JPH0573157B2 - - Google Patents

Info

Publication number
JPH0573157B2
JPH0573157B2 JP13266287A JP13266287A JPH0573157B2 JP H0573157 B2 JPH0573157 B2 JP H0573157B2 JP 13266287 A JP13266287 A JP 13266287A JP 13266287 A JP13266287 A JP 13266287A JP H0573157 B2 JPH0573157 B2 JP H0573157B2
Authority
JP
Japan
Prior art keywords
resin
weight
parts
adhesive
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP13266287A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63297483A (ja
Inventor
Kichiji Eikuchi
Hitoshi Arai
Saneteru Sakaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP13266287A priority Critical patent/JPS63297483A/ja
Publication of JPS63297483A publication Critical patent/JPS63297483A/ja
Publication of JPH0573157B2 publication Critical patent/JPH0573157B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP13266287A 1987-05-28 1987-05-28 フレキシブル印刷回路基板用接着剤組成物 Granted JPS63297483A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13266287A JPS63297483A (ja) 1987-05-28 1987-05-28 フレキシブル印刷回路基板用接着剤組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13266287A JPS63297483A (ja) 1987-05-28 1987-05-28 フレキシブル印刷回路基板用接着剤組成物

Publications (2)

Publication Number Publication Date
JPS63297483A JPS63297483A (ja) 1988-12-05
JPH0573157B2 true JPH0573157B2 (enrdf_load_html_response) 1993-10-13

Family

ID=15086562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13266287A Granted JPS63297483A (ja) 1987-05-28 1987-05-28 フレキシブル印刷回路基板用接着剤組成物

Country Status (1)

Country Link
JP (1) JPS63297483A (enrdf_load_html_response)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02199706A (ja) * 1989-01-27 1990-08-08 Toshiba Chem Corp 導電性ペースト
DE3936488C2 (de) * 1989-11-02 1996-04-04 Beck & Co Ag Dr Verfahren zur Herstellung von flexiblen Basismaterialien, nach diesem Verfahren hergestellte Basismaterialen und deren Verwendung
JP3849789B2 (ja) * 2003-10-20 2006-11-22 東洋紡績株式会社 積層体
JP5586362B2 (ja) * 2010-07-28 2014-09-10 Ｄｉｃグラフィックス株式会社 樹脂組成物

Also Published As

Publication number Publication date
JPS63297483A (ja) 1988-12-05

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees