JPH0578176B2 - - Google Patents

Info

Publication number
JPH0578176B2
JPH0578176B2 JP58233120A JP23312083A JPH0578176B2 JP H0578176 B2 JPH0578176 B2 JP H0578176B2 JP 58233120 A JP58233120 A JP 58233120A JP 23312083 A JP23312083 A JP 23312083A JP H0578176 B2 JPH0578176 B2 JP H0578176B2
Authority
JP
Japan
Prior art keywords
chip
inspection
image
circuit
illumination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP58233120A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60125547A (ja
Inventor
Hiroyuki Tsukahara
Tetsuo Hizuka
Noryuki Hiraoka
Masahito Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP23312083A priority Critical patent/JPS60125547A/ja
Publication of JPS60125547A publication Critical patent/JPS60125547A/ja
Publication of JPH0578176B2 publication Critical patent/JPH0578176B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Die Bonding (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP23312083A 1983-12-09 1983-12-09 検査装置 Granted JPS60125547A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23312083A JPS60125547A (ja) 1983-12-09 1983-12-09 検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23312083A JPS60125547A (ja) 1983-12-09 1983-12-09 検査装置

Publications (2)

Publication Number Publication Date
JPS60125547A JPS60125547A (ja) 1985-07-04
JPH0578176B2 true JPH0578176B2 (enrdf_load_stackoverflow) 1993-10-28

Family

ID=16950072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23312083A Granted JPS60125547A (ja) 1983-12-09 1983-12-09 検査装置

Country Status (1)

Country Link
JP (1) JPS60125547A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001194322A (ja) * 2000-01-14 2001-07-19 Sharp Corp 外観検査装置及び検査方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5368847A (en) * 1976-12-01 1978-06-19 Hitachi Ltd Automatic appearance inspecting device
JPS5733304A (en) * 1980-08-06 1982-02-23 Hitachi Ltd Method and device for shape inspection
JPS57198638A (en) * 1981-05-30 1982-12-06 Toshiba Corp Detection of wire bonding state and device therefore

Also Published As

Publication number Publication date
JPS60125547A (ja) 1985-07-04

Similar Documents

Publication Publication Date Title
US4688939A (en) Method and apparatus for inspecting articles
KR930005496B1 (ko) 와이어본딩 검사장치
JPH09504401A (ja) ボールボンド検査システム用の方法および装置
JP2851151B2 (ja) ワイヤボンディング検査装置
US6339337B1 (en) Method for inspecting semiconductor chip bonding pads using infrared rays
JPH0578176B2 (enrdf_load_stackoverflow)
JPS60227431A (ja) ダイボンデイング状態の検査装置
JP3419118B2 (ja) 外観検査装置
KR950004592B1 (ko) 접합부의 검사 방법
JP2001004561A (ja) 基板検査装置
JPH033941B2 (enrdf_load_stackoverflow)
JP2842486B2 (ja) 透明モールドic検査装置
JPS62274205A (ja) リ−ド平坦度検査方法および装置
JPS59144140A (ja) ワイヤボンデイング部の検査方法
JP2003141509A (ja) 基板検査方法およびその装置
JPS6336543A (ja) 半導体装置の自動検査方法及び検査装置
JPS59663A (ja) 波形テスト方法
JPH05288687A (ja) リード検査装置
JPS634348B2 (enrdf_load_stackoverflow)
JPS6186637A (ja) パタ−ン欠陥検出方法
JPH01140636A (ja) 半導体組立装置
JPH047448B2 (enrdf_load_stackoverflow)
JPH0524667B2 (enrdf_load_stackoverflow)
JPH06160063A (ja) 表面検査方法
JPS61294831A (ja) ウエハチツプの検出方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees