JPH0567057B2 - - Google Patents
Info
- Publication number
- JPH0567057B2 JPH0567057B2 JP62009578A JP957887A JPH0567057B2 JP H0567057 B2 JPH0567057 B2 JP H0567057B2 JP 62009578 A JP62009578 A JP 62009578A JP 957887 A JP957887 A JP 957887A JP H0567057 B2 JPH0567057 B2 JP H0567057B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- pressure
- discharge
- resin container
- integral value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
-
- H10W95/00—
-
- H10W72/013—
-
- H10W72/071—
-
- H10W72/30—
-
- H10W72/0113—
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- H10W72/073—
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- H10W72/07338—
Landscapes
- Die Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Coating Apparatus (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62009578A JPS63177530A (ja) | 1987-01-19 | 1987-01-19 | ダイボンデイング方法とその装置 |
| KR1019880000342A KR910002827B1 (ko) | 1987-01-19 | 1988-01-18 | 반도체칩의 다이본딩방법과 그 장치 |
| US07/145,320 US4874444A (en) | 1987-01-19 | 1988-01-19 | Die-bonding method and apparatus therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62009578A JPS63177530A (ja) | 1987-01-19 | 1987-01-19 | ダイボンデイング方法とその装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6211438A Division JP2716940B2 (ja) | 1994-09-05 | 1994-09-05 | ダイボンディング方法とその装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63177530A JPS63177530A (ja) | 1988-07-21 |
| JPH0567057B2 true JPH0567057B2 (cg-RX-API-DMAC10.html) | 1993-09-24 |
Family
ID=11724194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62009578A Granted JPS63177530A (ja) | 1987-01-19 | 1987-01-19 | ダイボンデイング方法とその装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4874444A (cg-RX-API-DMAC10.html) |
| JP (1) | JPS63177530A (cg-RX-API-DMAC10.html) |
| KR (1) | KR910002827B1 (cg-RX-API-DMAC10.html) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5074443A (en) * | 1989-12-20 | 1991-12-24 | Nordson Corporation | Adaptor for liquid dispensing syringe |
| JPH03290715A (ja) * | 1990-04-07 | 1991-12-20 | Iwashita Eng Kk | 圧力センサを有する定量吐出装置の圧力変更型吐出量安定ディスペンス制御装置 |
| KR940009257B1 (ko) * | 1990-07-10 | 1994-10-06 | 무사시엔지니어링 가부시기가이샤 | 액체 정량 토출장치 |
| US5423889A (en) * | 1994-06-24 | 1995-06-13 | Harris Corporation | Process for manufacturing a multi-port adhesive dispensing tool |
| JP2716940B2 (ja) * | 1994-09-05 | 1998-02-18 | 株式会社東芝 | ダイボンディング方法とその装置 |
| JP3498877B2 (ja) | 1995-12-05 | 2004-02-23 | 株式会社東芝 | 半導体製造装置および半導体装置の製造方法 |
| US5772814A (en) * | 1996-01-26 | 1998-06-30 | Branson Ultrasonic Corporation | Welding system and method of setting welding machine parameters |
| JP2804951B2 (ja) * | 1996-02-23 | 1998-09-30 | 九州日本電気株式会社 | 精密定量吐出方法および吐出装置 |
| US6399425B1 (en) | 1998-09-02 | 2002-06-04 | Micron Technology, Inc. | Method of encapsulating semiconductor devices utilizing a dispensing apparatus with rotating orifices |
| US20020189541A1 (en) * | 2001-06-14 | 2002-12-19 | Lily Chao | Glue dropping machine |
| US6857543B2 (en) * | 2001-12-01 | 2005-02-22 | Shipley Company, L.L.C. | Low volume dispense unit and method of using |
| TWI286086B (en) * | 2005-04-11 | 2007-09-01 | Unaxis Int Trading Ltd | Method for operating a pneumatic device for the metered delivery of a liquid and pneumatic device |
| JP4749141B2 (ja) * | 2005-12-07 | 2011-08-17 | トリニティ工業株式会社 | 塗装システム |
| US20090317544A1 (en) * | 2008-05-15 | 2009-12-24 | Zao "Intermetcomposit" | Method and Device for Gasodynamically Marking a Surface with a Mark |
| US8464902B2 (en) * | 2009-01-09 | 2013-06-18 | Nordson Corporation | Apparatus and method for pulsed dispensing of liquid |
| US20120040477A1 (en) * | 2010-08-13 | 2012-02-16 | Frank Yu | Ai epoxy adjustment |
| JP5853164B2 (ja) * | 2012-04-24 | 2016-02-09 | パナソニックIpマネジメント株式会社 | 液体供給装置、液体吐出装置及び液体供給方法 |
| WO2020258815A1 (zh) * | 2019-06-25 | 2020-12-30 | 常州铭赛机器人科技股份有限公司 | 点胶控制设备及其出胶控制方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3347418A (en) * | 1965-10-23 | 1967-10-17 | Polaroid Corp | Liquid dispenser utilizing controlled gas pressure |
| US3499580A (en) * | 1968-07-02 | 1970-03-10 | Frank B Smith | Pressure pour apparatus and component thereof |
| US3666143A (en) * | 1970-06-22 | 1972-05-30 | Murray Weston | Automatic fluid dispensing apparatus with manual override |
| US4164001A (en) * | 1978-04-04 | 1979-08-07 | Patnaude Edmond J | Speed compensating control system |
| JPS55119471A (en) * | 1979-03-09 | 1980-09-13 | Matsushita Electric Ind Co Ltd | Adhesive coating method |
| US4334636A (en) * | 1979-12-27 | 1982-06-15 | Paul William A | Apparatus for handling gasket-forming material |
| US4675301A (en) * | 1985-04-01 | 1987-06-23 | Eastman Kodak Company | Method for correcting for changes in air pressure above a liquid to be dispensed from a container mounted on a probe |
| JPS6397259A (ja) * | 1986-10-14 | 1988-04-27 | Shinkawa Ltd | ペ−スト吐出装置 |
-
1987
- 1987-01-19 JP JP62009578A patent/JPS63177530A/ja active Granted
-
1988
- 1988-01-18 KR KR1019880000342A patent/KR910002827B1/ko not_active Expired
- 1988-01-19 US US07/145,320 patent/US4874444A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR880009428A (ko) | 1988-09-15 |
| JPS63177530A (ja) | 1988-07-21 |
| KR910002827B1 (ko) | 1991-05-06 |
| US4874444A (en) | 1989-10-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |