JPH0459766B2 - - Google Patents

Info

Publication number

JPH0459766B2

JPH0459766B2 JP2291686A JP2291686A JPH0459766B2 JP H0459766 B2 JPH0459766 B2 JP H0459766B2 JP 2291686 A JP2291686 A JP 2291686A JP 2291686 A JP2291686 A JP 2291686A JP H0459766 B2 JPH0459766 B2 JP H0459766B2

Authority

JP

Japan

Prior art keywords

lead

leads

face

resin

chip

Prior art date

1986-02-06

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000003990 capacitor Substances 0.000 claims description 60
• 229920005989 resin Polymers 0.000 claims description 33
• 239000011347 resin Substances 0.000 claims description 33
• 238000004519 manufacturing process Methods 0.000 claims description 30
• 239000011888 foil Substances 0.000 claims description 16
• 238000000034 method Methods 0.000 claims description 14
• 238000005452 bending Methods 0.000 claims description 12
• 238000000576 coating method Methods 0.000 claims description 11
• 239000011248 coating agent Substances 0.000 claims description 10
• 238000005470 impregnation Methods 0.000 claims description 9
• 239000000853 adhesive Substances 0.000 claims description 7
• 230000001070 adhesive effect Effects 0.000 claims description 7
• 238000005498 polishing Methods 0.000 claims description 7
• 229910052782 aluminium Inorganic materials 0.000 claims description 6
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
• 229910052751 metal Inorganic materials 0.000 claims description 6
• 239000002184 metal Substances 0.000 claims description 6
• 238000004804 winding Methods 0.000 claims description 6
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 44
• 239000010408 film Substances 0.000 description 42
• 238000011282 treatment Methods 0.000 description 4
• 238000005520 cutting process Methods 0.000 description 3
• 238000004806 packaging method and process Methods 0.000 description 3
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
• 239000004593 Epoxy Substances 0.000 description 2
• XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
• 239000002390 adhesive tape Substances 0.000 description 2
• 238000010924 continuous production Methods 0.000 description 2
• 229910000679 solder Inorganic materials 0.000 description 2
• 229910000831 Steel Inorganic materials 0.000 description 1
• ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
• 238000007796 conventional method Methods 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 238000001723 curing Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 229920006332 epoxy adhesive Polymers 0.000 description 1
• 239000003822 epoxy resin Substances 0.000 description 1
• -1 etc. Substances 0.000 description 1
• 238000013007 heat curing Methods 0.000 description 1
• 238000007689 inspection Methods 0.000 description 1
• 229910052742 iron Inorganic materials 0.000 description 1
• 239000011104 metalized film Substances 0.000 description 1
• 238000007517 polishing process Methods 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1
• 239000010959 steel Substances 0.000 description 1