JPH0588887B2 - - Google Patents

Info

Publication number
JPH0588887B2
JPH0588887B2 JP19071088A JP19071088A JPH0588887B2 JP H0588887 B2 JPH0588887 B2 JP H0588887B2 JP 19071088 A JP19071088 A JP 19071088A JP 19071088 A JP19071088 A JP 19071088A JP H0588887 B2 JPH0588887 B2 JP H0588887B2
Authority
JP
Japan
Prior art keywords
resin
polymer
vinyl
epoxy resin
silicone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP19071088A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0241353A (ja
Inventor
Koichi Machida
Mikio Kitahara
Takayuki Kubo
Motoyuki Torikai
Kotaro Asahina
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Priority to JP19071088A priority Critical patent/JPH0241353A/ja
Publication of JPH0241353A publication Critical patent/JPH0241353A/ja
Publication of JPH0588887B2 publication Critical patent/JPH0588887B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP19071088A 1988-08-01 1988-08-01 半導体封止用樹脂組成物 Granted JPH0241353A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19071088A JPH0241353A (ja) 1988-08-01 1988-08-01 半導体封止用樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19071088A JPH0241353A (ja) 1988-08-01 1988-08-01 半導体封止用樹脂組成物

Publications (2)

Publication Number Publication Date
JPH0241353A JPH0241353A (ja) 1990-02-09
JPH0588887B2 true JPH0588887B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-12-24

Family

ID=16262547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19071088A Granted JPH0241353A (ja) 1988-08-01 1988-08-01 半導体封止用樹脂組成物

Country Status (1)

Country Link
JP (1) JPH0241353A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9916160B2 (en) 2009-12-26 2018-03-13 Intel Corporation Rotate instructions that complete execution either without writing or reading flags

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1025417A (ja) * 1996-07-08 1998-01-27 Toray Dow Corning Silicone Co Ltd 硬化性液状組成物、その硬化物、および電子部品
JP4971824B2 (ja) * 2007-02-21 2012-07-11 パナソニック株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP6016023B2 (ja) 2012-12-25 2016-10-26 パナソニックＩｐマネジメント株式会社 バリカンの刃、及びバリカンの刃を備えたバリカン

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9916160B2 (en) 2009-12-26 2018-03-13 Intel Corporation Rotate instructions that complete execution either without writing or reading flags
US9940130B2 (en) 2009-12-26 2018-04-10 Intel Corporation Rotate instructions that complete execution either without writing or reading flags
US9940131B2 (en) 2009-12-26 2018-04-10 Intel Corporation Rotate instructions that complete execution either without writing or reading flags

Also Published As

Publication number Publication date
JPH0241353A (ja) 1990-02-09

Similar Documents

Publication Publication Date Title
JP2669247B2 (ja) 熱硬化性樹脂組成物
JPH04359911A (ja) 熱硬化性樹脂組成物
JPH0531883B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
US5082880A (en) Semiconductor sealing composition containing epoxy resin and polymaleimide
US5120803A (en) Resin compositions for sealing semiconductor
JP2815408B2 (ja) 半導体封止用樹脂組成物
JPH0588887B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2823704B2 (ja) 半導体封止用樹脂組成物
JPH0232117A (ja) 半導体封止用樹脂組成物
JPH02212554A (ja) 半導体封止用樹脂組成物
JPH0238413A (ja) 半導体封止用樹脂組成物
JPH0234623A (ja) 半導体封止用樹脂組成物
JPH0236219A (ja) 半導体封止用樹脂組成物
JP2755034B2 (ja) 熱硬化性樹脂組成物
JPH02209916A (ja) 半導体封止用樹脂組成物
JPH02302422A (ja) 半導体封止用樹脂組成物
JPH02132118A (ja) 半導体封止用樹脂組成物
JPH02209964A (ja) 半導体封止用樹脂組成物
JPH0531884B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0229419A (ja) 半導体封止用樹脂組成物
JPH02212512A (ja) 半導体封止用樹脂組成物
JPH02212553A (ja) 半導体封止用樹脂組成物
JPH0588864B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH01198659A (ja) 半導体封止用樹脂組成物
JPH07206949A (ja) 熱硬化性樹脂組成物

Legal Events

Date Code Title Description
FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081224

Year of fee payment: 15

EXPY Cancellation because of completion of term
FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081224

Year of fee payment: 15