Multiilayer wiring
JPS582037A (ja) * 1981-06-29 1983-01-07 Oki Electric Ind Co Ltd Ｉｃ等の実装方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100644804B1 (ko) * 1999-11-16 2006-11-13 삼성전자주식회사 액정표시장치 및 이의 조립방법

Also Published As

Publication number Publication date
JPH059957B2 (ko) 1993-02-08

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