JPH0573260B2 - - Google Patents

Info

Publication number
JPH0573260B2
JPH0573260B2 JP62091408A JP9140887A JPH0573260B2 JP H0573260 B2 JPH0573260 B2 JP H0573260B2 JP 62091408 A JP62091408 A JP 62091408A JP 9140887 A JP9140887 A JP 9140887A JP H0573260 B2 JPH0573260 B2 JP H0573260B2
Authority
JP
Japan
Prior art keywords
layer
substrate
wiring layer
aluminum
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62091408A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63257247A (ja
Inventor
Daishoku Shin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP9140887A priority Critical patent/JPS63257247A/ja
Publication of JPS63257247A publication Critical patent/JPS63257247A/ja
Publication of JPH0573260B2 publication Critical patent/JPH0573260B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP9140887A 1987-04-14 1987-04-14 半導体装置の製造方法 Granted JPS63257247A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9140887A JPS63257247A (ja) 1987-04-14 1987-04-14 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9140887A JPS63257247A (ja) 1987-04-14 1987-04-14 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS63257247A JPS63257247A (ja) 1988-10-25
JPH0573260B2 true JPH0573260B2 (US07223432-20070529-C00017.png) 1993-10-14

Family

ID=14025553

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9140887A Granted JPS63257247A (ja) 1987-04-14 1987-04-14 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS63257247A (US07223432-20070529-C00017.png)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5192183A (US07223432-20070529-C00017.png) * 1975-02-10 1976-08-12
JPS57176747A (en) * 1981-04-23 1982-10-30 Fujitsu Ltd Manufacture of semiconductor device
JPS58197748A (ja) * 1982-05-13 1983-11-17 Nec Corp 半導体装置の製造方法
JPS604240A (ja) * 1983-06-22 1985-01-10 Nec Corp 半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5192183A (US07223432-20070529-C00017.png) * 1975-02-10 1976-08-12
JPS57176747A (en) * 1981-04-23 1982-10-30 Fujitsu Ltd Manufacture of semiconductor device
JPS58197748A (ja) * 1982-05-13 1983-11-17 Nec Corp 半導体装置の製造方法
JPS604240A (ja) * 1983-06-22 1985-01-10 Nec Corp 半導体装置

Also Published As

Publication number Publication date
JPS63257247A (ja) 1988-10-25

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