JPH0577325B2 - - Google Patents
Info
- Publication number
- JPH0577325B2 JPH0577325B2 JP63096792A JP9679288A JPH0577325B2 JP H0577325 B2 JPH0577325 B2 JP H0577325B2 JP 63096792 A JP63096792 A JP 63096792A JP 9679288 A JP9679288 A JP 9679288A JP H0577325 B2 JPH0577325 B2 JP H0577325B2
- Authority
- JP
- Japan
- Prior art keywords
- case
- resin
- electronic component
- manufacturing
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920005989 resin Polymers 0.000 claims description 39
- 239000011347 resin Substances 0.000 claims description 39
- 238000004519 manufacturing process Methods 0.000 claims description 19
- 238000007789 sealing Methods 0.000 claims description 7
- 238000005470 impregnation Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 16
- 239000010408 film Substances 0.000 description 12
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 239000012943 hotmelt Substances 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011104 metalized film Substances 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63096792A JPH01270213A (ja) | 1988-04-21 | 1988-04-21 | ケース外装形電子部品の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63096792A JPH01270213A (ja) | 1988-04-21 | 1988-04-21 | ケース外装形電子部品の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01270213A JPH01270213A (ja) | 1989-10-27 |
JPH0577325B2 true JPH0577325B2 (enrdf_load_stackoverflow) | 1993-10-26 |
Family
ID=14174488
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63096792A Granted JPH01270213A (ja) | 1988-04-21 | 1988-04-21 | ケース外装形電子部品の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01270213A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111863363B (zh) * | 2020-06-03 | 2023-02-17 | 中科立民新材料(扬州)有限公司 | 一种高温热敏电阻的封装方法及其封装的电阻和应用 |
-
1988
- 1988-04-21 JP JP63096792A patent/JPH01270213A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH01270213A (ja) | 1989-10-27 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |