JPH0569164B2 - - Google Patents

Info

Publication number
JPH0569164B2
JPH0569164B2 JP59280506A JP28050684A JPH0569164B2 JP H0569164 B2 JPH0569164 B2 JP H0569164B2 JP 59280506 A JP59280506 A JP 59280506A JP 28050684 A JP28050684 A JP 28050684A JP H0569164 B2 JPH0569164 B2 JP H0569164B2
Authority
JP
Japan
Prior art keywords
receiving element
light
light receiving
tracking
cylindrical object
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59280506A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61149816A (ja
Inventor
Mitsuhito Kamei
Mikio Tachibana
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Nippon Steel Corp
Original Assignee
Mitsubishi Electric Corp
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp, Sumitomo Metal Industries Ltd filed Critical Mitsubishi Electric Corp
Priority to JP28050684A priority Critical patent/JPS61149816A/ja
Publication of JPS61149816A publication Critical patent/JPS61149816A/ja
Publication of JPH0569164B2 publication Critical patent/JPH0569164B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP28050684A 1984-12-24 1984-12-24 振動する物体の表面検査装置 Granted JPS61149816A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28050684A JPS61149816A (ja) 1984-12-24 1984-12-24 振動する物体の表面検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28050684A JPS61149816A (ja) 1984-12-24 1984-12-24 振動する物体の表面検査装置

Publications (2)

Publication Number Publication Date
JPS61149816A JPS61149816A (ja) 1986-07-08
JPH0569164B2 true JPH0569164B2 (enExample) 1993-09-30

Family

ID=17626039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28050684A Granted JPS61149816A (ja) 1984-12-24 1984-12-24 振動する物体の表面検査装置

Country Status (1)

Country Link
JP (1) JPS61149816A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7094618B2 (en) 2000-08-25 2006-08-22 Micron Technology, Inc. Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape
US7169685B2 (en) 2002-02-25 2007-01-30 Micron Technology, Inc. Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive
US7361862B2 (en) 1998-12-21 2008-04-22 Micron Technology, Inc. Laser marking system for dice carried in trays and method of operation

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834011B2 (ja) * 1976-03-17 1983-07-23 日本ビクター株式会社 無接触式ピツクアツプ
JPS5932804A (ja) * 1982-08-18 1984-02-22 Chino Works Ltd 長さ測定装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7361862B2 (en) 1998-12-21 2008-04-22 Micron Technology, Inc. Laser marking system for dice carried in trays and method of operation
US7094618B2 (en) 2000-08-25 2006-08-22 Micron Technology, Inc. Methods for marking a packaged semiconductor die including applying tape and subsequently marking the tape
US7238543B2 (en) 2000-08-25 2007-07-03 Micron Technology, Inc. Methods for marking a bare semiconductor die including applying a tape having energy-markable properties
US7169685B2 (en) 2002-02-25 2007-01-30 Micron Technology, Inc. Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive

Also Published As

Publication number Publication date
JPS61149816A (ja) 1986-07-08

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