JPH0585261B2 - - Google Patents

Info

Publication number
JPH0585261B2
JPH0585261B2 JP23465286A JP23465286A JPH0585261B2 JP H0585261 B2 JPH0585261 B2 JP H0585261B2 JP 23465286 A JP23465286 A JP 23465286A JP 23465286 A JP23465286 A JP 23465286A JP H0585261 B2 JPH0585261 B2 JP H0585261B2
Authority
JP
Japan
Prior art keywords
heat medium
steam generation
generation tank
flux
reflow soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP23465286A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6390361A (ja
Inventor
Haruo Sankai
Keizo Tsucha
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Techno Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Techno Engineering Co Ltd filed Critical Hitachi Techno Engineering Co Ltd
Priority to JP23465286A priority Critical patent/JPS6390361A/ja
Publication of JPS6390361A publication Critical patent/JPS6390361A/ja
Publication of JPH0585261B2 publication Critical patent/JPH0585261B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B23K1/015—Vapour-condensation soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP23465286A 1986-10-03 1986-10-03 ベ−パ−リフロ−式はんだ付け装置 Granted JPS6390361A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23465286A JPS6390361A (ja) 1986-10-03 1986-10-03 ベ−パ−リフロ−式はんだ付け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23465286A JPS6390361A (ja) 1986-10-03 1986-10-03 ベ−パ−リフロ−式はんだ付け装置

Publications (2)

Publication Number Publication Date
JPS6390361A JPS6390361A (ja) 1988-04-21
JPH0585261B2 true JPH0585261B2 (enrdf_load_stackoverflow) 1993-12-06

Family

ID=16974371

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23465286A Granted JPS6390361A (ja) 1986-10-03 1986-10-03 ベ−パ−リフロ−式はんだ付け装置

Country Status (1)

Country Link
JP (1) JPS6390361A (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01107965A (ja) * 1987-10-20 1989-04-25 Tamura Seisakusho Co Ltd 気相式はんだ付け用溶剤のフィルタリング装置
JPH0677812B2 (ja) * 1988-06-29 1994-10-05 日立テクノエンジニアリング株式会社 ベーパリフローはんだ付け装置
JPH082495B2 (ja) * 1989-12-25 1996-01-17 日立テクノエンジニアリング株式会社 ベーパーリフロー式はんだ付け方法及び同装置
JP2549211B2 (ja) * 1991-01-16 1996-10-30 株式会社日立製作所 ベーパーはんだ付装置
JP2794352B2 (ja) * 1991-08-22 1998-09-03 エイテックテクトロン 株式会社 リフロー半田付け装置
JP2709365B2 (ja) * 1992-03-16 1998-02-04 日立テクノエンジニアリング株式会社 ベーパーリフローはんだ付け装置

Also Published As

Publication number Publication date
JPS6390361A (ja) 1988-04-21

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