JPS632274A - Socket for integrated circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a socket for an integrated circuit, and more particularly to a socket for an integrated circuit in which a ground layer is formed inside the socket.

[Prior Art] A conventional integrated circuit socket will be described with reference to FIG. The integrated circuit socket shown in FIG. 2 includes a first insulating plate 15 provided on a printed wiring board 11 that serves as an insertion portion for a socket pin, and a socket pin that electrically connects pins 9 and 10 of an integrated circuit 8. 6.7, and a second insulating plate 5 which forms an insertion portion 5a for the pins 9 and 10 and fixes the socket pin 6.7 to the first insulating plate 15.

With the above structure, the pin 9.10 of the integrated circuit 8 is pushed into the socket pin 6.7 through the second insulating plate 5,
The elasticity of the socket pin 6.7 electrically connects the pin 9.10.

[Problems to be Solved] Since the conventional integrated circuit socket described above does not have a ground layer inside the socket, the connection between the ground pin 6 of the socket and the ground of the printed wiring board 11 is through the through hole 11a of the printed wiring board 11. This is done by soldering. Therefore, since the distance from the ground of integrated circuit 8 to the ground of printed wiring board 11 is long, ground noise due to inductance components of the pins is large, and crosstalk due to mutual coupling between pins is large. Another disadvantage is that reflection noise is large due to the large impedance of the pin. This is particularly noticeable in sockets for large integrated circuits.

[Means for Solving the Problems] The integrated circuit socket of the present invention which solves the above conventional problems includes a first insulating plate installed on a printed wiring board, and a printed wiring board installed on the first insulating plate. a grounding metal plate electrically connected to the ground of the integrated circuit, a spring-shaped socket pin electrically connected and fixed to a pin of the integrated circuit, and a grounding bin of the socket pin electrically connected to the grounding metal plate. an insulating piece that insulates the socket pins other than the ground bin from the ground metal plate; and the first M! , and a second insulating plate for fixing the grounding metal plate, the metal piece, the insulating piece, and the socket pin to the edge plate.

[Example] Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a longitudinal sectional view of an integrated circuit socket according to an embodiment of the present invention. The integrated circuit socket of this example includes a first insulating plate l, a grounding metal plate 2, and a metal piece 3.
, the insulating piece 4, the second insulating plate 5, and the socket pin 6.7
It is composed of

The first insulating board 1 has an insertion part 1a for the socket pin 6.7, and is installed on the printed wiring board 11 so that the insertion part 1a is located corresponding to the through hole lla of the printed wiring board 11. . The ground metal plate 2 is placed on the first insulating plate 1, and its negative end is electrically connected to the ground 12 on the printed wiring board 11 as shown.

This ground metal plate 2 is provided to form a ground layer inside the socket. The metal piece 3 is a socket pin 6.7 mounted in the insertion portion la of the first insulating plate 1.
Of these, the socket pin 6 which becomes the ground pin and the ground metal plate 2 are located in contact with each other as shown in the figure, and as a result, the socket pin 6 and the ground 12 are electrically connected via the metal piece 3 and the ground metal plate 2. Connected.

As shown in the figure, the insulating piece 4 is interposed 2E between the socket pin 7 other than the ground pin and the grounding metal plate 2, and electrically insulates the socket pin 7 from the grounding metal plate 2.

The socket pins 6.7 have spring properties for connecting with the ground pin 9 of the integrated circuit 8 and the pins 10 other than the ground bin, respectively, and their negative ends are connected to the printed wiring board 11 through the through holes lla. It is fixed by soldering.

The second insulating plate 5 includes the grounding metal plates 2 and 114.
The metal piece 3, the insulating piece 4, and the socket pin 6.7 are held and fixed to the first insulating plate 1. Further, the second insulating plate 5 is formed with an insertion portion 5a through which the pins 9 and 10 of the integrated circuit 8 are passed through the socket pins 6.7.

As described above, in the integrated circuit socket of this embodiment, the ground layer is formed inside the socket by the ground metal plate 2, so that the ground is strengthened. Further, by setting the distance between the socket pin and the ground metal plate 2 to an appropriate value, the impedance of the printed wiring board 11 and the impedance of the socket pin can be matched.

[Effects of the Invention] As explained above, the present invention provides a grounding metal plate inside the integrated circuit socket, connects it to the ground of the printed wiring board to form a ground layer inside the integrated circuit socket, and connects the pin to the pin. By ensuring that there is a ground between them, the ground is strengthened and ground noise and crosstalk can be reduced. In addition, by setting the distance between the pin and the grounding metal plate to an appropriate value,
By matching the impedance of the printed wiring board and the impedance of the pins, reflected noise can be reduced.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view of a socket for an integrated circuit according to an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view of a conventional socket for an integrated circuit. 1: First insulating plate 2 Metal plate for nigerant 3: Metal piece 4: Insulating piece 5: Second insulating plate 6.7: Socket pin 8: Integrated circuit 9.10: Integrated circuit bin 11 Niblint wiring board 12 nigerant

Claims (1)

[Claims] a first insulating board installed on a printed wiring board;
A ground metal plate installed on an insulating board and electrically connected to the ground of the printed wiring board, a spring-shaped socket pin that is electrically connected and fixed to a pin of an integrated circuit, and a ground pin of the socket pin that is connected to the ground of the printed wiring board. a metal piece that electrically connects to the ground metal plate; an insulating piece that insulates pins other than the ground pin among the socket pins from the ground metal plate; and a ground metal plate and the first insulating plate. A socket for an integrated circuit, comprising the metal piece, the insulating piece, and a second insulating plate for fixing the socket pin.