JPH0587161B2 - - Google Patents
Info
- Publication number
- JPH0587161B2 JPH0587161B2 JP63222002A JP22200288A JPH0587161B2 JP H0587161 B2 JPH0587161 B2 JP H0587161B2 JP 63222002 A JP63222002 A JP 63222002A JP 22200288 A JP22200288 A JP 22200288A JP H0587161 B2 JPH0587161 B2 JP H0587161B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- ultra
- conductive path
- low resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 15
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 238000009966 trimming Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 238000007747 plating Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63222002A JPH0269901A (ja) | 1988-09-05 | 1988-09-05 | 混成集積回路の超低抵抗体構造及びその超低抵抗体の形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63222002A JPH0269901A (ja) | 1988-09-05 | 1988-09-05 | 混成集積回路の超低抵抗体構造及びその超低抵抗体の形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0269901A JPH0269901A (ja) | 1990-03-08 |
| JPH0587161B2 true JPH0587161B2 (forum.php) | 1993-12-15 |
Family
ID=16775554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63222002A Granted JPH0269901A (ja) | 1988-09-05 | 1988-09-05 | 混成集積回路の超低抵抗体構造及びその超低抵抗体の形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0269901A (forum.php) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4652356B2 (ja) | 2007-02-26 | 2011-03-16 | アルプス電気株式会社 | ターンシグナルスイッチ装置 |
-
1988
- 1988-09-05 JP JP63222002A patent/JPH0269901A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0269901A (ja) | 1990-03-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5683566A (en) | Method of manufacting an SMD resistor | |
| JP3073003U (ja) | 表面実装型電気装置 | |
| JP3060896B2 (ja) | バンプ電極の構造 | |
| US4949225A (en) | Circuit board for mounting electronic components | |
| JP2988243B2 (ja) | パワー混成集積回路装置 | |
| US5099395A (en) | Circuit board for mounting electronic components | |
| JPH0587161B2 (forum.php) | ||
| JPH07221411A (ja) | プリント配線基板及びその製造方法 | |
| JPH0553285B2 (forum.php) | ||
| JP2545077Y2 (ja) | チツプ形抵抗器 | |
| JP3670593B2 (ja) | 抵抗器を用いる電子部品及びその使用方法 | |
| JP2839262B2 (ja) | チップ抵抗器とその製造方法 | |
| JPH024143B2 (forum.php) | ||
| JPH01183192A (ja) | フレキシブルプリント配線板およびその製造方法 | |
| JPH064605Y2 (ja) | 混成集積回路 | |
| JP2661158B2 (ja) | リードパターンの形成方法 | |
| JP3462198B2 (ja) | 抵抗器及びその製造法 | |
| JPH0351965Y2 (forum.php) | ||
| JP2839308B2 (ja) | 多層配線基板 | |
| JP2002270973A (ja) | 放熱板を用いた部品の実装構造 | |
| JP3054249B2 (ja) | リードフレーム組立体 | |
| JPH0719162Y2 (ja) | 集積回路パッケージ | |
| JP3308448B2 (ja) | 終端抵抗アレー及びこれを備えた基板 | |
| JPH05218280A (ja) | リードフレームおよびその製造方法 | |
| JPS6148993A (ja) | 混成集積回路の製造方法 |