JPH0574892A - Measuring device of semiconductor devices - Google Patents

Abstract

PURPOSE:To make it possible to measure the electric properties in a high frequency region of a semiconductor device in a stabilized manner and inspect the devices on a mass production basis. CONSTITUTION:A connection terminal for a socket mounting printed board 3 is installed to an upper socket section 5 of a lead insertion socket of a semiconductor device 2 to be measured while a hole which can be inscribed with the connection terminal of the socket 1 is bored and installed to the socket mounting printed board 3. The socket 1 is inserted therein and connected to an electrode of the socket mounting printed board 3. This construction makes it possible to reduce remarkably the distance between a lead 4 of the measured semiconductor device 2 and an electronic component or the printed board and measure and inspect the electric properties in a high frequency region in a stabilized manner.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a measuring device for mass production inspection of semiconductor devices in a high frequency region.

[0002]

2. Description of the Related Art Conventionally, when measuring the electrical characteristics of a semiconductor device, a measuring apparatus as shown in FIG. 5 has been used. In this measuring device, a semiconductor integrated circuit device (IC) socket 22 is mounted on a printed circuit board 21, and an electronic component 24 such as a resistor or a capacitor is mounted between a socket terminal 23 and a connection terminal of the printed circuit board 21. The distance between the contact portions between the semiconductor device and the printed board, that is, the wiring distance (d + e + f) is long.

By the way, the conductor lines and the signal wirings on the printed circuit board are generally considered to be simple connecting lines, and it is often considered that the voltage and current changes at the output end and the input end of the wirings are simultaneous. However, when a switching element or the like having a fast rise and fall time is used, for example, the waveform propagation delay time of the print pattern is 1.8 × 10 ⁻⁹ seconds per 30 cm, and the voltage and current in the circuit are no longer simultaneous. Cannot be said to have changed. Such a pattern needs to be treated as a distributed constant circuit in which resistance, inductance, capacitance, etc. are distributed along the line. Therefore, the frequency is several hundred MH
It is impossible to measure the characteristics of the semiconductor device in the region exceeding z, and the wiring distance from the semiconductor device to be measured to peripheral components must be made as short as possible.

As a measuring device in which the wiring distance has already been shortened, there is one shown in FIG. In this measuring apparatus, a socket 35 including a spring portion 33 that comes into contact with a lead 32 that is a terminal of a semiconductor device 31 and a cup portion 34 that accommodates the same is provided at a pitch between the terminals of the semiconductor device 31 to be measured and the number of terminals. The same number of printed circuit boards 36
It is attached by soldering.

According to this structure, the linear distance from the lead 32 to the circuit board surface 37 to be measured and the connecting electronic component 38 is shortened to 1/3 or less as compared with the one shown in FIG. 5, and stable in the frequency region of 1 GHz or more. It is possible to measure the characteristic.

[0006]

However, according to the above configuration, the receiving portion of the lead 32 has no margin in the insertion dimension of the semiconductor device to be measured as compared with the socket in FIG. 5, and is shown in FIG. 4 (a). As described above, there is a difference between the basic dimension A and the lead tip dimension B, and as shown in FIG. 4B, it is necessary to form the leads before measurement, and
As shown in FIG. 5, the lead receiving portion does not have a full-scale spring structure, and the life is thousands of times.
There was a problem that it was necessary to replace the socket as appropriate.

Therefore, the present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide a measuring device for a semiconductor device having a short wiring distance and a long socket life, which can correspond to a high-speed switching element. ..

[0008]

In order to achieve this object, a semiconductor device measuring apparatus according to the present invention is provided with a connection terminal for connecting a socket mounting printed board to an upper receptacle portion of a lead insertion socket of a semiconductor device to be measured. Along with
The socket mounting printed circuit board is provided with a hole through which the connection terminal of the socket can be inscribed, the socket is inserted, and the socket mounting printed circuit board electrodes are connected.

[0009]

With this structure, the distance from the lead of the semiconductor device under test to the electronic component or the printed circuit board becomes very short, and stable measurement and inspection of electrical characteristics in a high frequency region can be performed. Moreover, since a socket having a normal lead receiving portion can be processed and used, the life of the socket is extended and maintenance is facilitated.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

In FIGS. 1 and 2, reference numeral 1 is an IC socket for mounting a semiconductor device to be measured (hereinafter simply referred to as a device) 2 on a printed circuit board 3, and a socket for inserting a lead 4 of the device 2. 5 are formed by the number of leads 4 and the socket 5 of the socket 1
A part of this also serves as a connection terminal for electrically connecting to the printed circuit board 3 and is exposed from the resin of the socket 1. On the other hand, the printed circuit board is provided with a hole for inscribing the socket 5 that also serves as the connection terminal of the socket 1, and the electrodes connected to the socket 5 that also serves as the connection terminal are connected to the chip capacitor (or chip resistor, etc.) 6 The electronic parts are patterned so that they can be wired at the shortest distance, and the socket 1 is inserted and connected by the solder 7. In this state, the force is directly applied to the connection part when inserting or removing the device, so
It is advisable to fix the socket 1 to the printed circuit board 3 with screws, or to prevent the connection part from being subjected to force by another method.

With such a configuration, the wiring distance from the lead 4 of the device 2 to the connection terminal to the next circuit of the printed circuit board 3 via the chip capacitor 6 which is an electronic component (measurement peripheral circuit component) is reduced. (A + b + c), which is about 1/3 of the distance (d + e + f) shown in the conventional example. Further, since the socket 1 and the socket 5 thereof can be used by processing the one shown in FIG. 5 of the conventional example, the device 2 can be easily inserted and taken out, and the measurement and inspection efficiency is good. Also, since the life of the socket 1 is long, the socket 1
Maintenance of the measurement / inspection equipment by replacing the is easy.

Here, an example of the semiconductor device to be measured will be described with reference to FIG. This is a high-speed prescaler (frequency divider). Terminal 12 to which a high frequency signal of 1 GHz or more is input, its reference input terminal 13, and terminals 15 and 18 to be ground terminals are connected from the device terminal (lead) to the measurement peripheral circuit. A short wiring distance is an essential condition. The conductor wire and the signal wiring on the printed circuit board are generally considered to be simply connecting wires, and it is often considered that the voltage and current changes at the output terminal and the input terminal of the wiring are the same. However, when using a switching element or the like having a fast rise and fall, it is necessary to consider, for example, the waveform propagation delay time of the print pattern, and it is no longer considered that the voltage and current in the circuit are changing at the same time. I can't say it.

This is because the pattern forms a distributed constant circuit in which resistance, inductance, capacitance, etc. are distributed along the line, and the external component constants in the circuit diagram are actually Are no longer equivalent. Therefore, the total of the wiring linear distance (a + b + c) from the lead of FIG. 2 to the printed circuit board through the connecting electronic component is as shown in FIG.
The above problem can be solved by shortening the value to (1/3) or less than (d + e + f) of the conventional example shown in FIG.

It is to be noted that the grounding terminals 15 and 18 in FIG. 3 are also based on the same idea, in which the socket portion 5 which also serves as the connection terminal of the socket 1 is electrically connected directly to the grounding portion of the printed circuit board 3 by the solder 7. Just think. Further, it goes without saying that the socket terminal 8 of the socket 1 can be used for the wiring of the circuit as in the conventional case.

[0016]

As described above, according to the structure of the present invention, the wiring distance from the lead of the semiconductor device under test to the mounting substrate of the device via the electronic component is very short, and the electrical characteristics are stable in the high frequency region. Since various measurements and inspections can be performed and a socket with a normal lead receiving part can be used, it is easy to insert and remove the device into the socket and replace the socket due to the long life of the socket. Maintenance becomes easier due to the longer cycle.

[Brief description of drawings]

FIG. 1 is a perspective view of a semiconductor device measuring apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view of the measuring device.

FIG. 3 is a block diagram showing a circuit function of a semiconductor device under test.

4A and 4B are schematic side views showing leads of a semiconductor device to be measured.

FIG. 5 is a sectional view of a conventional measuring device.

FIG. 6 is a sectional view of a conventional measuring device.

[Explanation of symbols]

 1 Socket 2 Semiconductor Device for Measurement 3 Printed Circuit Board 4 Lead 5 Receptacle 6 Chip Capacitor 7 Solder 8 Socket Terminal

Claims (1)

[Claims] 1. A lead mounting socket of a semiconductor device to be measured is provided with a connection terminal with a socket mounting printed circuit board at an upper socket portion thereof, and a socket mounting printed circuit board is provided with a hole through which the connection terminal of the socket can be inscribed. A device for measuring a semiconductor device, which is provided, inserts the socket, and connects the electrode to an electrode of the printed circuit board for mounting the socket.