JPH01291179A - Measuring instrument for semiconductor device - Google Patents

Abstract

PURPOSE:To stably measure an electric characteristic in a high frequency area by sticking a copper plate to the outside periphery of a socket of a semiconductor to be measured, connecting one electrode of electronic parts to a socket part of a socket and connecting the other electrode to the copper plate. CONSTITUTION:A copper plate 6 is stuck to the outside periphery of an IC socket for installing a semiconductor device to be measured 2 to a printed board 3. Also, a chip capacitor 7 is embedded into the outside periphery in the vicinity of a socket part 5, one electrode 7a of the capacitor 7 is connected to the socket part 5 by solder 8, and the other electrode 7b of the capacitor 7 is connected to the copper plate 6 by solder 8. Also, the copper plate 6 is connected to a ground terminal of the substrate 3 through a screw 9 for fixing the socket 1 to the substrate 3. In such a way, a wiring distance extending from a lead 4 of the device 2 to the ground terminal of the substrate 3 through the capacitor 7 becomes a distance (a + b + c) to the copper plate 6, and becomes about 1/3. Accordingly, an electric characteristic in a high frequency area can be measured stably.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a measuring device for mass production inspection of semiconductor devices in a high frequency range.

Conventional technology Conventionally, when measuring the electrical characteristics of semiconductor devices,
A measuring device as shown in FIG. 5 is used. This measuring device attaches an IC socket 22 to a printed circuit board 21, and connects a socket terminal 23 to a printed circuit board 21.
Electronic components 24 such as resistors and capacitors are installed between the ground terminal (or power supply terminal) of Conductive wires and signal wiring on printed circuit boards are generally considered to be mere connection lines, and it is often thought that voltage and current changes at the output and input ends of the wiring are simultaneous. However, when using switching elements with fast rise and fall times (for example, the waveform propagation delay time of a printed pattern is 1.8 ns per 303), the current and voltage in the circuit no longer change simultaneously. You can no longer say that you are doing it. Such a pattern must be treated as a distributed constant circuit in which resistance, inductance, capacitance, etc. are distributed along the line. For this reason, it is difficult to measure the characteristics of a semiconductor device in a region where the frequency exceeds several hundred MH2, and it is necessary to shorten the wiring distance from the semiconductor device to be measured to peripheral components as much as possible. There is a measuring device shown in FIG. 6 that has already shortened the wiring distance. This measuring device is a semiconductor device 31
A socket 35 consisting of a spring part 33 that contacts the lead 32, which is a terminal of the socket, and a cup part 34 that houses the spring part 33.
The same number of terminals as the pitch of the terminals of the semiconductor device 31 to be measured and the same number of terminals are attached to the printed circuit board 36 by soldering. According to this configuration, the linear distance from the buried lead 32 to the circuit board surface 37 to be measured and the connected electronic components 38 is shortened to 1/3 or less compared to the one shown in FIG. becomes possible.

Problems to be Solved by the Invention However, according to the above configuration, the receptacle part of the lead 32 is
Compared to the socket in Fig. 5, there is less room for the insertion dimension of the semiconductor device under test, as shown in Fig. 4(a).
There is a difference between the basic dimension A and the lead tip dimension B, as shown in Figure 4 (
As shown in b), it is necessary to form the lead before measurement, and as shown in Figure 5, the receptacle part of the lead does not have a full-fledged spring structure, and the lifespan is limited to several thousand measurements. However, there was a problem in that the socket needed to be replaced as appropriate.

Therefore, one object of the present invention is to take advantage of the advantages of both of the above-mentioned conventional examples, that is, to provide a semiconductor device with short wiring distance and long socket life.

Means for Solving the Problems In order to solve the above problems, the semiconductor device of the present invention includes:
A copper plate is attached to the outer periphery of a socket for inserting leads of the semiconductor device under test, one electrode of the electronic component is connected to the socket of the socket, and the other electrode of the electronic component is connected to the copper plate, and the A copper plate is connected to the connection terminal of the socket mounting board.

Effect: According to the above configuration, the wiring distance from the lead of the semiconductor device to be measured to the mounting board of the device via the electronic component is very short compared to the distance to the copper plate.

Stable measurements and inspections of electrical characteristics can be performed in the high frequency range. Furthermore, since a socket with a normal lead socket can be used, the life of the socket is extended and maintenance is facilitated.

EXAMPLE Hereinafter, an example of the present invention will be explained based on FIGS. 1 to 3.

1 and 2, reference numeral 1 indicates a semiconductor device to be measured (hereinafter simply referred to as a device) 2 and a printed circuit board 3.
This is an IC socket for mounting on an IC, and has the same number of normal sockets 5 for inserting the leads 4 of the device 2 as there are leads 4, and a copper plate 6 pasted on the outer periphery of the socket 1. There is. Also, on the outer periphery near the socket part 5.

A chip capacitor (or chip resistor, etc.) 7, which is an electronic component, is embedded, and one electrode 7a of the chip capacitor 7 is connected to the socket S by solder 8, and the other electrode 7b of the chip capacitor 7 is connected to the socket S. copper plate 6
It is connected to by solder 8. Further, the copper plate 6 has screws 9 for fixing the socket 1 to the printed circuit board 3.
It is also electrically connected to the ground terminal (power supply terminal, etc.) of the printed circuit board 3 via. Note that the screws 9 are not necessarily necessary if other means are available for fixing the socket 1 and the printed circuit board 3, and the copper plate 6 and the printed circuit board 3 may be connected using a separate wiring means.

Further, 10 is a protective film for the chip capacitor 7, which is made of insulating resin or the like.

With this configuration, the wiring distance from the lead 4 of the device 2 to the ground terminal of the printed circuit board 3 via the chip capacitor 7, which is an electronic component (measurement peripheral circuit component), is the distance (a+b+c) to the copper plate 6. This is approximately 173 of the distance (d+e+f) shown in the conventional example.

In addition, since the socket 1 and its socket 5 shown in the conventional example shown in FIG. Since it is long, maintenance of the measurement and inspection device by replacing the socket 1 does not require much effort.

Here, an example of a semiconductor device to be measured will be explained based on FIG. 3.

The one in Figure 3 is a high-speed prescaler (frequency divider), and the terminal 12 to which a high frequency signal of IGH2 or higher is input.
, its reference input voltage terminal 13, and a terminal 15 that serves as the ground terminal.
．． 18, an essential condition is that the wiring distance from the device terminal (lead) to the measurement peripheral circuit be short. This is because conductive wires and signal wiring on a printed circuit board are generally considered to be mere connection lines, and it tends to be thought that voltage and current changes at the output and input ends of the wiring are simultaneous. However, when using switching elements with fast rise and fall times, for example, the waveform propagation delay time of a printed pattern can no longer be said to mean that the current and voltage in the circuit are changing simultaneously.

This is because the pattern forms a distributed constant circuit in which resistance, inductance, capacitance, etc. are distributed along the line, and the external component constants in the circuit diagram are not actually equivalent. ing.

Therefore, the straight line distance of the wiring from the lead in Figure 2 to the printed circuit board through the connected electronic components (a+b+c)
The total of (d+e+f) of the conventional example shown in FIG.
By shortening the number to about 173 or less, the above problem can be solved.

In addition, the grounding terminal 15.18 in Fig. 3 is also based on the same concept.
In terms of the structure of the socket shown in FIG. 2, it can be considered that a chip capacitor (such as a chip resistor) 7 is short-circuited with solder 8 to electrically connect the socket socket 5 and the copper plate 6. Further, the copper plate 6 in the above embodiment includes copper foil, a strip-shaped copper plate, and the like.

Effects of the Invention According to the above configuration of the present invention, the wiring distance from the lead of the semiconductor device under test to the mounting board of the device via the electronic components is very short compared to the distance to the copper plate, and the electrical characteristics are stabilized in the high frequency range. In addition, it is possible to perform measurements and inspections using sockets with regular lead sockets, making it easier to insert and remove devices from the socket, and the long life of the socket makes it easier to use sockets. Maintenance is easier due to the longer replacement cycle.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a semiconductor device measuring device according to an embodiment of the present invention, FIG. 2 is a sectional view of the measuring device, and FIG. 3 is a block diagram showing circuit functions of a semiconductor device under test.
4(a) and 4(b) are schematic side views showing leads of a semiconductor device to be measured, and FIGS. 5 and 6 are sectional views of a conventional measuring apparatus, respectively. 1...Socket, 2...Semiconductor device to be measured. 3... Printed circuit board, 4... Lead, 5... Socket part, 6... Copper plate, 7... Chip capacitor. Agent Yoshihiro Morimoto @ l Fig.O f, Soge Soto 2 Gap Measurement 111 Lead 1 Winter T'Vise 4-1 Lead 5 - Socket 651g 1 Extraction 7 Child Soft 0 Container Fig. 2/' 3-1-F0〉To early 4 and 3 Figure 4 (dn
(Fig. 5, Fig. 6)

Claims (1)

[Claims] 1. Attach a copper plate to the outer periphery of a socket for inserting leads of the semiconductor device under test, connect one electrode of the electronic component to the socket of the socket, and connect the other electrode of the electronic component to the copper plate, and a semiconductor device measuring device in which the copper plate is connected to a connection terminal of a socket mounting board.