JPH0481313B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a socket for an integrated circuit, and more particularly to a socket for an integrated circuit in which a ground layer is formed inside the socket.

[Prior Art] A conventional integrated circuit socket will be described with reference to FIG. The integrated circuit socket shown in FIG. 2 includes a first insulating plate 15 provided on a printed wiring board 11 and serving as an insertion portion for a socket pin, and a socket pin 6 that electrically connects pins 9 and 10 of an integrated circuit 8. 7, and a second insulating plate 5 forming insertion portions 5a for the pins 9 and 10 and fixing the socket pins 6 and 7 to the first insulating plate 15.

With the above structure, the pins 9 and 10 of the integrated circuit 8 are pushed into the socket pins 6 and 7 through the second insulating plate 5, and the pins 9 and 10 are electrically connected by the elasticity of the socket pins 6 and 7. It is.

[Problems to be Solved] Since the conventional integrated circuit socket described above does not have a ground layer inside the socket, the connection between the ground pin 6 of the socket and the ground of the printed wiring board 11 is through the through hole 11a of the printed wiring board 11.
This is done by soldering. Therefore, from the ground of the integrated circuit 8 to the printed wiring board 1
Since the distance to the ground of 1 is long, the ground noise due to the inductance component of the pin is large, and the crosstalk due to mutual coupling between the pins is large. Another disadvantage is that reflection noise is large due to the large impedance of the pin. This is particularly noticeable in sockets for large integrated circuits.

[Means for Solving Problems] The integrated circuit socket of the present invention which solves the above conventional problems includes a first insulating plate installed on a printed wiring board, and a printed wiring board installed on the first insulating plate. a grounding metal plate electrically connected to the ground of the integrated circuit; a spring-shaped socket pin electrically connected and fixed to a pin of the integrated circuit; and a grounding pin of the socket pins electrically connected to the grounding metal plate. a metal piece, an insulating piece that insulates pins other than the ground pin among the socket pins from the ground metal plate, and the ground metal plate, the metal piece, the insulating piece, and the socket pin are attached to the first insulating plate. Second fixing
and an insulating plate.

[Example] Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a longitudinal sectional view of a socket for an integrated circuit according to an embodiment of the present invention. The integrated circuit socket of this embodiment includes a first insulating plate 1, a grounding metal plate 2, a metal piece 3, an insulating piece 4, and a second insulating plate 5.
and socket pins 6 and 7.

The first insulating board 1 has insertion portions 1a for socket pins 6 and 7, and the insertion portions 1a are inserted into the printed wiring board 1.
It is installed on the printed wiring board 11 so as to be located corresponding to the through hole 11a of No. 1. The ground metal plate 2 is placed on the first insulating plate 1, and one end thereof is electrically connected to the ground 12 on the printed wiring board 11 as shown. This ground metal plate 2 is provided to form a ground layer inside the socket. metal piece 3
Of the socket pins 6 and 7 installed in the insertion portion 1a of the first insulating plate 1, the socket pin 6 serving as a ground pin and the grounding metal plate 2 are located in contact with each other as shown in the figure, and as a result, the metal piece 3 The socket pin 6 and the ground 12 are electrically connected via the ground metal plate 2.

As shown in the figure, the insulating piece 4 is interposed between the socket pin 7 other than the ground pin and the grounding metal plate 2, and electrically insulates the socket pin 7 from the grounding metal plate 2. The socket pins 6 and 7 are
Each has spring properties for connection to the ground pin 9 and pins 10 other than the ground pin of the integrated circuit 8, and one end thereof is fixed to the printed wiring board 11 by soldering via a through hole 11a.

The second insulating plate 5 holds and fixes the grounding metal plate 2, the metal piece 3, the insulating piece 4, and the socket pins 6, 7 to the first insulating plate 1. The second insulating plate 5 also includes an integrated circuit 8.
An insertion portion 5a is formed for passing the pins 9, 10 into the socket pins 6, 7.

As described above, in the integrated circuit socket of this embodiment, the grounding metal plate 2 is installed inside the socket.
Since the ground layer is formed by the above method, the ground can be strengthened. Further, by setting the distance between the socket pin and the ground metal plate 2 to an appropriate value, the impedance of the printed wiring board 11 and the impedance of the socket pin can be matched.

[Effects of the Invention] As explained above, the present invention provides a ground metal plate inside the integrated circuit socket, connects it to the ground of the printed wiring board to form a ground layer inside the integrated circuit socket, and connects the pins to the pins. By ensuring that there is a ground between them, the ground is strengthened and ground noise and crosstalk can be reduced. In addition, by setting the distance between the pin and the grounding metal plate to an appropriate value,
By matching the impedance of the printed wiring board and the impedance of the pins, reflected noise can be reduced.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view of a socket for an integrated circuit according to an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view of a conventional socket for an integrated circuit. 1...First insulating plate, 2...Grounding metal plate,
3... Metal piece, 4... Insulating piece, 5... Second insulating plate, 6, 7... Socket pin, 8... Integrated circuit,
9, 10... integrated circuit pin, 11... printed wiring board, 12... ground.

Claims (1)

[Claims] 1. A first insulating plate installed on a printed wiring board, a grounding metal plate installed on the first insulating plate and electrically connected to the ground of the printed wiring board, and electrically connected to a pin of an integrated circuit. A spring-shaped socket pin to be fixed, a metal piece that electrically connects the ground pin of the socket pins to the ground metal plate, and insulates the socket pins other than the ground pin from the ground metal plate. A socket for an integrated circuit, comprising an insulating piece, and a second insulating plate for fixing the grounding metal plate, the metal piece, the insulating piece, and the socket pin to the first insulating plate.