JPH0574644B2 - - Google Patents
Info
- Publication number
- JPH0574644B2 JPH0574644B2 JP61285717A JP28571786A JPH0574644B2 JP H0574644 B2 JPH0574644 B2 JP H0574644B2 JP 61285717 A JP61285717 A JP 61285717A JP 28571786 A JP28571786 A JP 28571786A JP H0574644 B2 JPH0574644 B2 JP H0574644B2
- Authority
- JP
- Japan
- Prior art keywords
- ground
- soil
- improved soil
- solidification material
- excavate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Consolidation Of Soil By Introduction Of Solidifying Substances Into Soil (AREA)
- Investigation Of Foundation Soil And Reinforcement Of Foundation Soil By Compacting Or Drainage (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28571786A JPS63138014A (ja) | 1986-11-29 | 1986-11-29 | 建築用地盤改良工法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28571786A JPS63138014A (ja) | 1986-11-29 | 1986-11-29 | 建築用地盤改良工法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63138014A JPS63138014A (ja) | 1988-06-10 |
JPH0574644B2 true JPH0574644B2 (enrdf_load_stackoverflow) | 1993-10-18 |
Family
ID=17695113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28571786A Granted JPS63138014A (ja) | 1986-11-29 | 1986-11-29 | 建築用地盤改良工法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63138014A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9064639B2 (en) | 2013-04-26 | 2015-06-23 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component and board for mounting the same |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2437960B (en) | 2006-05-08 | 2008-08-13 | Aqs Holdings Ltd | Ground engineering method |
CN104264655A (zh) * | 2014-10-16 | 2015-01-07 | 中化岩土工程股份有限公司 | 预成孔深层水下夯实法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5814896B2 (ja) * | 1978-01-14 | 1983-03-23 | 積水ハウス株式会社 | 建物用地盤表土改良工法 |
-
1986
- 1986-11-29 JP JP28571786A patent/JPS63138014A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9064639B2 (en) | 2013-04-26 | 2015-06-23 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component and board for mounting the same |
Also Published As
Publication number | Publication date |
---|---|
JPS63138014A (ja) | 1988-06-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |