JPH0575183B2 - - Google Patents
Info
- Publication number
- JPH0575183B2 JPH0575183B2 JP62260928A JP26092887A JPH0575183B2 JP H0575183 B2 JPH0575183 B2 JP H0575183B2 JP 62260928 A JP62260928 A JP 62260928A JP 26092887 A JP26092887 A JP 26092887A JP H0575183 B2 JPH0575183 B2 JP H0575183B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- cooling pipe
- wiring board
- printed wiring
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 11
- 239000002826 coolant Substances 0.000 claims description 4
- 239000003507 refrigerant Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62260928A JPH01102944A (ja) | 1987-10-15 | 1987-10-15 | 集積回路パッケージの冷却構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62260928A JPH01102944A (ja) | 1987-10-15 | 1987-10-15 | 集積回路パッケージの冷却構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01102944A JPH01102944A (ja) | 1989-04-20 |
| JPH0575183B2 true JPH0575183B2 (fr) | 1993-10-20 |
Family
ID=17354714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62260928A Granted JPH01102944A (ja) | 1987-10-15 | 1987-10-15 | 集積回路パッケージの冷却構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01102944A (fr) |
-
1987
- 1987-10-15 JP JP62260928A patent/JPH01102944A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01102944A (ja) | 1989-04-20 |
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