JPH0587161B2 - - Google Patents

Info

Publication number

JPH0587161B2

JPH0587161B2 JP63222002A JP22200288A JPH0587161B2 JP H0587161 B2 JPH0587161 B2 JP H0587161B2 JP 63222002 A JP63222002 A JP 63222002A JP 22200288 A JP22200288 A JP 22200288A JP H0587161 B2 JPH0587161 B2 JP H0587161B2

Authority

JP

Japan

Prior art keywords

integrated circuit

hybrid integrated

ultra

conductive path

low resistance

Prior art date

1988-09-05

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired - Lifetime

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• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
• 239000000758 substrate Substances 0.000 claims description 15
• 229910052759 nickel Inorganic materials 0.000 claims description 8
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
• 238000000034 method Methods 0.000 claims description 5
• 238000009966 trimming Methods 0.000 claims description 5
• 229910000679 solder Inorganic materials 0.000 claims description 4
• 229910052782 aluminium Inorganic materials 0.000 claims description 2
• 238000007747 plating Methods 0.000 description 5
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
• 239000011889 copper foil Substances 0.000 description 2
• 238000005530 etching Methods 0.000 description 2
• 229910052751 metal Inorganic materials 0.000 description 2
• 239000002184 metal Substances 0.000 description 2
• 229910044991 metal oxide Inorganic materials 0.000 description 2
• 150000004706 metal oxides Chemical class 0.000 description 2
• KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
• OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
• 238000002048 anodisation reaction Methods 0.000 description 1
• 229910052799 carbon Inorganic materials 0.000 description 1
• 239000000919 ceramic Substances 0.000 description 1
• 238000007772 electroless plating Methods 0.000 description 1
• 239000003822 epoxy resin Substances 0.000 description 1
• 230000017525 heat dissipation Effects 0.000 description 1
• LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
• 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1
• 238000007650 screen-printing Methods 0.000 description 1
• 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1