JPH0575022B2 - - Google Patents
Info
- Publication number
- JPH0575022B2 JPH0575022B2 JP3656988A JP3656988A JPH0575022B2 JP H0575022 B2 JPH0575022 B2 JP H0575022B2 JP 3656988 A JP3656988 A JP 3656988A JP 3656988 A JP3656988 A JP 3656988A JP H0575022 B2 JPH0575022 B2 JP H0575022B2
- Authority
- JP
- Japan
- Prior art keywords
- gel
- polyorganosiloxane
- bonded
- groups
- mol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 23
- 239000000203 mixture Substances 0.000 claims description 20
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 16
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 14
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 5
- 125000001931 aliphatic group Chemical group 0.000 claims description 4
- 238000007259 addition reaction Methods 0.000 claims description 2
- 239000007809 chemical reaction catalyst Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 description 17
- 239000010410 layer Substances 0.000 description 15
- -1 polysiloxane Polymers 0.000 description 6
- 229920001296 polysiloxane Polymers 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 1
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000011067 equilibration Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 150000003058 platinum compounds Chemical class 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3656988A JPH01213363A (ja) | 1988-02-19 | 1988-02-19 | ポリオルガノシロキサン組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3656988A JPH01213363A (ja) | 1988-02-19 | 1988-02-19 | ポリオルガノシロキサン組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01213363A JPH01213363A (ja) | 1989-08-28 |
JPH0575022B2 true JPH0575022B2 (enrdf_load_stackoverflow) | 1993-10-19 |
Family
ID=12473396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3656988A Granted JPH01213363A (ja) | 1988-02-19 | 1988-02-19 | ポリオルガノシロキサン組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01213363A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2519563B2 (ja) * | 1990-03-02 | 1996-07-31 | 信越化学工業株式会社 | オルガノポリシロキサン組成物及びその硬化物 |
-
1988
- 1988-02-19 JP JP3656988A patent/JPH01213363A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH01213363A (ja) | 1989-08-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4087585A (en) | Self-adhering silicone compositions and preparations thereof | |
EP0252665B1 (en) | Heat stable fluorinated polyorganosiloxane compositions | |
EP0532362A1 (en) | Silicone gel composition excellent in damping property | |
EP0903378A1 (en) | Dielectric gel for protection of electronic modules | |
KR0175947B1 (ko) | 경화성 실리콘 조성물 및 그의 경화물 | |
JP3912523B2 (ja) | 難燃性シリコーン組成物、及びシリコーンゴム硬化物又はシリコーンゲル硬化物の難燃性向上方法 | |
JPH0460502B2 (enrdf_load_stackoverflow) | ||
EP0727462B1 (en) | Silicone gel composition | |
KR910004045B1 (ko) | 실리콘-결합 수소를 함유하는 저온 폴리메틸실록산 및 이로부터 제조된 경화 조성물 | |
JPS5823852A (ja) | 現場生成硬化抑制剤を含むオルガノ珪素組成物の製法 | |
JPS6056190B2 (ja) | ポリオルガノシロキサン組成物 | |
EP0444960A2 (en) | Curable organopolysiloxane composition | |
JPH0478659B2 (enrdf_load_stackoverflow) | ||
JPS60127362A (ja) | 白金族金属触媒のケトン禁止剤及びそれを含有するオルガノポリシロキサン組成物 | |
US5432280A (en) | Gel-forming silicone composition | |
JPH0655894B2 (ja) | オルガノポリシロキサンゲル組成物 | |
JP2510577B2 (ja) | 硬化性シリコ−ンゲル組成物 | |
US5346723A (en) | Method for curing organosiloxane compositions in the presence of cure inhibiting materials | |
EP0400786A2 (en) | Heat stable acrylamide polysiloxane composition | |
JPH0832785B2 (ja) | 低温特性を有する即成型シロキサンゲル | |
JPH0575022B2 (enrdf_load_stackoverflow) | ||
JP2632614B2 (ja) | フルオロシリコーン組成物及びそのゲル状硬化物 | |
JP3178968B2 (ja) | 耐溶剤性シリコーンゲル用組成物 | |
JPH0384064A (ja) | メチル水素シロキサン類の硬化及び架橋方法 | |
JPH0660282B2 (ja) | 耐熱性シリコーンゲル組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |