JPH0581179B2 - - Google Patents
Info
- Publication number
- JPH0581179B2 JPH0581179B2 JP62315166A JP31516687A JPH0581179B2 JP H0581179 B2 JPH0581179 B2 JP H0581179B2 JP 62315166 A JP62315166 A JP 62315166A JP 31516687 A JP31516687 A JP 31516687A JP H0581179 B2 JPH0581179 B2 JP H0581179B2
- Authority
- JP
- Japan
- Prior art keywords
- pin
- peripheral
- push
- holder
- pin holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
- Y10T156/1189—Gripping and pulling work apart during delaminating with shearing during delaminating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/11—Vacuum
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Walking Sticks, Umbrellas, And Fans (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62315166A JPH01157548A (ja) | 1987-12-15 | 1987-12-15 | ペレット突き上げ装置 |
KR1019880013649A KR910007107B1 (ko) | 1987-12-15 | 1988-10-20 | 펠릿 돌상(突上)장치 |
US07/284,133 US4907790A (en) | 1987-12-15 | 1988-12-14 | Pellet-lifting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62315166A JPH01157548A (ja) | 1987-12-15 | 1987-12-15 | ペレット突き上げ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01157548A JPH01157548A (ja) | 1989-06-20 |
JPH0581179B2 true JPH0581179B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-11-11 |
Family
ID=18062217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62315166A Granted JPH01157548A (ja) | 1987-12-15 | 1987-12-15 | ペレット突き上げ装置 |
Country Status (3)
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0625963Y2 (ja) * | 1988-07-29 | 1994-07-06 | 松下電器産業株式会社 | 電子部品実装装置 |
DE102006025361A1 (de) * | 2006-05-31 | 2007-12-06 | Siemens Ag | Ausstoßeinheit zum Abtrennen von Bauelementen aus einer im Wesentlichen ebenen Anordnung von Bauelementen |
JP4629624B2 (ja) * | 2006-07-06 | 2011-02-09 | 芝浦メカトロニクス株式会社 | 半導体チップのピックアップ装置及びピックアップ方法 |
DE102007041911A1 (de) * | 2007-09-04 | 2009-03-05 | Siemens Ag | Vorrichtung zum Ablösen von elektronischen Bauelementen von eienr Montagefolie |
EP2587261A1 (de) | 2011-10-25 | 2013-05-01 | Pharmatron AG | Tablettenteststation |
JP6089038B2 (ja) | 2011-10-25 | 2017-03-01 | ファーマトロン アーゲー | タブレット試験デバイス |
CN108312088B (zh) * | 2018-01-29 | 2019-12-03 | 重庆市长寿区惠峰汽车修理有限公司 | 汽车配件夹紧装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1544107A (en) * | 1923-06-18 | 1925-06-30 | Arthur E Sharples | Chuck |
US2982558A (en) * | 1958-06-02 | 1961-05-02 | Skinner Chuck Company | Chuck having counterbalanced jaws |
US3938789A (en) * | 1973-12-05 | 1976-02-17 | Richards Raymond E | Metallurgical cooling panel |
US4509891A (en) * | 1979-06-22 | 1985-04-09 | Precision Steel Warehouse, Inc. | Method and apparatus for supplying metal coils to a processing station |
SU917945A1 (ru) * | 1980-08-29 | 1982-04-07 | за вители | Эжекционный патрон |
JPS5948223U (ja) * | 1982-09-24 | 1984-03-30 | シチズン時計株式会社 | 腕時計バンド |
JPS6216542A (ja) * | 1985-07-15 | 1987-01-24 | Matsushita Electronics Corp | 半導体チツプの分離装置 |
JPS6298638A (ja) * | 1985-10-24 | 1987-05-08 | Shinkawa Ltd | ダイボンデイング装置 |
-
1987
- 1987-12-15 JP JP62315166A patent/JPH01157548A/ja active Granted
-
1988
- 1988-10-20 KR KR1019880013649A patent/KR910007107B1/ko not_active Expired
- 1988-12-14 US US07/284,133 patent/US4907790A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4907790A (en) | 1990-03-13 |
KR910007107B1 (ko) | 1991-09-18 |
KR890011054A (ko) | 1989-08-12 |
JPH01157548A (ja) | 1989-06-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |