JPH0336061Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a socket used for testing semiconductor devices such as LSIs.

[Conventional examples and problems that the invention attempts to solve]

When testing semiconductor devices such as LSIs, a socket is soldered in advance to the printed circuit board of the test equipment, and the external terminal of the semiconductor device to be tested is inserted into the socket.

In that case, for example, in the case of TTL, a first power supply with a high potential, a second power supply with a low potential (ground potential), and a plurality of signals are supplied to the semiconductor element in the package via external terminals, but the socket When mounting via
There were problems in that it was not possible to evaluate the original characteristics of the LSI, and it also caused malfunctions of the LSI itself.

This is thought to be caused by the parasitic inductance of the pin, since the ground potential is supplied through the pin of the socket.

[Means for solving problems]

This invention aims to solve the above problems,
The socket body is made of a conductive material and has a plurality of pin insertion holes, and the socket body is made of a conductive material and has a receiving hole into which the signal and first power supply external terminals of the semiconductor device are inserted. It has a plurality of first socket pins whose periphery is covered with an insulating layer, and a socket made of a conductive material into which a second power supply external terminal of the semiconductor device is inserted, and the conductive material is exposed. and a second socket pin for a second power supply, the first socket pin is insulated from the socket body and inserted into the pin insertion hole, and the second socket pin is inserted into the pin insertion hole. A socket for a semiconductor device is characterized in that the socket is electrically connected to the socket body and inserted into the pin insertion hole.

[Embodiment] Fig. 1 is a sectional view of a main part showing an embodiment of the present invention, Fig. 2 is a perspective view of the socket body, and Fig. 3 is a perspective view of the first and second socket pins. It is.

In this embodiment, the socket body 1 is made of a conductive material made of metal, whereas it is conventionally made of an insulating material. The socket body 1 is provided with a plurality of pin insertion holes 2. The socket pin inserted into this hole 2 is made of a conductive material made of metal, as shown in FIG.
There is a pin 7, and a first pin 5, which is made of metal and whose side surface is covered with an insulating layer 4, as shown in FIG. The first pin 5 has a receiving hole 3 for receiving general LSI signals and external terminals for high potential (first power supply), and the second pin 7 has a receiving hole 3 for receiving external terminals for general signals of the LSI and high potential (first power supply). It has a hole 6 for receiving an external terminal.

These first and second pins 5, 7 are tested
According to the external terminal arrangement of the LSI, the socket is inserted into the hole 2 of the present case 1 and mounted as a socket on a printed circuit board of a test device or the like. Then, the external terminals of the LSI are inserted into the receiving holes 3 and 6 of each pin of the socket, and the LSI is mounted on the test equipment.

As a result, the ground potential to the LSI to be tested is supplied by the metal mass of the socket body 1 in addition to the conventional grounding pin, making it less susceptible to noise and more stable. Also, since each pin is shielded, crosstalk can be prevented.

The pins 5 and 7 for the socket are fixed in the hole 2 of the socket body 1 by having a shape such as a screw groove or a wedge.

In addition, if you want to ground at a different location from the external grounding terminal of the LSI due to restrictions on the printed board, or if you want to increase the number of grounding pins on the printed board, use the unused holes in the socket body 1. This can be easily achieved by setting up another grounding pin.

Furthermore, if you want to insert a capacitor between the first power supply and the ground potential, you can install an additional grounding pin near the first power supply pin and provide a capacitor between them, or you can connect the capacitor directly to the socket body. By doing so, the power supply noise absorption effect can also be improved.

[Conventional effect]

As detailed above, according to the present invention, the ground potential can be stably supplied.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a main part showing an embodiment of the present invention, FIG. 2 is a perspective view of the socket body, and FIG. 3 is a perspective view of the first and second socket pins. In the figure, 1 is the socket body, 2 is a hole, 3 and 6 are receiving holes, 4 is an insulating layer, 5 and 7 are first and second socket pins, 8 is a semiconductor device, and 9 and 10 are external terminals. be.

Claims (1)

[Scope of utility model registration request] The socket body is made of a conductive material and has a plurality of pin insertion holes, and the socket body is made of a conductive material and has a receiving hole into which the signal and first power supply external terminals of the semiconductor device are inserted, and is surrounded by an insulating layer. a second power supply having a plurality of first socket pins covered with a conductive material and a receiving hole into which a second power supply external terminal of a semiconductor device is inserted made of a conductive material and exposing the conductive material; The first socket pin is insulated from the socket body and inserted into the pin insertion hole, and the second socket pin is insulated from the socket body. A socket for a semiconductor device, characterized in that the socket is electrically conductive and inserted into the pin insertion hole.