JPH0568101B2 - - Google Patents

Info

Publication number
JPH0568101B2
JPH0568101B2 JP63066903A JP6690388A JPH0568101B2 JP H0568101 B2 JPH0568101 B2 JP H0568101B2 JP 63066903 A JP63066903 A JP 63066903A JP 6690388 A JP6690388 A JP 6690388A JP H0568101 B2 JPH0568101 B2 JP H0568101B2
Authority
JP
Japan
Prior art keywords
wire
bonding position
capillary
bonding
crimped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP63066903A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01239861A (ja
Inventor
Masajiro Takasaki
Masami Nakano
Takashi Endo
Takashi Yamanaka
Yoshihiro Usui
Takasane Urasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Mitsubishi Electric Corp
Original Assignee
Shinkawa Ltd
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Mitsubishi Electric Corp filed Critical Shinkawa Ltd
Priority to JP63066903A priority Critical patent/JPH01239861A/ja
Publication of JPH01239861A publication Critical patent/JPH01239861A/ja
Publication of JPH0568101B2 publication Critical patent/JPH0568101B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50
    • H10W72/01551
    • H10W72/0711
    • H10W72/07141
    • H10W72/075
    • H10W72/07521
    • H10W72/07551
    • H10W72/5363

Landscapes

  • Wire Bonding (AREA)
JP63066903A 1988-03-18 1988-03-18 ワイヤボンデイング方法 Granted JPH01239861A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63066903A JPH01239861A (ja) 1988-03-18 1988-03-18 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63066903A JPH01239861A (ja) 1988-03-18 1988-03-18 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPH01239861A JPH01239861A (ja) 1989-09-25
JPH0568101B2 true JPH0568101B2 (cg-RX-API-DMAC10.html) 1993-09-28

Family

ID=13329368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63066903A Granted JPH01239861A (ja) 1988-03-18 1988-03-18 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPH01239861A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19823623A1 (de) 1998-05-27 1999-12-02 Bosch Gmbh Robert Verfahren und Kontaktstelle zur Herstellung einer elektrischen Verbindung
KR100674781B1 (ko) * 2002-06-10 2007-01-25 레온 지도키 가부시키가이샤 띠형상 푸드 생지의 비팅 및 압연 장치 및 방법

Also Published As

Publication number Publication date
JPH01239861A (ja) 1989-09-25

Similar Documents

Publication Publication Date Title
JPH10135221A (ja) バンプ形成方法
JP3128718B2 (ja) ワイヤボンデイング方法
JPH0568101B2 (cg-RX-API-DMAC10.html)
JP2727352B2 (ja) リード付き半導体素子の製造方法
JPH03289149A (ja) ワイヤボンディング方法
JPH04255237A (ja) 半導体装置の製造方法
JPS62219533A (ja) ボンデイング装置
JP2788885B2 (ja) 半導体装置用リードフレームおよび半導体装置
JPS60182730A (ja) ワイヤボンデイング方法
JPH0195528A (ja) ワイヤボンデイング方法および装置
US6906263B2 (en) Crossing-wire fixing structure
JP3289579B2 (ja) 金属接合方法
JPH0797521B2 (ja) 摺動接点およびその製造方法
JPS6254500A (ja) ワイヤ接続方法
JPH08222595A (ja) ワイヤーボンディング方法
JPS58180035A (ja) ボンデイング装置
JP2002171020A (ja) 半導体レーザ装置およびそのワイヤボンディング法
JP2003007758A (ja) 半導体装置用ボンディングワイヤの接合方法
JPH01248655A (ja) 半導体装置用リードフレームの製造方法
JPH11168119A (ja) ワイヤボンディング方法とそれに用いる押圧ツール
JPS5853502B2 (ja) 金属細線の接続方法
JPS62115730A (ja) ワイヤボンデイング方法
JPH01297834A (ja) ワイヤボンデイング方法
JPH10189640A (ja) 半導体装置及びその製造方法
JPH02270272A (ja) 電線圧着方法

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees