JPH0575183B2 - - Google Patents
Info
- Publication number
- JPH0575183B2 JPH0575183B2 JP62260928A JP26092887A JPH0575183B2 JP H0575183 B2 JPH0575183 B2 JP H0575183B2 JP 62260928 A JP62260928 A JP 62260928A JP 26092887 A JP26092887 A JP 26092887A JP H0575183 B2 JPH0575183 B2 JP H0575183B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- cooling pipe
- wiring board
- printed wiring
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 11
- 239000002826 coolant Substances 0.000 claims description 4
- 239000003507 refrigerant Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、集積回路パツケージに関し、特にそ
の冷却構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to integrated circuit packages, and more particularly to cooling structures thereof.
従来、この種の集積回路パツケージの冷却構造
の一例は第２図に示すように、複数の集積回路を
実装したプリント配線板１と、これら集積回路ケ
ース２の上面に半田付けあるいは熱伝導性密着剤
１１などを用いて固定される金属製冷却用パイプ
３とからなり、集積回路から発生する熱を冷却用
パイプ３中に流れる冷媒によつて放熱冷却するも
のであつた。
Conventionally, an example of a cooling structure for this type of integrated circuit package, as shown in FIG. It consisted of a metal cooling pipe 3 fixed using a cooling agent 11 or the like, and the heat generated from the integrated circuit was radiated and cooled by a refrigerant flowing through the cooling pipe 3.
しかしながら、プリント配線板１上に実装され
る集積回路ケース２の上面はその寸法がばらつく
ため剛性の冷却パイプ３となじみにくく、冷却パ
イプ３および集積回路間に応力が加わり半田付け
や接着１１が剥れたり集積回路を破損したりする
という欠点があつた。 However, since the upper surface of the integrated circuit case 2 mounted on the printed wiring board 1 varies in size, it is difficult to fit in with the rigid cooling pipe 3, and stress is applied between the cooling pipe 3 and the integrated circuit, causing the soldering and adhesive 11 to come off. The drawback was that it could damage the integrated circuit.
また集積回路の交換時などに多くの手数を必要
とし、迅速に行うことが困難であるという欠点が
あつた。 Another drawback is that it requires a lot of effort when replacing the integrated circuit, and it is difficult to replace it quickly.
本発明の目的は上記の欠点すなわち、冷却用パ
イプと集積回路ケースとの固定部に応力が加わ
り、この固定部が剥れたり、集積回路が破損する
などの問題点や、集積回路交換時に多くの手数が
かかるという問題点を解決した集積回路パツケー
ジの冷却構造を提供することにある。
The purpose of the present invention is to solve the above-mentioned drawbacks, such as stress being applied to the fixing part between the cooling pipe and the integrated circuit case, which may cause the fixing part to peel off or damage the integrated circuit, and to solve the problems that occur when replacing the integrated circuit. It is an object of the present invention to provide a cooling structure for an integrated circuit package which solves the problem of requiring a lot of time and effort.
本発明は上述の問題点を解決するために、プリ
ント配線板と、この上に実装される複数個の集積
回路と、このケースの上面に接触する下面を弾性
薄板、上面を剛性厚板としほぼ矩形断面を有する
金属製冷却パイプと、この冷却パイプをプリント
配線板方向へ押圧保持するためのスプリングおよ
び保持固定部材とからなる構成を採用するもので
ある。
In order to solve the above-mentioned problems, the present invention includes a printed wiring board, a plurality of integrated circuits mounted thereon, a thin elastic plate on the lower surface that contacts the upper surface of the case, and a rigid thick plate on the upper surface. A configuration is adopted that includes a metal cooling pipe having a rectangular cross section, a spring and a holding and fixing member for pressing and holding the cooling pipe toward the printed wiring board.
本発明は上述のように構成したので、プリント
配線板上に実装された複数の集積回路のケース上
面に冷却パイプを配置し、スプリングと保持固定
部材とによつて、この冷却パイプの上面の剛性厚
板面を押圧し、冷却パイプ中に冷媒を適当な圧力
を用いて流すことにより、集積回路の傾きや高さ
のばらつきが補正吸収されて、冷却パイプの下面
の弾性薄板面が集積回路ケースの上面の熱放出面
に適当な圧力で密着し、放熱が確実となる。
Since the present invention is configured as described above, the cooling pipe is arranged on the upper surface of the case of the plurality of integrated circuits mounted on the printed wiring board, and the rigidity of the upper surface of the cooling pipe is fixed by the spring and the holding and fixing member. By pressing the thick plate surface and flowing the refrigerant into the cooling pipe using appropriate pressure, the tilt and height variations of the integrated circuit are corrected and absorbed, and the elastic thin plate surface on the bottom of the cooling pipe becomes the integrated circuit case. It adheres to the heat dissipation surface on the top surface with appropriate pressure, ensuring heat dissipation.
次に本発明の実施例について図面を参照して説
明する。
Next, embodiments of the present invention will be described with reference to the drawings.
本発明の一実施例を断面図で示す第１図を参照
すると、本発明の集積回路パツケージの冷却構造
はプリント配線板１と、このプリント配線板１上
に実装された複数の集積回路と、この集積回路の
ケース２の上部の熱放出面１０に接し、内部に冷
媒通路７を有する金属製冷却パイプ３と、適当な
圧力によりこの冷却パイプ３をプリント配線板１
の方向に押圧するスプリング４よよび保持固定部
材８とからなり、冷却パイプ３の上面５は剛性を
有する厚板金属、下面６弾性力を有する薄板金属
となつている。またスプリング４は保持固定部材
８にスプリング取付けねじ９を用いて取付けられ
ている。 Referring to FIG. 1, which shows a cross-sectional view of an embodiment of the present invention, the cooling structure for an integrated circuit package of the present invention includes a printed wiring board 1, a plurality of integrated circuits mounted on the printed wiring board 1, A metal cooling pipe 3 is in contact with the heat dissipation surface 10 on the upper part of the case 2 of this integrated circuit and has a coolant passage 7 inside, and the cooling pipe 3 is connected to the printed wiring board 1 by an appropriate pressure.
The upper surface 5 of the cooling pipe 3 is made of a rigid thick plate metal, and the lower surface 6 is made of an elastic thin plate metal. Further, the spring 4 is attached to the holding and fixing member 8 using a spring attaching screw 9.
次に本実施例の動作について第１図を用いて説
明する。 Next, the operation of this embodiment will be explained using FIG.
保持固定部材８に取付けられたスプリング４に
より押圧される冷却パイプ３の上面５は厚く剛性
を有するため、ほぼ一様に冷却パイプ３を集積回
路ケース２の熱放出面１０に押しつける。この時
冷却パイプ３の下面６は弾力性のある薄板金属の
ため集積回路ケース２の熱放出面１０とよくなじ
み密着する。更に冷却パイプ中の冷媒通路７に適
当の圧力により冷媒を流すことにより熱放出面１
０と薄板金属との間に適当な圧力が加えられ、集
積回路の発熱は冷媒によつて冷却される。 Since the upper surface 5 of the cooling pipe 3 pressed by the spring 4 attached to the holding and fixing member 8 is thick and rigid, the cooling pipe 3 is pressed almost uniformly against the heat emitting surface 10 of the integrated circuit case 2. At this time, the lower surface 6 of the cooling pipe 3 is made of an elastic thin metal plate, so it fits well and comes into close contact with the heat release surface 10 of the integrated circuit case 2. Furthermore, by flowing the refrigerant at an appropriate pressure into the refrigerant passage 7 in the cooling pipe, the heat release surface 1
Appropriate pressure is applied between the 0 and the sheet metal, and the heat generated by the integrated circuit is cooled by the coolant.
したがつて集積回路ケース２の傾きや実装高さ
のばらつきがある場合にも接触が十分に行われ、
冷却不足になどが発生しにくいという利点があ
る。 Therefore, even if there are variations in the inclination of the integrated circuit case 2 or the mounting height, sufficient contact can be made.
This has the advantage that problems such as insufficient cooling are less likely to occur.
また、冷却パイプ３と集積回路ケース２間の応
力により集積回路が破損することがなく、集積回
路の取換えも簡単に行えるという利点がある。 Further, there is an advantage that the integrated circuit is not damaged due to stress between the cooling pipe 3 and the integrated circuit case 2, and that the integrated circuit can be easily replaced.
以上に説明したように本発明によれば、集積回
路の熱放出面に接触する下面に弾力性薄板金属
を、上面に剛性厚板金属を冷却パイプと、これを
集積回路ケース上に押圧保持するためのスプリン
グおよび保持固定部材とを備えることにより、プ
リント配線板上に取付けられた複数個の集積回路
の実装高さのばらつき、傾きがあつても、それを
吸収して密着し、すぐれた冷却性能が得られると
いう効果がある。また、一部の集積回路を変換す
るような場合にも作業が容易となるという効果が
ある。
As explained above, according to the present invention, a cooling pipe is formed of an elastic thin sheet metal on the bottom surface that contacts the heat dissipation surface of the integrated circuit, and a rigid thick metal sheet on the top surface, and this is pressed and held on the integrated circuit case. Even if there are variations in the mounting height or tilt of multiple integrated circuits mounted on a printed wiring board, this feature is equipped with a spring and a holding and fixing member to absorb the variations in the mounting height of multiple integrated circuits mounted on the printed wiring board, and to ensure that they are in close contact with each other, resulting in excellent cooling. This has the effect of improving performance. Furthermore, there is an effect that the work becomes easier when converting some integrated circuits.
第１図は本発明の一実施例の断面図、第２図は
従来の一例の断面図である。
１……プリント配線板、２……集積回路ケー
ス、３……冷却パイプ、４……スプリング、５…
…冷却パイプ上面（剛性面）、６……冷却パイプ
下面（薄板金属面）、７……冷媒通路、８……保
持固定部材、９……スプリング取付ねじ、１０…
…熱放出面（ケース上面）。
FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. 1...Printed wiring board, 2...Integrated circuit case, 3...Cooling pipe, 4...Spring, 5...
...Top surface of cooling pipe (rigid surface), 6...Bottom surface of cooling pipe (thin metal surface), 7...Refrigerant passage, 8...Holding fixing member, 9...Spring mounting screw, 10...
...Heat release surface (top of the case).
Claims (1)
個の集積回路と、これら複数の集積回路のケース
の上面に固定され内部に冷媒を流す金属性冷却パ
イプとを有する集積回路パツケージの冷却構造に
おいて、前記金属性冷却パイプの断面をほぼ矩形
とし、前記集積回路ケースに接触する下面を弾力
性薄板、上面を剛性厚板とし、かつ、この冷却パ
イプの剛性面を前記プリント配線板方向へ押圧保
持するためのスプリングおよび保持固定部材を設
けることを特徴とする集積回路パツケージの冷却
構造。1. In a cooling structure for an integrated circuit package, which includes a printed wiring board, a plurality of integrated circuits mounted on the printed wiring board, and a metal cooling pipe fixed to the upper surface of a case of the plurality of integrated circuits and through which a coolant flows inside. , the metallic cooling pipe has a substantially rectangular cross section, a lower surface in contact with the integrated circuit case is an elastic thin plate, and an upper surface is a rigid thick plate, and the rigid surface of the cooling pipe is pressed and held in the direction of the printed wiring board. A cooling structure for an integrated circuit package, comprising a spring and a holding and fixing member for cooling the integrated circuit package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62260928A JPH01102944A (en) | 1987-10-15 | 1987-10-15 | Cooling structure of integrated circuit package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62260928A JPH01102944A (en) | 1987-10-15 | 1987-10-15 | Cooling structure of integrated circuit package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01102944A JPH01102944A (en) | 1989-04-20 |
| JPH0575183B2 true JPH0575183B2 (en) | 1993-10-20 |
Family
ID=17354714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62260928A Granted JPH01102944A (en) | 1987-10-15 | 1987-10-15 | Cooling structure of integrated circuit package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01102944A (en) |
-
1987
- 1987-10-15 JP JP62260928A patent/JPH01102944A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01102944A (en) | 1989-04-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4479140A (en) | Thermal conduction element for conducting heat from semiconductor devices to a cold plate | |
| JPH06209174A (en) | Heat sink | |
| US5237485A (en) | Apparatus and method for improved thermal coupling of a semiconductor package to a cooling plate and increased electrical coupling of package leads on more than one side of the package to a circuit board | |
| EP1195813A2 (en) | Semiconductor device, semiconductor module and hard disk | |
| JP3094768B2 (en) | Semiconductor device | |
| JPWO2004093187A1 (en) | Electronic component package, electronic component package assembly and printed circuit board unit | |
| KR0155843B1 (en) | A semiconductor equipment | |
| US7459838B2 (en) | Plasma display device, TCP applied thereto, and method of manufacturing the TCP | |
| US6154367A (en) | Heat sink for printed circuit board | |
| JPH0575183B2 (en) | ||
| JP2007184424A (en) | Semiconductor device | |
| JPH11312770A (en) | Radiation fin for thin ic | |
| JPH06252299A (en) | Semiconductor device and board mounted therewith | |
| JPH08321694A (en) | Heat dissipating structure | |
| JPH11345890A (en) | Semiconductor device | |
| JP2936845B2 (en) | Integrated circuit mounting structure | |
| KR200154509Y1 (en) | Thermal type semiconductor package | |
| JP2535032Y2 (en) | Thermal print head | |
| JP6823283B2 (en) | Cooling device, mounting method | |
| JP2603768B2 (en) | Electronic equipment | |
| JP4428092B2 (en) | Electronic component mounting method | |
| JP2595957B2 (en) | Cooling structure of LSI case | |
| JPH0521902Y2 (en) | ||
| JPS61248496A (en) | Flexible substrate device | |
| JPH06181395A (en) | Heat dissipation printed-wiring board |