JPH0587138B2 - - Google Patents

Info

Publication number
JPH0587138B2
JPH0587138B2 JP61166033A JP16603386A JPH0587138B2 JP H0587138 B2 JPH0587138 B2 JP H0587138B2 JP 61166033 A JP61166033 A JP 61166033A JP 16603386 A JP16603386 A JP 16603386A JP H0587138 B2 JPH0587138 B2 JP H0587138B2
Authority
JP
Japan
Prior art keywords
film carrier
reel
take
bonding
spacer tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61166033A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6320840A (ja
Inventor
Yasunobu Suzuki
Motohiko Kato
Akio Bando
Hisao Ishida
Akihiro Nishimura
Hiroshi Yamaguchi
Naoki Awamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP61166033A priority Critical patent/JPS6320840A/ja
Publication of JPS6320840A publication Critical patent/JPS6320840A/ja
Publication of JPH0587138B2 publication Critical patent/JPH0587138B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP61166033A 1986-07-15 1986-07-15 外部リ−ド接合装置における巻き取りリ−ル構造 Granted JPS6320840A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61166033A JPS6320840A (ja) 1986-07-15 1986-07-15 外部リ−ド接合装置における巻き取りリ−ル構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61166033A JPS6320840A (ja) 1986-07-15 1986-07-15 外部リ−ド接合装置における巻き取りリ−ル構造

Publications (2)

Publication Number Publication Date
JPS6320840A JPS6320840A (ja) 1988-01-28
JPH0587138B2 true JPH0587138B2 (enrdf_load_stackoverflow) 1993-12-15

Family

ID=15823696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61166033A Granted JPS6320840A (ja) 1986-07-15 1986-07-15 外部リ−ド接合装置における巻き取りリ−ル構造

Country Status (1)

Country Link
JP (1) JPS6320840A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6320840A (ja) 1988-01-28

Similar Documents

Publication Publication Date Title
JPH0467782B2 (enrdf_load_stackoverflow)
US4526646A (en) Inner lead bonder
JP5308433B2 (ja) 部品実装装置及びその方法
JPS63296398A (ja) 部品装着装置
CN111168766B (zh) 薄膜自动冲切机
JPH0675199A (ja) 液晶パネル製造装置、位置決め装置および加工装置
JPH0587138B2 (enrdf_load_stackoverflow)
JP2639968B2 (ja) 電子部品装着機
JPH0467783B2 (enrdf_load_stackoverflow)
CN211806586U (zh) 薄膜自动冲切机
JP2825279B2 (ja) キャリアテープ部品の実装装置
JP4518257B2 (ja) 半導体装置実装装置
JP3440801B2 (ja) 電子部品の接合装置
JP2760566B2 (ja) キャリアテープ部品の実装装置
JP4452817B2 (ja) 回路基板用シート状ワークの枠貼装置
TWI856783B (zh) 一種貼膜貼信息碼設備和貼膜貼信息碼方法
JP2802198B2 (ja) 半導体部品位置補正装置
JP2825300B2 (ja) キャリアテープ部品の実装装置
JPH0157498B2 (enrdf_load_stackoverflow)
JP2916333B2 (ja) 半導体部品供給装置
JPH0151055B2 (enrdf_load_stackoverflow)
JPH1022696A (ja) 電子部品搭載装置
JPS63229723A (ja) ダイボンデイング装置
JP2853286B2 (ja) フィルムキャリアテープの処理装置
JP2775553B2 (ja) ワイヤボンディング装置及びワイヤボンディング方法