JPH05855B2 - - Google Patents

Info

Publication number
JPH05855B2
JPH05855B2 JP21502088A JP21502088A JPH05855B2 JP H05855 B2 JPH05855 B2 JP H05855B2 JP 21502088 A JP21502088 A JP 21502088A JP 21502088 A JP21502088 A JP 21502088A JP H05855 B2 JPH05855 B2 JP H05855B2
Authority
JP
Japan
Prior art keywords
chip
adhesive
conductor
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP21502088A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0265147A (ja
Inventor
Masato Ishii
Tatsuo Kataoka
Yoshitaka Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Priority to JP21502088A priority Critical patent/JPH0265147A/ja
Priority to EP19890108827 priority patent/EP0360971A3/en
Priority to US07/357,030 priority patent/US5019944A/en
Publication of JPH0265147A publication Critical patent/JPH0265147A/ja
Publication of JPH05855B2 publication Critical patent/JPH05855B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
JP21502088A 1988-08-31 1988-08-31 Ｉｃチップ実装方法 Granted JPH0265147A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP21502088A JPH0265147A (ja) 1988-08-31 1988-08-31 Ｉｃチップ実装方法
EP19890108827 EP0360971A3 (en) 1988-08-31 1989-05-17 Mounting substrate and its production method, and printed wiring board having connector function and its connection method
US07/357,030 US5019944A (en) 1988-08-31 1989-05-25 Mounting substrate and its production method, and printed wiring board having connector function and its connection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21502088A JPH0265147A (ja) 1988-08-31 1988-08-31 Ｉｃチップ実装方法

Publications (2)

Publication Number Publication Date
JPH0265147A JPH0265147A (ja) 1990-03-05
JPH05855B2 true JPH05855B2 (cs) 1993-01-06

Family

ID=16665404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21502088A Granted JPH0265147A (ja) 1988-08-31 1988-08-31 Ｉｃチップ実装方法

Country Status (1)

Country Link
JP (1) JPH0265147A (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007103440A (ja) * 2005-09-30 2007-04-19 Mitsui Mining & Smelting Co Ltd 配線基板の製造方法および配線基板
JP2007165816A (ja) * 2005-11-15 2007-06-28 Mitsui Mining & Smelting Co Ltd プリント配線基板、その製造方法およびその使用方法

Also Published As

Publication number Publication date
JPH0265147A (ja) 1990-03-05

Similar Documents

Publication Publication Date Title
US5019944A (en) Mounting substrate and its production method, and printed wiring board having connector function and its connection method
JP3400051B2 (ja) 異方性導電膜、その製造方法及びそれを使用するコネクタ
US6420664B1 (en) Metal foil having bumps, circuit substrate having the metal foil, and semiconductor device having the circuit substrate
EP0558325B1 (en) Raised feature on substrate for flip chip interconnection
US6331679B1 (en) Multi-layer circuit board using anisotropic electro-conductive adhesive layer
JPH1050886A (ja) グリッドアレイ半導体パッケージへの導電ポリマボールの接着
JPS63150930A (ja) 半導体装置
JP3219140B2 (ja) 電気・電子機器
JPH05855B2 (cs)
JPH09306231A (ja) 導電性微粒子及び基板
JPS63122135A (ja) 半導体チツプの電気的接続方法
JPH03129745A (ja) 半導体装置の実装方法
JPH0574846A (ja) 電気的接続方法
JPH0273690A (ja) 実装基板の製造方法
JP2004127612A (ja) 導電性微粒子、電極端子の相互接続方法及び導電接続構造体
JP3714415B2 (ja) 液晶ディスプレイ用のｔａｂテープ及びその製造方法
JP2967560B2 (ja) フィルムキャリアの接続構造体
JPS63185035A (ja) 半導体装置
JP2705263B2 (ja) Ｔａｂ用テープキャリアの製造方法
JP2002176267A (ja) 電子部品、回路装置とその製造方法並びに半導体装置
JP2006154621A (ja) 基板の接着方法
JPH04326747A (ja) 部品実装方法
JP3106846B2 (ja) 半導体チップ実装基板の製造方法
JPH01232735A (ja) 半導体装置の実装体
JPS59204298A (ja) 印刷回路板の形成方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees