JPH0572096B2 - - Google Patents
Info
- Publication number
- JPH0572096B2 JPH0572096B2 JP58147015A JP14701583A JPH0572096B2 JP H0572096 B2 JPH0572096 B2 JP H0572096B2 JP 58147015 A JP58147015 A JP 58147015A JP 14701583 A JP14701583 A JP 14701583A JP H0572096 B2 JPH0572096 B2 JP H0572096B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- wafer
- temperature
- lamp
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14701583A JPS6037717A (ja) | 1983-08-10 | 1983-08-10 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14701583A JPS6037717A (ja) | 1983-08-10 | 1983-08-10 | 半導体装置の製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26628392A Division JPH05251377A (ja) | 1992-10-05 | 1992-10-05 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6037717A JPS6037717A (ja) | 1985-02-27 |
JPH0572096B2 true JPH0572096B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-10-08 |
Family
ID=15420610
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14701583A Granted JPS6037717A (ja) | 1983-08-10 | 1983-08-10 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6037717A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6173324A (ja) * | 1984-09-17 | 1986-04-15 | Dainippon Screen Mfg Co Ltd | 熱処理装置 |
JPH07105345B2 (ja) * | 1985-08-08 | 1995-11-13 | 日電アネルバ株式会社 | 基体処理装置 |
JPS62128525A (ja) * | 1985-11-29 | 1987-06-10 | Matsushita Electric Ind Co Ltd | 化合物半導体基板のアニ−ル方法 |
JP2001297995A (ja) * | 2000-04-13 | 2001-10-26 | Nec Corp | 回路製造方法および装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5872837U (ja) * | 1981-11-10 | 1983-05-17 | 株式会社日立国際電気 | 減圧気相成長装置 |
-
1983
- 1983-08-10 JP JP14701583A patent/JPS6037717A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6037717A (ja) | 1985-02-27 |